SPIE MOEMS-MEMS最新文献_第10页

Process development for waveguide chemical sensors with integrated polymeric sensitive layers 集成聚合物敏感层波导化学传感器的工艺开发

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.765237

Raghu Amberkar, Zhan Gao, Jongwon Park, D. Henthorn, Chang-Soo Kim

{"title":"Process development for waveguide chemical sensors with integrated polymeric sensitive layers","authors":"Raghu Amberkar, Zhan Gao, Jongwon Park, D. Henthorn, Chang-Soo Kim","doi":"10.1117/12.765237","DOIUrl":"https://doi.org/10.1117/12.765237","url":null,"abstract":"Due to the proper optical property and flexibility in the process development, an epoxy-based, high-aspect ratio photoresist SU-8 is now attracting attention in optical sensing applications. Manipulation of the surface properties of SU-8 waveguides is critical to attach functional films such as chemically-sensitive layers. We describe a new integration process to immobilize fluorescence molecules on SU-8 waveguide surface for application to intensity-based optical chemical sensors. We use two polymers for this application. Spin-on, hydrophobic, photopatternable silicone is a convenient material to contain fluorophore molecules and to pattern a photolithographically defined thin layer on the surface of SU-8. We use fumed silica powders as an additive to uniformly disperse the fluorophores in the silicone precursor. In general, additional processes are not critically required to promote the adhesion between the SU-8 and silicone. The other material is polyethylene glycol diacrylate (PEGDA). Recently we demonstrated a novel photografting method to modify the surface of SU-8 using a surface bound initiator to control its wettability. The activated surface is then coated with a monomer precursor solution. Polymerization follows when the sample is exposed to UV irradiation, resulting in a grafted PEGDA layer incorporating fluorophores within the hydrogel matrix. Since this method is based the UV-based photografting reaction, it is possible to grow off photolithographically defined hydrogel patterns on the waveguide structures. The resulting films will be viable integrated components in optical bioanalytical sensors. This is a promising technique for integrated chemical sensors both for planar type waveguide and vertical type waveguide chemical sensors.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"181 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115461233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Microtransfer molding of SU-8 micro-optics SU-8微光学的微传递成型

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.769694

A. Cannistra, P. Srinivasan, E. Johnson, T. Suleski

{"title":"Microtransfer molding of SU-8 micro-optics","authors":"A. Cannistra, P. Srinivasan, E. Johnson, T. Suleski","doi":"10.1117/12.769694","DOIUrl":"https://doi.org/10.1117/12.769694","url":null,"abstract":"SU-8 is a very promising polymer for micro-optics. It is mechanically robust with high thermal and chemical resistance, has high transmission at visible and near-infrared wavelengths, and has relatively high refractive index after curing. While lithographic patterning of SU-8 is relatively common, molding of SU-8 is more difficult due to challenges with solvent removal and cross linking. In this paper, we discuss techniques for micromolding of micro- and nano-optics in SU-8. Elastomeric mold templates are first cast from master structures fabricated using standard techniques. The elastomeric templates are then used in low pressure molding processes to produce high-fidelity refractive and diffractive micro-optics in SU-8. The use of the elastomeric replica mold enables realization of a wider variety of optical surfaces than can be achieved with conventional lithographic patterning in SU-8, and further enables conformal fabrication of SU-8 micro-optics on non-planar surfaces. Molding processes and experimental results for both thin (diffractive) and thick (refractive) elements are presented. Replication of SU-8 micro-optics on both planar and non-planar surfaces, and hybrid processes combining molding and lithographic exposure are demonstrated.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121190680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Grayscale homogenizers in calcium fluoride 氟化钙的灰度均质器

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.767531

Jeffrey Lawrence, Lamarr R. Simmons, A. Stockham, John G. Smith, G. Borek, M. Cumme, R. Kleindienst, P. Weissbrodt

引用次数: 2

3D MOEMS-based optical micro-bench platform for the miniaturization of sensing devices 面向传感器件小型化的三维moems光学微工作台平台

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.761339

S. García-Blanco, J. Caron, S. Leclair, P. Topart, H. Jerominek

{"title":"3D MOEMS-based optical micro-bench platform for the miniaturization of sensing devices","authors":"S. García-Blanco, J. Caron, S. Leclair, P. Topart, H. Jerominek","doi":"10.1117/12.761339","DOIUrl":"https://doi.org/10.1117/12.761339","url":null,"abstract":"As we enter into the 21st century, the need for miniaturized portable diagnostic devices is increasing continuously. Portable devices find important applications for point-of-care diagnostics, patient self-monitoring and in remote areas, such as unpopulated regions where the cost of large laboratory facilities is not justifiable, underdeveloped countries and other remote locations such as space missions. The advantage of miniaturized sensing optical systems includes not only the reduced weight and size but also reduced cost, decreased time to results and robustness (e.g. no need for frequent re-alignments). Recent advances in micro-fabrication and assembly technologies have enabled important developments in the field of miniaturized sensing systems. INO has developed a technology platform for the three dimensional integration of MOEMS on an optical microbench. Building blocks of the platform include microlenses, micromirrors, dichroic beamsplitters, filters and optical fibers, which can be positioned using passive alignment structures to build the desired miniaturised system. The technology involves standard microfabrication, thick resist UV-lithography, thick metal electroplating, soldering, replication in sol-gel materials and flip-chip bonding processes. The technology is compatible with wafer-to-wafer bonding. A placement accuracy of ± 5 μm has been demonstrated thanks to the integration of alignment marks co registered with other optical elements fabricated on different wafers. In this paper, the building blocks of the technology will be detailed. The design and fabrication of a 5x5 channels light processing unit including optical fibers, mirrors and collimating microlenses will be described. Application of the technology to various kinds of sensing devices will be discussed.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125211906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Measuring MEMS through silicon caps 通过硅帽测量MEMS

