Multichip thin-film technology for low temperature packaging (CCD image sensors)

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122245

C.-L. Chen, R.W. Johnson, R. Jaeger, M. Cornelius, W. A. Foster

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引用次数: 4

Abstract

An advanced astrometric sensor array (AASA) of charge coupled device (CCD) chips has been constructed using hybrid multichip packaging technology for operation at -140 degrees C. Precise alignment of the CCD chips, long-term thermal cycling between 25 degrees C and -140 degrees C, and electrical signal coupling were challenges in the construction of the AASA. A series of AASA prototypes was fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to obtain materials, fabrication processes, and a structure suitable for construction of the AASA. A silicon template was fabricated by anisotropic etching and used to align the CCD sensors. The AASA samples were evaluated by thermal cycling (27 degrees C to -138 degrees C) and die shear tests. Computer modeling was used for thermal stress analysis of the mechanical behavior of the AASA as a function of temperature. The coupled noise between long parallel lines (1.5 cm) on the AASA was investigated by circuit simulation and experimental measurements. The experimental and modeling results are presented.<>

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用于低温封装的多芯片薄膜技术(CCD图像传感器)

采用混合多芯片封装技术，构建了一种先进的电荷耦合器件(CCD)天文测量传感器阵列(AASA)，可在-140℃下工作。CCD芯片的精确对准、25℃至-140℃之间的长期热循环以及电信号耦合是构建AASA的挑战。为了获得适合AASA建造的材料、制造工艺和结构，我们用不同的环氧树脂、电路布局和衬底厚度制作了一系列AASA原型。采用各向异性刻蚀法制备硅模板，用于CCD传感器对准。AASA样品通过热循环(27℃至-138℃)和模具剪切试验进行评估。采用计算机模拟对AASA的力学行为进行了温度函数的热应力分析。通过电路仿真和实验测量，研究了AASA上长平行线(1.5 cm)之间的耦合噪声。给出了实验和建模结果。

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量