{"title":"Novel optical viscosity sensor based on laser-induced capillary wave","authors":"A. Ebisui, Y. Taguchi, Y. Nagasaka","doi":"10.1117/12.759637","DOIUrl":"https://doi.org/10.1117/12.759637","url":null,"abstract":"In recent years, viscosity has been one of the most important thermophysical properties, and its new sensing applications in a noninvasive method with small sample volume are required in a broad field. For example, in the medical field, the viscosity of body fluid, such as blood, is an essential parameter for diagnosis. In the present study, we have developed a new miniaturized optical viscometer, namely MOVS (Micro Optical Viscosity Sensor), which is applicable to the noninvasive, high speed, small sample volume, in situ and in vivo measurement of a liquid sample in both medical and industrial fields based on laser-induced capillary wave (LiCW) technique. In our experimental setup, two excitation laser beams interfere on a liquid surface and generate the LiCW. By observing the behavior of the LiCW using a probing laser, which contains the surface information of the sample liquid, viscosity and surface tension can be obtained. In this paper, the fabrication of prototype MOVS chip using micro-electro mechanical systems (MEMS) technology for the first time and the discussion of the validity of the viscosity measurement are reported. Preliminary measurement using distilled water was demonstrated, and nanosecond order high speed damping oscillation was successfully observed.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128220282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fabrication approaches for metallo-dielectric plasmonic waveguides","authors":"M. Nezhad, S. Zamek, L. Pang, Y. Fainman","doi":"10.1117/12.768161","DOIUrl":"https://doi.org/10.1117/12.768161","url":null,"abstract":"Different techniques for fabricating long-range plasmonic metallo-dielectric waveguides are discussed. The approaches depend strongly on the material system in use. Specific results are presented for SU8 and PDMS.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115496124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Uncertainty analysis on optical testing with a Shack-Hartmann sensor and a point source","authors":"D. Kang, Jin Seok Lee, Ho-Soon Yang, J. Hahn","doi":"10.1117/12.762505","DOIUrl":"https://doi.org/10.1117/12.762505","url":null,"abstract":"In this study, we analyze the uncertainty in an optical testing system using a Shack-Hartmann sensor for a wavefront measurement device. The main uncertainty sources of the optical testing system are the Shack-Hartmann sensor, the image relay optics, and the pinhole source. Using a homemade high-precision plane-wave source as a reference, we develop a simple method to calibrate the optics of the system and the Shack-Hartmann sensor itself. It is found that the wavefront error of a pinhole source is negligible, and that the error due to the image relay optics installed between the test lens and the Shack-Hartmann sensor is 0.030 λ (RMS). By warming up the Shack-Hartmann sensor for about 1 hour, the measurement values are stabilized to within 0.001 λ (RMS). After calibrating the optical testing system with the reference source, overall uncertainty in the optical testing system is reduced to 0.009 λ (RMS). Performance of the optical testing system is evaluated by measuring the wavefront errors of various optical components, such as a numerical aperture (NA) 0.25 aspheric lens and a digital video disc (DVD) pick up lens.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115693837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Behnam, Jason L. Johnson, Yongho Choi, M. G. Ertosun, Zhuangchun Wu, A. Rinzler, P. Kapur, K. Saraswat, A. Ural
{"title":"Metal-semiconductor-metal (MSM) photodetectors based on single-walled carbon nanotube film-silicon Schottky contacts","authors":"A. Behnam, Jason L. Johnson, Yongho Choi, M. G. Ertosun, Zhuangchun Wu, A. Rinzler, P. Kapur, K. Saraswat, A. Ural","doi":"10.1117/12.761935","DOIUrl":"https://doi.org/10.1117/12.761935","url":null,"abstract":"We fabricate and experimentally characterize metal-semiconductor-metal (MSM) photodetectors with CNT film Schottky electrodes on n-type and p-type silicon substrates. We extract a Schottky barrier height of ~0.45 eV and ~0.51 eV for CNT films on n-type and p-type Si respectively. The extracted barrier height corresponds to a CNT film workfunction of 4.5-4.7 eV, which is within the range of the previously reported workfunction values for individual CNTs. Furthermore, we find that while at temperatures above 240°K thermionic emission is the dominant transport mechanism, at lower temperatures tunneling begins to dominate. We also characterize the photoresponse of the CNT film-Si MSM photodetector by illuminating the samples with a 633 nm HeNe laser. We observe that while the photocurrent of the CNT film MSM devices is similar to that of the Ti/Au control samples at high biases, their lower dark current results in a higher photo-to-dark current ratio relative to the control devices. We explain these observations by comparing the two interfaces. This work opens up the possibility of integrating CNT films as transparent and conductive Schottky electrodes in conventional semiconductor electronic and optoelectronic devices.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115763674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Adaptive optics calibration for a wide-field microscope","authors":"J. Castillo, T. Bifano","doi":"10.1117/12.769431","DOIUrl":"https://doi.org/10.1117/12.769431","url":null,"abstract":"Adaptive optics calibration of a novel wide-field scanning microscope is described, comparing relevant parameters for several optimization techniques. Specifically, comparisons of the optimization algorithm, image quality metrics, and the calibration image target are detailed. It is shown that stochastic parallel gradient descent (SPGD) algorithm using image intensity as a metric provides robust, repeatable system optimization. Results also show that optimization performance improves when the feature sizes on the calibration target approach the diffraction limit and are more uniformly distributed. This paper further compares stochastic, image-based optimization performance to that of conventional adaptive optics optimization with a point source object and a Shack Hartmann wavefront sensor.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126108812","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Q. L. Chen, H. Ho, L. Jin, B. W. Chu, M. Li, V. Yam
