40th Conference Proceedings on Electronic Components and Technology最新文献

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A stable laser module with UV-curable resin for single-mode subscriber use 一个稳定的激光模块与紫外光固化树脂单模用户使用
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122189
M. Suzuki, T. Nakanishi, N. Tsuzuki, N. Murata
{"title":"A stable laser module with UV-curable resin for single-mode subscriber use","authors":"M. Suzuki, T. Nakanishi, N. Tsuzuki, N. Murata","doi":"10.1109/ECTC.1990.122189","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122189","url":null,"abstract":"The successful development of a low-cost laser-to-fiber coupling module for single-mode subscriber use is reported. The module consists of a laser collimator and a fiber collimator with a microball lens in each collimator, that is, a two-microball-lens system in a confocal condition. The key technology of this module is the high-precision bonding of a microball lens in front of a laser diode using a recently developed ultraviolet (UV)-curable resin. An average coupling efficiency of -4.7 dB with a standard deviation as small as 0.37 dB is achieved. It is found that the resin has good bonding durability and the module is stable under a temperature cycle test of over 1400 cycles. Simple structure and high reproducibility of the module have reduced the cost. A monolithically integrated laser diode and photodiode (LD-PD) are also developed. An output efficiency as high as 0.03 W/A is achieved in a 10-60 degrees C temperature range by combining the LD-PD with the module.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124818041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
A laser based system for tape automated bonding to integrated circuits 一种基于激光的磁带自动粘接到集成电路的系统
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122275
P. Spletter, R. Crowley
{"title":"A laser based system for tape automated bonding to integrated circuits","authors":"P. Spletter, R. Crowley","doi":"10.1109/ECTC.1990.122275","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122275","url":null,"abstract":"A laser-based process has been developed to bond tape automated bonding (TAB) leads to integrated circuit pads. This technology has many distinct advantages over conventional TAB bonding techniques, such as gang thermode bonding and single-point thermosonic bonding. TAB laser bonding is performed by positioning a focused laser beam over a lead and then pulsing the laser once, creating a reliable metallurgical bond between the plated lead and the bump. This bonding process takes advantage of a thin tin plating to absorb the laser energy and accelerate melting of the lead and bump materials. The resulting bond, which is composed of copper and gold, has withstood exposure to damaging environments. The laser-bonding equipment consists of a pseudo-pulsed Nd:YAG laser, a high-performance laser-beam positioner, a four-axis die pedestal, and a system control computer. The laser-beam positioner and laser-pulse parameters are software-controlled. The part's alignment and bonding positions are stored in a data file, and product changeover is accomplished by reading in the new product data file. The system can bond over 60 leads per second and is ideal for bonding high-pad-count or stress-sensitive integrated circuits.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127231293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Statistical process control used in surface mount assembly 用于表面贴装装配的统计过程控制
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122257
J. Criscione, B. Workman
{"title":"Statistical process control used in surface mount assembly","authors":"J. Criscione, B. Workman","doi":"10.1109/ECTC.1990.122257","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122257","url":null,"abstract":"Insufficient and excess solder are the two most significant defects associated with surface-mount assembly, for which process control can play an important role. The statistical process control of the amount of solder deposited is directly related to the control of defects associated with solder volume. Statistical process control has been implemented to ensure that associated solder defects are minimized and that proper process conditions are maintained and controlled. The sensitivity of influential process variables has been analyzed to establish their range of influence upon control of the process. It is concluded that, with this information, problem process conditions can quickly be identified and corrected.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132316283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design 高速互连用多导体传输线的分析与仿真及封装设计
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122186
H. You, M. Soma
{"title":"Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design","authors":"H. You, M. Soma","doi":"10.1109/ECTC.1990.122186","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122186","url":null,"abstract":"The authors present a novel approach to the crosstalk analysis of high-speed interconnects which are modeled as multiconductor transmission lines. The method is applicable to the general problem of N coupled lossy and/or dispersive interconnects with arbitrary linear source/load impedances. Closed-form formulas for determining the voltage and current transfer functions are derived using the spectral domain modal analysis technique. The transfer function is expanded to its Taylor series form, and the inverse Fourier transform is applied to the significant terms in the series. As a result, analytical expressions of time-domain signal waveforms are obtained. Besides providing valuable insight into the coupling phenomenon, the formulas facilitate analytical computation of noise and waveform distortion due to crosstalk.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128772503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Technology developments for terpene cleaning of electronic assemblies 萜烯清洗电子组件的技术进展
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122197
G. Tashjian, G. Wenger
{"title":"Technology developments for terpene cleaning of electronic assemblies","authors":"G. Tashjian, G. Wenger","doi":"10.1109/ECTC.1990.122197","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122197","url":null,"abstract":"Following extensive process testing and machine development, a spray-cleaning facility utilizing the semiaqueous terpene hydrocarbon Bioact EC-7 was installed at AT&T's Merrimack Valley manufacturing location in North Andover, MA. This facility, which represents a viable alternative to chlorofluorocarbon cleaning, is used to remove rosin-based-solder paste residues after reflow soldering of surface-mount devices to printed circuit (PC) board assemblies. The authors describe technology developments and operating experience gained during the implementation of semiaqueous terpene hydrocarbon cleaning. The EC-7 spray development/production machine will be used for further technology improvements in semiaqueous cleaning. The provisions incorporated in this machine, including the nitrogen inerting system, will enable the machine to handle almost any semiaqueous or aqueous material that may be developed.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123234360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Robust encapsulation of hybrid devices 混合器件的鲁棒封装
