利用扩展的x因素理论优化CMP运行，包括离线单位小时

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI:10.1109/ISSM.2000.993619

M. Kishimoto, K. Ozawa

{"title":"利用扩展的x因素理论优化CMP运行，包括离线单位小时","authors":"M. Kishimoto, K. Ozawa","doi":"10.1109/ISSM.2000.993619","DOIUrl":null,"url":null,"abstract":"We focus on operator efficiency in the CMP (chemical mechanical polishing) operation, which, as a typical manually operated tool, influences cycle time. The main purpose is to optimize CMP operation by using online/offline unit hour analysis and X-factor theory, and describe the relationship between operator headcount and cycle time. The online/offline unit hour analysis has been designed to optimize operator allocation and headcount in our production line in order to archive the shortest cycle time.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Optimized CMP operation by extended X-factor theory including offline unit hour\",\"authors\":\"M. Kishimoto, K. Ozawa\",\"doi\":\"10.1109/ISSM.2000.993619\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We focus on operator efficiency in the CMP (chemical mechanical polishing) operation, which, as a typical manually operated tool, influences cycle time. The main purpose is to optimize CMP operation by using online/offline unit hour analysis and X-factor theory, and describe the relationship between operator headcount and cycle time. The online/offline unit hour analysis has been designed to optimize operator allocation and headcount in our production line in order to archive the shortest cycle time.\",\"PeriodicalId\":104122,\"journal\":{\"name\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2000.993619\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2000.993619","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

我们关注的是CMP(化学机械抛光)操作中的操作员效率，CMP作为一种典型的手动操作工具，会影响周期时间。主要目的是通过在线/离线单位小时分析和x因素理论来优化CMP操作，并描述操作人员人数与周期时间的关系。在线/离线单位小时分析旨在优化生产线上的操作人员分配和人员数量，以存档最短的周期时间。

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Optimized CMP operation by extended X-factor theory including offline unit hour

We focus on operator efficiency in the CMP (chemical mechanical polishing) operation, which, as a typical manually operated tool, influences cycle time. The main purpose is to optimize CMP operation by using online/offline unit hour analysis and X-factor theory, and describe the relationship between operator headcount and cycle time. The online/offline unit hour analysis has been designed to optimize operator allocation and headcount in our production line in order to archive the shortest cycle time.

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来源期刊

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)

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