{"title":"Dissolved oxygen sensing using organometallic dyes deposited within a microfluidic environment","authors":"Q. L. Chen, H. Ho, L. Jin, B. W. Chu, M. Li, V. Yam","doi":"10.1117/12.762666","DOIUrl":"https://doi.org/10.1117/12.762666","url":null,"abstract":"This work primarily aims to integrate dissolved oxygen sensing capability with a microfluidic platform containing arrays of micro bio-reactors or bio-activity indicators. The measurement of oxygen concentration is of significance for a variety of bio-related applications such as cell culture and gene expression. Optical oxygen sensors based on luminescence quenching are gaining much interest in light of their low power consumption, quick response and high analyte sensitivity in comparison to similar oxygen sensing devices. In our microfluidic oxygen sensor device, a thin layer of oxygen-sensitive luminescent organometallic dye is covalently bonded to a glass slide. Micro flow channels are formed on the glass slide using patterned PDMS (Polydimethylsiloxane). Dissolved oxygen sensing is then performed by directing an optical excitation probe beam to the area of interest within the microfluidic channel. The covalent bonding approach for sensor layer formation offers many distinct advantages over the physical entrapment method including minimizing dye leaching, ensuring good stability and fabrication simplicity. Experimental results confirm the feasibility of the device.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"186 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122365372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. K. Luo, Y. Q. Fu, Q. Huang, J. Williams, W. Milne
{"title":"Degradation evaluation of microelectromechanical thermal actuators","authors":"J. K. Luo, Y. Q. Fu, Q. Huang, J. Williams, W. Milne","doi":"10.1117/12.760918","DOIUrl":"https://doi.org/10.1117/12.760918","url":null,"abstract":"Metal based thermal microactuators normally have lower operation temperatures than those of Si-based ones; hence they have great potential for applications. However, metal-based thermal actuators easily suffer from degradation such as plastic deformation. In this study, planar thermal actuators were made by a single mask process using electroplated nickel as the active material, and their thermal degradation has been studied. Electrical tests show that the Ni-based thermal actuators deliver a maximum displacement of ~20 m at an average temperature of ~420 °C, much lower than that of Si-based microactuators. However, the displacement strongly depends on the frequency and peak voltage of the pulse applied. Back bending was clearly observed at a maximum temperature as low as 240 °C. Both forward and backward displacements increase with increasing the temperature up to ~450 °C, and then decreases with power. Scanning electron microscopy observation clearly showed that Ni structure deforms and reflows at power above 50mW. The compressive stress is believed to be responsible for Ni piling-up (creep), while the tensile stress upon removing the pulse current is responsible for necking at the hottest section of the device. Energy dispersive X-ray diffraction analysis revealed severe oxidation of the Ni-structure induced by Joule-heating of the current.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116209040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Thermopower measurement of freestanding nanowires using a MEMS workbench","authors":"N. Duarte, S. Tadigadapa","doi":"10.1117/12.775801","DOIUrl":"https://doi.org/10.1117/12.775801","url":null,"abstract":"Nanowires of a diameter less than 50nm have been predicted to exhibit a higher thermoelectric figure of merit in comparison to their bulk equivalent. In order to experimentally measure the thermoelectric power in nanowires it is necessary to design and fabricate a measurement platform that is ideally matched in thermal and physical size and capable of testing a large number of individual nanowires in a high throughput manner. In this paper we present the design, fabrication, and characterization of a MEMS thermoelectric workbench with a high density of testing locations. Characteristic measurements of the thermoelectric power of Au nanowires are presented as demonstration of the workbench functionality.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116222915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"TCAD tool for innovative MEMS and MOEMS: an all-in-one solution","authors":"U. Triltsch, S. Büttgenbach","doi":"10.1117/12.773043","DOIUrl":"https://doi.org/10.1117/12.773043","url":null,"abstract":"In this paper we present a TCAD tool for MEMS, which combines process and layout design and provides links to behavioral modeling tools as well as to specialized modules for the optimized design of single components. There is a large amount of new fabrication technologies available which make the design of highly innovative MEMS and MOEMS possible. The design of such systems not only incorporates the layout of masks but also involves the composition of a flawless process chain. TCAD tools for MEMS available today do mostly not support the design of new fabrication processes together with behavioral simulation and layout design. Therefore, there is a need for a methodical approach to component-design, which leads an engineer from single components to a system ready for fabrication. Based on a conceptual model for the design process the latest version of the modular software environment BICEP3S (Braunschweigs Integrated CAD-Environment for Product Planning Process Simulation) is explained. The concept and data model of building blocks on component level, that act as knowledge containers for fabrication ready functional elements of microsystems, are shown in detail. As the detailed simulation of single process steps is crucial in fabrication oriented design cycles, we present an atomistic etch-simulator as one example for specialized simulation modules of our design environment.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125450762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Rimberg, W. Xue, Z. Ji, F. Pan, J. Stettenheim, T. Gilheart
{"title":"The quantum limit for electrical amplifiers: Can we reach it?","authors":"A. Rimberg, W. Xue, Z. Ji, F. Pan, J. Stettenheim, T. Gilheart","doi":"10.1117/12.778262","DOIUrl":"https://doi.org/10.1117/12.778262","url":null,"abstract":"Any scientific instrument, including an electrical amplifier, necessarily adds noise in the process of performing a measurement. As might be expected from knowledge of Heisenberg's uncertainty principle, quantum mechanics sets strict limits on how little noise a measurement can add. There is a great deal of current interest in performing measurements at the quantum limit on such systems as qubits and nanomechanical resonators. Here we introduce the notion of quantum limited electrical measurement, and discuss recent progress made toward this goal.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125596401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}