SPIE MOEMS-MEMS最新文献

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Toward sub-10-nm resolution zone plates using the overlay nanofabrication processes 采用覆盖纳米工艺制备亚10nm分辨率的带片
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.768878
W. Chao, E. Anderson, P. Fischer, Donghyun Kim
{"title":"Toward sub-10-nm resolution zone plates using the overlay nanofabrication processes","authors":"W. Chao, E. Anderson, P. Fischer, Donghyun Kim","doi":"10.1117/12.768878","DOIUrl":"https://doi.org/10.1117/12.768878","url":null,"abstract":"Soft x-ray zone plate microscopy has proven to be a valuable imaging technique for nanoscale studies. It complements nano-analytic techniques such as electron and scanning probe microscopies. One of its key features is high spatial resolution. We developed an overlay nanofabrication process which allows zone plates of sub-20 nm zone widths to be fabricated. Zone plates of 15 nm outer zones were successfully realized using this process, and sub-15 nm resolution was achieved with these zone plates. We extend the overlay process to fabricating zone plates of 12 nm outer zones, which is expected to achieve 10 nm resolution. In addition, we have identified a pathway to realizing sub-10 nm resolution, high efficiency zone plates with tilted zones using the overlay process.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131736531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Fabrication and testing of plasmonic optimized transmission and reflection coatings 等离子体优化传输和反射涂层的制备和测试
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.763921
A. Cruz-Cabrera, L. Basilio, D. Peters, J. Wendt, S. Kemme, S. Samora
{"title":"Fabrication and testing of plasmonic optimized transmission and reflection coatings","authors":"A. Cruz-Cabrera, L. Basilio, D. Peters, J. Wendt, S. Kemme, S. Samora","doi":"10.1117/12.763921","DOIUrl":"https://doi.org/10.1117/12.763921","url":null,"abstract":"We designed, fabricated, and tested surface-plasmon-based transmissive coatings in the MWIR (mid wave infrared) and LWIR (long wave infrared). This method offers certain advantages over current coatings technologies such as thin-film stacks and two-dimensional surface structuring (e.g. motheyes) while exploring an entirely different physical mechanism for achieving transmission. Thin-film stack technology relies on interference between layers of the stack, and often many layers are required for high efficiency performance. Two-dimensional surface structuring can optimize transmission over a broad spectral and angular domain1. Here the physical mechanism is an effective index matching between air and the substrate due to subwavelength surface features, such as tall pyramids. These pyramids must have a high-aspect ratio, resulting in a surface of many tall thin features, which may not be mechanically robust. In this work, we created a transmissive surface out of a metal skin perforated with an array of subwavelength apertures. The surface is the infrared analog of a frequency selective surface (FSS) common in the microwave regime. Such perforated metal surfaces are predicted to have nearly 100% transmission over selected wavelength and angular ranges. These ranges are determined by array geometry, period, and aperture size and shape, allowing the designer considerable freedom. Array geometry and aperture shape were investigated for tailoring spectral features.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"181 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124524740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Frontiers in device engineering: synthesis for nonintuitive design 器件工程前沿:非直觉设计的综合
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.769264
A. Levi
{"title":"Frontiers in device engineering: synthesis for nonintuitive design","authors":"A. Levi","doi":"10.1117/12.769264","DOIUrl":"https://doi.org/10.1117/12.769264","url":null,"abstract":"Today, nano-science provides an overwhelmingly large number of experimentally accessible ways to configure the spatial position of atoms, molecules, and other nanoscale components to form devices. The challenge is to find the best, most practical, configuration that yields a useful device function. In the presence of what will typically be an enormous non-convex search space, it is reasonable to assume that traditional ad-hoc design methods will miss many possible solutions. One approach to solving this difficult problem is to employ machine-based searches of configuration space that discover user-defined objective functions. Such an optimal design methodology aims to identify the best brokensymmetry spatial configuration of metal, semiconductor, and dielectric that produce a desired response. Hence, by harnessing a combination of modern compute power, adaptive algorithms, and realistic physical models, it should be possible to seek robust, manufacturable designs that meet previously unobtainable system specifications. Ultimately one can envision a methodology that simultaneously is capable of basic scientific discovery and engineering for technological applications.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124021335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dry film process development for electroplating and lift-off of metal layers 电镀及金属层剥离干膜工艺的发展
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.768611
P. R. Kanikella, M. O’Keefe, Chang-soo Kim
