高速互连用多导体传输线的分析与仿真及封装设计

H. You, M. Soma
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引用次数: 8

摘要

提出了一种以多导体传输线为模型的高速互连串扰分析新方法。该方法适用于具有任意线性源/负载阻抗的N耦合损耗和/或色散互连的一般问题。利用谱域模态分析技术导出了确定电压和电流传递函数的封闭公式。将传递函数展开为泰勒级数形式,并对级数中的重要项进行傅里叶反变换。得到了时域信号波形的解析表达式。除了对耦合现象提供有价值的见解外,这些公式还有助于解析计算由串扰引起的噪声和波形畸变。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design
The authors present a novel approach to the crosstalk analysis of high-speed interconnects which are modeled as multiconductor transmission lines. The method is applicable to the general problem of N coupled lossy and/or dispersive interconnects with arbitrary linear source/load impedances. Closed-form formulas for determining the voltage and current transfer functions are derived using the spectral domain modal analysis technique. The transfer function is expanded to its Taylor series form, and the inverse Fourier transform is applied to the significant terms in the series. As a result, analytical expressions of time-domain signal waveforms are obtained. Besides providing valuable insight into the coupling phenomenon, the formulas facilitate analytical computation of noise and waveform distortion due to crosstalk.<>
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CiteScore
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