S. García-Blanco, J. Caron, S. Leclair, P. Topart, H. Jerominek
{"title":"面向传感器件小型化的三维moems光学微工作台平台","authors":"S. García-Blanco, J. Caron, S. Leclair, P. Topart, H. Jerominek","doi":"10.1117/12.761339","DOIUrl":null,"url":null,"abstract":"As we enter into the 21st century, the need for miniaturized portable diagnostic devices is increasing continuously. Portable devices find important applications for point-of-care diagnostics, patient self-monitoring and in remote areas, such as unpopulated regions where the cost of large laboratory facilities is not justifiable, underdeveloped countries and other remote locations such as space missions. The advantage of miniaturized sensing optical systems includes not only the reduced weight and size but also reduced cost, decreased time to results and robustness (e.g. no need for frequent re-alignments). Recent advances in micro-fabrication and assembly technologies have enabled important developments in the field of miniaturized sensing systems. INO has developed a technology platform for the three dimensional integration of MOEMS on an optical microbench. Building blocks of the platform include microlenses, micromirrors, dichroic beamsplitters, filters and optical fibers, which can be positioned using passive alignment structures to build the desired miniaturised system. The technology involves standard microfabrication, thick resist UV-lithography, thick metal electroplating, soldering, replication in sol-gel materials and flip-chip bonding processes. The technology is compatible with wafer-to-wafer bonding. A placement accuracy of ± 5 μm has been demonstrated thanks to the integration of alignment marks co registered with other optical elements fabricated on different wafers. In this paper, the building blocks of the technology will be detailed. The design and fabrication of a 5x5 channels light processing unit including optical fibers, mirrors and collimating microlenses will be described. Application of the technology to various kinds of sensing devices will be discussed.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"3D MOEMS-based optical micro-bench platform for the miniaturization of sensing devices\",\"authors\":\"S. García-Blanco, J. Caron, S. Leclair, P. Topart, H. Jerominek\",\"doi\":\"10.1117/12.761339\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As we enter into the 21st century, the need for miniaturized portable diagnostic devices is increasing continuously. Portable devices find important applications for point-of-care diagnostics, patient self-monitoring and in remote areas, such as unpopulated regions where the cost of large laboratory facilities is not justifiable, underdeveloped countries and other remote locations such as space missions. The advantage of miniaturized sensing optical systems includes not only the reduced weight and size but also reduced cost, decreased time to results and robustness (e.g. no need for frequent re-alignments). Recent advances in micro-fabrication and assembly technologies have enabled important developments in the field of miniaturized sensing systems. INO has developed a technology platform for the three dimensional integration of MOEMS on an optical microbench. Building blocks of the platform include microlenses, micromirrors, dichroic beamsplitters, filters and optical fibers, which can be positioned using passive alignment structures to build the desired miniaturised system. The technology involves standard microfabrication, thick resist UV-lithography, thick metal electroplating, soldering, replication in sol-gel materials and flip-chip bonding processes. The technology is compatible with wafer-to-wafer bonding. A placement accuracy of ± 5 μm has been demonstrated thanks to the integration of alignment marks co registered with other optical elements fabricated on different wafers. In this paper, the building blocks of the technology will be detailed. The design and fabrication of a 5x5 channels light processing unit including optical fibers, mirrors and collimating microlenses will be described. Application of the technology to various kinds of sensing devices will be discussed.\",\"PeriodicalId\":130723,\"journal\":{\"name\":\"SPIE MOEMS-MEMS\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-02-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE MOEMS-MEMS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.761339\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE MOEMS-MEMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.761339","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D MOEMS-based optical micro-bench platform for the miniaturization of sensing devices
As we enter into the 21st century, the need for miniaturized portable diagnostic devices is increasing continuously. Portable devices find important applications for point-of-care diagnostics, patient self-monitoring and in remote areas, such as unpopulated regions where the cost of large laboratory facilities is not justifiable, underdeveloped countries and other remote locations such as space missions. The advantage of miniaturized sensing optical systems includes not only the reduced weight and size but also reduced cost, decreased time to results and robustness (e.g. no need for frequent re-alignments). Recent advances in micro-fabrication and assembly technologies have enabled important developments in the field of miniaturized sensing systems. INO has developed a technology platform for the three dimensional integration of MOEMS on an optical microbench. Building blocks of the platform include microlenses, micromirrors, dichroic beamsplitters, filters and optical fibers, which can be positioned using passive alignment structures to build the desired miniaturised system. The technology involves standard microfabrication, thick resist UV-lithography, thick metal electroplating, soldering, replication in sol-gel materials and flip-chip bonding processes. The technology is compatible with wafer-to-wafer bonding. A placement accuracy of ± 5 μm has been demonstrated thanks to the integration of alignment marks co registered with other optical elements fabricated on different wafers. In this paper, the building blocks of the technology will be detailed. The design and fabrication of a 5x5 channels light processing unit including optical fibers, mirrors and collimating microlenses will be described. Application of the technology to various kinds of sensing devices will be discussed.