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122249
J. Emerson, J.J. Sparapany, A. R. Martín, M. Bonneau, D. Burkhart
{"title":"Robust encapsulation of hybrid devices","authors":"J. Emerson, J.J. Sparapany, A. R. Martín, M. Bonneau, D. Burkhart","doi":"10.1109/ECTC.1990.122249","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122249","url":null,"abstract":"An option for polymeric protection of bare ICs mounted directly to the surface of an alumina substrate is described. This robust package, with enhanced temperature-cycling performance and increased circuit survival rate under actual operating conditions, provides excellent protection throughout processing, handling, and field operation. The enhanced performance is the result of the high modulus and toughness of epoxy selective encapsulant-glob top. A combination of several physical enhancements in the material results from: (1) a higher silica filler content to lower the TCE (thermal coefficient of expansion) of the material, (2) the addition of elastomeric modifiers to improve the fracture toughness and dissipate stress, and (3) the definition of a cure schedule to optimize physical properties. The result of these factors is a good material formulation coupled with an enhanced cure schedule to yield a low-stress hybrid package. The final internal material stress, 3.2 MPa, is determined by the uniformly loaded beam method. The lower stress and lower TCE provide a four-fold improvement of temperature-cycling performance over older epoxy materials.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126407658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Multichip thin-film technology for low temperature packaging (CCD image sensors) 用于低温封装的多芯片薄膜技术(CCD图像传感器)
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122245
C.-L. Chen, R.W. Johnson, R. Jaeger, M. Cornelius, W. A. Foster
{"title":"Multichip thin-film technology for low temperature packaging (CCD image sensors)","authors":"C.-L. Chen, R.W. Johnson, R. Jaeger, M. Cornelius, W. A. Foster","doi":"10.1109/ECTC.1990.122245","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122245","url":null,"abstract":"An advanced astrometric sensor array (AASA) of charge coupled device (CCD) chips has been constructed using hybrid multichip packaging technology for operation at -140 degrees C. Precise alignment of the CCD chips, long-term thermal cycling between 25 degrees C and -140 degrees C, and electrical signal coupling were challenges in the construction of the AASA. A series of AASA prototypes was fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to obtain materials, fabrication processes, and a structure suitable for construction of the AASA. A silicon template was fabricated by anisotropic etching and used to align the CCD sensors. The AASA samples were evaluated by thermal cycling (27 degrees C to -138 degrees C) and die shear tests. Computer modeling was used for thermal stress analysis of the mechanical behavior of the AASA as a function of temperature. The coupled noise between long parallel lines (1.5 cm) on the AASA was investigated by circuit simulation and experimental measurements. The experimental and modeling results are presented.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"137 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114095057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A new technique for testing TAB-LSIs in gigahertz frequency range 一种在千兆赫频率范围内测试tab - lsi的新技术
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122303
T. Kon, S. Sasaki, R. Konno
{"title":"A new technique for testing TAB-LSIs in gigahertz frequency range","authors":"T. Kon, S. Sasaki, R. Konno","doi":"10.1109/ECTC.1990.122303","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122303","url":null,"abstract":"A novel testing technique for TAB (tape-automated-bonding) LSIs operating in the gigahertz-frequency range is described. A TAB tape is sandwiched between test tools in order to compose a stripline configuration during testing. This technique allows the testing frequency range to be dramatically extended by reducing reflection noise caused by impedance mismatch between the test leads and the test sets. Maximum testing bit rate reaches 5 Gb/s, which is 2.5 times greater than that of the conventional technique.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"127 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123802399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
New method of water cleaning for circuit substrates 电路基板的水清洗新方法
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122194
N. Takayama, T. Sugiyama, K. Takahashi
{"title":"New method of water cleaning for circuit substrates","authors":"N. Takayama, T. Sugiyama, K. Takahashi","doi":"10.1109/ECTC.1990.122194","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122194","url":null,"abstract":"Water-soluble flux which has characteristics equivalent to those of rosin flux has been developed by improving its activator and rheological modifier. Cleaning equipment has also been developed. The method was applied to cleaning on-board power-supply products, and the products passed a 1500-h temperature-humidity-bias test. It was demonstrated that combining the water-soluble flux and the cleaning equipment can provide the same reliability of reflow-soldered product as that of the product processed by the conventional cleaning method using rosin flux and solvent.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125181073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A new all-fiber fused taper polarization couplers 一种新型全光纤熔锥偏振耦合器
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122169
D. Wang, G. Qin, H. Chen, Z. Yan
{"title":"A new all-fiber fused taper polarization couplers","authors":"D. Wang, G. Qin, H. Chen, Z. Yan","doi":"10.1109/ECTC.1990.122169","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122169","url":null,"abstract":"All-fiber fused-taper polarization couplers with a package size of only 30 mm (length)*3 mm (diameter) have been fabricated with the conventional single-mode fiber. With unpolarized light exciting the input port of the device, the polarizing extinction ratios that are measured directly at both output ports are better than 20 dB. It is shown that this device can actually split two orthogonally polarized modes; in other words, this device performs as an all-fiber polarization beamsplitter. With the x- or y-polarized light exciting the input port of the device, the spectral response of the polarization splitting of both output ports was measured. The results show that this device performs as both a polarization coupler with a series of 3-dB splitting ratios and as a polarization wavelength division multiplexer.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122658689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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