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.772112

M. Hazel, Maurice S. Karpman

{"title":"Measuring MEMS through silicon caps","authors":"M. Hazel, Maurice S. Karpman","doi":"10.1117/12.772112","DOIUrl":"https://doi.org/10.1117/12.772112","url":null,"abstract":"MEMS used in inertial sensors rely on the movement of mechanical elements, generally systems of masses and springs. Shielding these structures from particulate contamination requires encapsulating the MEMS structures. This encapsulation is typically accomplished by placing a silicon cap over the MEMS at the wafer level. In the event the device stops functioning as expected, it is necessary to visually inspect the MEMS structures. However, once the device is capped, the only way to visually inspect the sensor is to remove the cap using a destructive decapsulation process. Fortunately, product analysts can take advantage of the transmissive properties of infrared light through lightly doped silicon to examine MEMS structures through their silicon cap using IR microscopy. Although useful, the image quality of conventional IR microscopy has limitations resulting from the optics, geometry and detectors currently available. Recently, laser confocal microscopy techniques have been adapted to the infrared spectrum, offering improved image clarity and measurement capability. This paper reviews the use of conventional IR microscopy in imaging through silicon caps, the limitations of conventional IR microscopy in this application, and the new capabilities afforded by the use of laser confocal IR microscopy for through-cap imaging.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130548474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Use of adaptive optics to increase nonlinear imaging signal in mouse bone morrow 利用自适应光学增强小鼠骨神经非线性成像信号

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.769506

Yaopeng Zhou, T. Bifano, Charles P. Lin

引用次数: 0

Support for microsystems simulation: Are we watching the clock? 对微系统模拟的支持:我们在看时钟吗?

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.764500

C. Drummond, F. Lisy

引用次数: 1

A new model for vacuum quality and lifetime prediction in hermetic vacuum bonded MEMS 一个新的真空键合MEMS真空质量和寿命预测模型

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.761140

A. Bonucci, S. Guadagnuolo, A. Caterino, A. Conte, M. Moraja

{"title":"A new model for vacuum quality and lifetime prediction in hermetic vacuum bonded MEMS","authors":"A. Bonucci, S. Guadagnuolo, A. Caterino, A. Conte, M. Moraja","doi":"10.1117/12.761140","DOIUrl":"https://doi.org/10.1117/12.761140","url":null,"abstract":"In many MEMS applications the level of vacuum is a key issue as it directly affects the quality of the device, in terms of response reliability. Due to the unavoidable desorption phenomena of gaseous species from the internal surfaces, the vacuum inside a MEMS, after bonding encapsulation, tends to be degraded, unless a proper getter solution is applied. The in situ getter film (PaGeWafer®) is recognised to be the most reliable way to get rid of degassed species, assuring uniform, high quality performances of the device throughout the lifetime. Moreover, post process vacuum quality control and reliability for hermetic bonding is extremely important for overall device reliability and process yield. In this paper we will discuss the main factors that are critical in the attainment of vacuum and will present a novel calculation model that enables the prediction of vacuum level after bonding, making also possible the estimate of the lifetime. Furthermore, a new analytical method based on the residual gas analyses (RGA) will be presented that gives the main characteristics of the materials. Modeling and simulation work support the process optimization and system design.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130396915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Villages: an on-sky visible wavelength astronomy AO experiment using a MEMS deformable mirror 村落:利用MEMS变形镜进行天空可见波长天文AO实验

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.772406

D. Gavel, S. Severson, Brian Jeffrey Bauman, D. Dillon, M. Reinig, C. Lockwood, D. Palmer, K. Morzinski, S. Ammons, E. Gates, B. Grigsby

引用次数: 24

New approach for MEMS scanning mirror for laser projection systems 激光投影系统用MEMS扫描镜的新方法

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.761531

H. Grüger, J. Knobbe, M. Scholles, H. Schenk, H. Lakner

{"title":"New approach for MEMS scanning mirror for laser projection systems","authors":"H. Grüger, J. Knobbe, M. Scholles, H. Schenk, H. Lakner","doi":"10.1117/12.761531","DOIUrl":"https://doi.org/10.1117/12.761531","url":null,"abstract":"Fraunhofer IPMS already demonstrated a technology for resonant 2D MEMS scanning mirrors, where the resonant driving principle has been established for mirror and frame. Using frequencies of 2500 Hz for the frame and 28 kHz for the mirror full color laser projection systems have been developed. Multiple Lissajous patterns are needed for the generation of one picture. Thus efficiency and frame rate are limited. Recently, a new approach has been invented: still a resonantly moving mirror is used for the fast movement but the frame is driven by a quasi-static drive. Among the several driving mechanisms possible the piezoelectric drive is the most promising. By choosing appropriate piezoelectric materials MEMS process integration is feasible. Besides a quasi-static deviation to generate pictures further options arise. The picture generation algorithm can be simplified if the movement along the rows is stepwise and the movement back is one fast step. This saw tooth like motion could be achieved through the high frequency response of piezoelectric materials. The setup of the chip is similar to the existing 2d scanning mirrors: Inside the mirror with an area of 0.25 to 9 mm2 is mounted on two spring bearings to the frame and resonantly driven through comb structures. The frame bearing to the chip is realized through flat bending actuators. Either the position change has to be considered at the picture generation or a layout has to be designed in a way that ensures a Pivot point in the middle of the mirror.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116833593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1