Statistical process control used in surface mount assembly

Abstract

Insufficient and excess solder are the two most significant defects associated with surface-mount assembly, for which process control can play an important role. The statistical process control of the amount of solder deposited is directly related to the control of defects associated with solder volume. Statistical process control has been implemented to ensure that associated solder defects are minimized and that proper process conditions are maintained and controlled. The sensitivity of influential process variables has been analyzed to establish their range of influence upon control of the process. It is concluded that, with this information, problem process conditions can quickly be identified and corrected.<>