用于低温封装的多芯片薄膜技术(CCD图像传感器)

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122245

C.-L. Chen, R.W. Johnson, R. Jaeger, M. Cornelius, W. A. Foster

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引用次数: 4

摘要

采用混合多芯片封装技术，构建了一种先进的电荷耦合器件(CCD)天文测量传感器阵列(AASA)，可在-140℃下工作。CCD芯片的精确对准、25℃至-140℃之间的长期热循环以及电信号耦合是构建AASA的挑战。为了获得适合AASA建造的材料、制造工艺和结构，我们用不同的环氧树脂、电路布局和衬底厚度制作了一系列AASA原型。采用各向异性刻蚀法制备硅模板，用于CCD传感器对准。AASA样品通过热循环(27℃至-138℃)和模具剪切试验进行评估。采用计算机模拟对AASA的力学行为进行了温度函数的热应力分析。通过电路仿真和实验测量，研究了AASA上长平行线(1.5 cm)之间的耦合噪声。给出了实验和建模结果。

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Multichip thin-film technology for low temperature packaging (CCD image sensors)

An advanced astrometric sensor array (AASA) of charge coupled device (CCD) chips has been constructed using hybrid multichip packaging technology for operation at -140 degrees C. Precise alignment of the CCD chips, long-term thermal cycling between 25 degrees C and -140 degrees C, and electrical signal coupling were challenges in the construction of the AASA. A series of AASA prototypes was fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to obtain materials, fabrication processes, and a structure suitable for construction of the AASA. A silicon template was fabricated by anisotropic etching and used to align the CCD sensors. The AASA samples were evaluated by thermal cycling (27 degrees C to -138 degrees C) and die shear tests. Computer modeling was used for thermal stress analysis of the mechanical behavior of the AASA as a function of temperature. The coupled noise between long parallel lines (1.5 cm) on the AASA was investigated by circuit simulation and experimental measurements. The experimental and modeling results are presented.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量