{"title":"Dry film process development for electroplating and lift-off of metal layers","authors":"P. R. Kanikella, M. O’Keefe, Chang-soo Kim","doi":"10.1117/12.768611","DOIUrl":"https://doi.org/10.1117/12.768611","url":null,"abstract":"A dry film photoresist (MX 5020 from DuPont Electronic Technologies) was selected to fabricate microstructures with high sidewall verticality. Sidewall verticality of dry film is very important for better pattern transfer and sharp features. A fractional factorial design (FFD) method was used to identify the significant process variables for sidewall optimization. The most significant factor was determined to be exposure energy, as other factors were not significant in improving sidewall verticality. It was found that the sidewall slope increased with a decrease in exposure energy. The fabricated dry film molds with nearly vertical sidewalls (86°) were used for copper electroplating and sputter deposited Ti lift-off applications. The electroplating process was also optimized using a fractional factorial design. A lower plating current density resulted in a smoother, fine grained deposit compared to the higher current density, and the dry film resist was able to withstand a very acidic (pH ~1) copper sulfate plating solution. Sputtered titanium films with a thickness of 200 nm were also successfully lifted-off using dry film patterning.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"556 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128695301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Mechanics of the dynamic release process for stiction failed microcantilever beams using structural vibrations 基于结构振动的粘性失效微悬臂梁动态释放过程力学
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.783835
Amit Savkar, K. D. Murphy
{"title":"Mechanics of the dynamic release process for stiction failed microcantilever beams using structural vibrations","authors":"Amit Savkar, K. D. Murphy","doi":"10.1117/12.783835","DOIUrl":"https://doi.org/10.1117/12.783835","url":null,"abstract":"Recently it has been shown that structural vibrations are an efficient means to repair stiction failed microcantilever beams. Experiments and analysis have identified excitation parameters (amplitude and frequency) that successfully initiated the debonding process between the microcantilever and the substrate. That analysis could not describe what happened after the debonding process was initiated. For example it could not predict if the beam would transition from a s-shaped to an arc-shaped configuration or even be repaired to a free-standing beam. The current research examines the post-initiation behavior of stiction failed microcantilever beams. A new-coupled fracture/vibration model is formulated and used to track the evolution of the repair in order to determine the extent of repair under various conditions. This model successfully explains phenomenological observations made during the experiments regarding the repair process being dependent on direction of frequency sweeps, complete and partial repair, and monitors the degree of repair no repair, partial repair or complete repair along with releases time associated with such repairs.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129920487","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Cytometric biochips with optically active surfaces for spatial engineering of fluorescence excitation 具有光学活性表面的荧光激发空间工程细胞生物芯片
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.763645
H. Summers, R. Errington, Paul J. Smith, D. Matthews, J. Leary
{"title":"Cytometric biochips with optically active surfaces for spatial engineering of fluorescence excitation","authors":"H. Summers, R. Errington, Paul J. Smith, D. Matthews, J. Leary","doi":"10.1117/12.763645","DOIUrl":"https://doi.org/10.1117/12.763645","url":null,"abstract":"The development of surface-active biochips for control of fluorescence within microscopy platforms is described. These use surface-plasmon control to provide selective excitation of fluorescently labeled, live cell populations. These chips effectively combine a number of commonly used techniques such as SPR, TIRF and epi-fluorescence within a single device and have the potential to provide sub-cellular discrimination of excitation in 3-D. Thus within a single field of view we can selectively excite membrane versus cytoplasm and localise the excitation within the lateral plane to an area of a few square microns.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132207352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Micromachining of a fiber-to-waveguide coupler using grayscale lithography and through-wafer etch 采用灰度光刻和通晶圆蚀刻的光纤-波导耦合器的微加工
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.764036
T. Dillon, M. Zablocki, S. Shi, J. Murakowski, D. Prather
{"title":"Micromachining of a fiber-to-waveguide coupler using grayscale lithography and through-wafer etch","authors":"T. Dillon, M. Zablocki, S. Shi, J. Murakowski, D. Prather","doi":"10.1117/12.764036","DOIUrl":"https://doi.org/10.1117/12.764036","url":null,"abstract":"For some time, the micro-optics and photonics fields have relied on fabrication processes and technology borrowed from the well-established silicon integrated circuit industry. However, new fabrication methodologies must be developed for greater flexibility in the machining of micro-optic devices. To this end, we have explored grayscale lithography as an enabler for the realization of such devices. This process delivers the ability to sculpt materials arbitrarily in three dimensions, thus providing the flexibility to realize optical surfaces to shape, transform, and redirect the propagation of light efficiently. This has opened the door for new classes of optical devices. As such, we present a fiber-to-waveguide coupling structure utilizing a smoothly contoured lensing surface in the device layer of a silicon-on insulator (SOI) wafer, fabricated using grayscale lithography. The structure collects light incident normally to the wafer from a singlemode optical fiber plugged through the back surface and turns the light into the plane of the device layer, focusing it into a single-mode waveguide. The basis of operation is total internal reflection, and the device therefore has the potential advantages of providing a large bandwidth, low polarization sensitivity, high efficiency, and small footprint. The structure was optimized with a simulated annealing algorithm in conjunction with two-dimensional finite-difference time-domain (FDTD) simulation accelerated on the graphics processing unit (GPU), and achieves a theoretical efficiency of approximately seventy percent, including losses due to Fresnel reflection from the oxide/silicon interface. Initial fabrication results validate the principle of operation. We discuss the grayscale fabrication process as well as the through-wafer etch for mechanical stabilization and alignment of the optical fiber to the coupling structure. Refinement of the through-wafer etch process for high etch rate and appropriate sidewall taper are addressed.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130937146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Noninstrumented nucleic acid amplification assay 无仪器核酸扩增试验
