Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)最新文献_第5页

Statistical analysis and design of semiconductor manufacturing systems 半导体制造系统的统计分析与设计

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993681

A. Chen, P.-S. Guo, P. Lin

引用次数: 3

Integrated Spares Solutions (ISS) program 综合备件解决方案(ISS)计划

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993610

W. Harris

{"title":"Integrated Spares Solutions (ISS) program","authors":"W. Harris","doi":"10.1109/ISSM.2000.993610","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993610","url":null,"abstract":"An increasingly expensive element of wafer cost is spares. The Integrated Spares Solutions (ISS) program breaks out of the traditional mold of relying on equipment manufacturers to supply parts, which has proven to be expensive and unreliable in terms of spares availability. The ISS program utilizes a distributor to direct source product at reduced cost and to streamline inventory and order management. This strategy exists in other industries (automotive), but has not found a foothold in the semiconductor industry. The scope of the program is high usage, non-proprietary parts. Suppliers had to be identified developed and managed The suppliers' experience in semiconductor spares is critical. ISS yields many benefits. 1. Integration is facilitated through on-site personnel. 2. The supply base is consolidated reducing supplier management tasks and variability. 3. The inventory investment is reduced. Parts are on-site (consignment) and are stocked in local depots for emergency back up, which improves availability. 4. Prices decline as the suppliers go direct to the part manufacturers. 5. Product is located in the factory near the tool. 6 Order management is consolidated, as are shipments, and the web is utilized. Significant cost savings have been realized and spares availability metrics have improved 10X.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116511976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Dynamic load balancing among multiple fabrication lines 多生产线之间的动态负载平衡

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993683

H. Toba, M. Yonekura

引用次数: 3

A framework model for fab agility and 25 ways to be agile fab敏捷的框架模型和实现敏捷的25种方法

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993651

U. Arazy, Y. De Russo

{"title":"A framework model for fab agility and 25 ways to be agile","authors":"U. Arazy, Y. De Russo","doi":"10.1109/ISSM.2000.993651","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993651","url":null,"abstract":"In the Semiconductor Industry, we often find ourselves with LRP (Long Range Plan) being obsolete the day it is officially published, we need to be able quickly respond to changing requirements, i.e. be agile! We start with a practical definition of agility for fabs and the fab supply chain. Agility is simply defined as \"The ability to respond and execute to a business scenario change quickly and at a low cost.\" We show 25 actions that can be taken within the Fab Supply Chain to achieve agility. These actions are classified according to their Scope of Influence, and are mapped into the Agility Framework Model. The Agility Framework Model ties these notions together, aligned with the above definition, in a crisp 2 /spl times/ 2 matrix model. An organization that can respond to changing requirements quickly and at a low cost is said to be agile. One that responds quickly but at a high cost is reactive. In order to achieve agility in a consistent and systematic way, an organization needs to go through three stages of the Agility Flow: strategic, proactive projects, and agility execution. We propose that agility needs to be an organizational value and may at times be in conflict with 'traditional' fab priorities. We believe that the model and the concepts are generic and applicable to other organizations.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126875089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Optimized CMP operation by extended X-factor theory including offline unit hour 利用扩展的x因素理论优化CMP运行，包括离线单位小时

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993619

M. Kishimoto, K. Ozawa

引用次数: 1

Productivity improvement for dry etch equipment through the application of simulation 通过模拟应用提高干式腐蚀设备的生产效率

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993621

S. Pampel, J. Domaschke, H. Jetter

引用次数: 1

On line diagnostics and support as a key part of process module control 在线诊断和支持是过程模块控制的关键部分

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993655

M. Locy

引用次数: 2

Interference method to fabricate phase shifter of alternate phase shifting mask 交替移相掩模移相器的干涉制作方法

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993703

Y. Lo, Yi-kong Tsai

引用次数: 0

Control of behavior of particles flaked off an anode in plasma etch-back equipment by bias electrode 用偏压电极控制等离子体腐蚀设备中阳极脱落颗粒的行为

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993689

T. Moriya, N. Ito, F. Uesugi, Y. Hayashi, K. Okamura

引用次数: 2

The most effective method for reducing PFC emissions caused by PECVD cleaning using the chamber impedance monitor 使用腔室阻抗监测器减少PECVD清洗引起的PFC排放的最有效方法

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI: 10.1109/ISSM.2000.993635

T. Yoda, M. Shimizu

引用次数: 0