面向传感器件小型化的三维moems光学微工作台平台

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI:10.1117/12.761339
S. García-Blanco, J. Caron, S. Leclair, P. Topart, H. Jerominek
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引用次数: 2

摘要

进入21世纪,对小型化便携式诊断设备的需求不断增加。便携式设备在即时诊断、患者自我监测和偏远地区(如大型实验室设施成本不合理的无人居住地区)、不发达国家和其他偏远地区(如太空任务)都有重要应用。小型化传感光学系统的优势不仅包括重量和尺寸的减小,而且还包括成本的降低、获得结果的时间缩短和鲁棒性(例如,不需要频繁的重新校准)。微加工和装配技术的最新进展使小型化传感系统领域取得了重要发展。INO开发了一种在光学微平台上实现MOEMS三维集成的技术平台。该平台的构建模块包括微透镜、微镜、二向色分束器、滤波器和光纤,它们可以使用被动对准结构进行定位,以构建所需的小型化系统。该技术涉及标准微加工、厚抗蚀剂uv光刻、厚金属电镀、焊接、溶胶-凝胶材料复制和倒装芯片键合工艺。该技术与晶圆间键合兼容。由于集成了在不同晶圆上制造的其他光学元件的对准标记,因此放置精度为±5 μm。在本文中,将详细介绍该技术的构建模块。设计和制造一个5x5通道光处理单元,包括光纤、反射镜和准直微透镜将被描述。将讨论该技术在各种传感装置中的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3D MOEMS-based optical micro-bench platform for the miniaturization of sensing devices
As we enter into the 21st century, the need for miniaturized portable diagnostic devices is increasing continuously. Portable devices find important applications for point-of-care diagnostics, patient self-monitoring and in remote areas, such as unpopulated regions where the cost of large laboratory facilities is not justifiable, underdeveloped countries and other remote locations such as space missions. The advantage of miniaturized sensing optical systems includes not only the reduced weight and size but also reduced cost, decreased time to results and robustness (e.g. no need for frequent re-alignments). Recent advances in micro-fabrication and assembly technologies have enabled important developments in the field of miniaturized sensing systems. INO has developed a technology platform for the three dimensional integration of MOEMS on an optical microbench. Building blocks of the platform include microlenses, micromirrors, dichroic beamsplitters, filters and optical fibers, which can be positioned using passive alignment structures to build the desired miniaturised system. The technology involves standard microfabrication, thick resist UV-lithography, thick metal electroplating, soldering, replication in sol-gel materials and flip-chip bonding processes. The technology is compatible with wafer-to-wafer bonding. A placement accuracy of ± 5 μm has been demonstrated thanks to the integration of alignment marks co registered with other optical elements fabricated on different wafers. In this paper, the building blocks of the technology will be detailed. The design and fabrication of a 5x5 channels light processing unit including optical fibers, mirrors and collimating microlenses will be described. Application of the technology to various kinds of sensing devices will be discussed.
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