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.763650
B. Weigl, G. Domingo, Jay L Gerlach, Dennis Tang, D. Harvey, Nick Talwar, Alex Fichtenholz, Bill van Lew, P. Labarre
{"title":"Noninstrumented nucleic acid amplification assay","authors":"B. Weigl, G. Domingo, Jay L Gerlach, Dennis Tang, D. Harvey, Nick Talwar, Alex Fichtenholz, Bill van Lew, P. Labarre","doi":"10.1117/12.763650","DOIUrl":"https://doi.org/10.1117/12.763650","url":null,"abstract":"We have developed components of a diagnostic disposable platform that has the dual purpose of providing molecular diagnostics at the point of care (POC) as well as stabilizing specimens for further analysis via a centralized surveillance system. This diagnostic is targeted for use in low-resource settings by minimally trained health workers. The disposable device does not require any additional instrumentation and will be almost as rapid and simple to use as a lateral flow strip test - yet will offer the sensitivity and specificity of nucleic acid amplification tests (NAATs). The low-cost integrated device is composed of three functional components: (1) a sample-processing subunit that generates clean and stabilized DNA from raw samples containing nucleic acids, (2) a NA amplification subunit, and (3) visual amplicon detection sub-unit. The device integrates chemical exothermic heating, temperature stabilization using phase-change materials, and isothermal nucleic acid amplification. The aim of developing this system is to provide pathogen detection with NAAT-level sensitivity in low-resource settings where there is no access to instrumentation. If a disease occurs, patients would be tested with the disposable in the field. A nucleic acid sample would be preserved within the spent disposable which could be sent to a central laboratory facility for further analysis if needed.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126585348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Manipulating T-junction chip for the generation of uniform O/W and W/O emulsions 操纵t结芯片生成均匀的O/W和W/O乳剂
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.771516
C. Yeh, Sheng-Ji Lee, Meng Sun, Q. Fang, Yu-Cheng Lin
{"title":"Manipulating T-junction chip for the generation of uniform O/W and W/O emulsions","authors":"C. Yeh, Sheng-Ji Lee, Meng Sun, Q. Fang, Yu-Cheng Lin","doi":"10.1117/12.771516","DOIUrl":"https://doi.org/10.1117/12.771516","url":null,"abstract":"The purpose of this study is to generate monodisperse oil-in-water (O/W) and water-in-oil (W/O) emulsions using microfluidic T-junction. The materials of poly methyl methacrylate (PMMA) (hydrophobic), polydimethylsiloxane (PDMS) (hydrophobic) and glass (hydrophilic) were employed for microfluidic chip fabrication. Our strategy is based on the shear focus effect and sheath effect (focusing) to form uniform self-assembling sphere structures, the so-called O/W and W/O emulsions, in the T-junction microchannel. Results show that the size from 31 μm to 43 μm in diameter of O/W emulsions was generated by using the glass-based microfluidic chip. In addition, results show that the size from 70 μm to 220 µm of W/O emulsions was available by utilizing the PMMA-based microfluidic chip. These W/O emulsions were further applied to Ca-alginate microparticles (Ca-alg MPs). And the results also show that the size from 410 μm to 700 μm of UV-Photopolymerized microparticles was available by utilizing the PDMS-based microfluidic chip. The proposed microfluidic chips are capable of generating relatively uniform micro-droplets and have the advantages of actively controlling the droplet diameter, and having a simple and low cost process, with a high throughput.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"333 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115980639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Study of Ag-In solder as low temperature wafer bonding intermediate layer 将 Ag-In 焊料用作低温晶片键合中间层的研究
SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.762046
R. I. Made, C. Gan, Chengkuo Lee, L. Yan, A. Yu, S. Yoon, J. Lau
{"title":"Study of Ag-In solder as low temperature wafer bonding intermediate layer","authors":"R. I. Made, C. Gan, Chengkuo Lee, L. Yan, A. Yu, S. Yoon, J. Lau","doi":"10.1117/12.762046","DOIUrl":"https://doi.org/10.1117/12.762046","url":null,"abstract":"Indium-silver as solder materials for low temperature bonding had been introduced earlier. In theory the final bonding interface composition is determined by the overall materials composition. Wafer bonding based multiple intermediate layers facilitates precise control of the formed alloy composition and the joint thickness. Thus the bonding temperature and post-bonding re-melting temperature could be easily designed by controlling the multilayer materials. In this paper, a more fundamental study of In-Ag solder materials is carried out in chip-to-chip level by using flip-chip based thermocompression bonding. Bonding at 180°C for various time duration under various bonding pressure is studied. Approaches of forming Ag2In with re-melting temperature higher than 400°C at the bonding interface are proposed and discussed. Knowledge learned in this process technology can support us to develop sophisticated wafer level packaging process based wafer bonding for applications of MEMS and IC packages.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131112350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
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