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40th Conference Proceedings on Electronic Components and Technology最新文献

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Electroless deposition of bumps for TAB technology 化学沉积压片技术的凸点
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122223
J. Simon, E. Zakel, H. Reichl
{"title":"Electroless deposition of bumps for TAB technology","authors":"J. Simon, E. Zakel, H. Reichl","doi":"10.1109/ECTC.1990.122223","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122223","url":null,"abstract":"Electroless nickel plating was investigated for bumping. Electroless nickel bumps with a height of 265 mu m have been selectively formed on aluminium bondpads. The nickel bumps have been inner-lead-bonded by gang bonding to a tape with a thick layer of tin. The adhesion of the bumps was investigated as a function of the pretreatment of the bondpads. It is noted that electroless bumping offers the greatest advantage of reducing the costs of the bumping process because no sputtering equipment or lithography is required. This can be very important if only small quantities of bumped dies are required because the process is independent of substrate size. Electroless bumping may become an alternative to conventional wafer bumping by electrodeposition at least for certain applications.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114988339","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 43
Thermosonic gold-ball bond accelerated life test 热超声金球键加速寿命试验
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122226
T. Hund
{"title":"Thermosonic gold-ball bond accelerated life test","authors":"T. Hund","doi":"10.1109/ECTC.1990.122226","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122226","url":null,"abstract":"Accelerated aging tests on gold-ball bonds in hermetic packages have been conducted at 350 degrees C, 300 degrees C, 250 degrees C, and 200 degrees C to determine time to failure, activation energy of failure, and the electrical/mechanical degradation at failure. Four different aluminium/1% silicon metallizations were tested: evaporated metal with P-glass (passivation-glass) contamination, evaporated metal with no P-glass contamination, sputtered metal with P-glass contamination, and sputtered metal with no P-glass contamination. The measured activation energies were from 0.4 to 1.1 eV. Two failure modes were encountered; one was an electrical open with good mechanical strength, and the second was an electrical open that resulted from a premature ball lift caused by voiding under the ball bond. The projected time to failure using an Arrhenius plot indicated that the functional life of gold-ball bonds can exceed 20 yr at ambient temperature if the wire-bonder setup is optimized and the contamination level is low.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123555098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Development of robust hybrids for smart skin avionics 为智能皮肤航空电子设备开发健壮的混合动力
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122179
T. L. Thomas
{"title":"Development of robust hybrids for smart skin avionics","authors":"T. L. Thomas","doi":"10.1109/ECTC.1990.122179","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122179","url":null,"abstract":"The author presents the conceptualization of robust hybrids which are conformally integrated onto aircraft structure for structural health monitoring applications. The robust hybrid concept exhibits high-performance signal processing and uses advanced hybrid packaging technologies to satisfy conformal integration requirements. The author also discusses the basic issues and requirements of smart skin avionics. The predominant issues of smart skin avionics integration include the thermal management, interconnects and mechanical attachment of modular avionics onto aircraft structure. It is concluded that the development of robust hybrids for sensor processing could introduce smart skins technologies to future avionics systems.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125672124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Corrosion of the joining metallurgy in multilayer substrates during processing 多层基板的连接冶金在加工过程中的腐蚀
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122173
A. Kumar
{"title":"Corrosion of the joining metallurgy in multilayer substrates during processing","authors":"A. Kumar","doi":"10.1109/ECTC.1990.122173","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122173","url":null,"abstract":"Difficulties encountered with respect to solder wettability and the ability of gold wire to bond to nickel-and-gold plated, thick-film, molybdenum bonding pads were traced to stains observed on the pads after the plating processes. These strains were, in turn, found to be due to galvanic corrosion occurring during processing. The mechanism of stain formation is explained in terms of the lowered ability of nickel to passivate itself upon alloying with molybdenum during the diffusion step following nickel plating, the pitting nature of the corrosion cell, and the insolubility of the corrosion product.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123779449","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Engineering change (EC) technology for thin film metallurgy on polyimide films 聚酰亚胺薄膜冶金的工程改造技术
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122220
S. Ray, K. Seshan, M. Interrante
{"title":"Engineering change (EC) technology for thin film metallurgy on polyimide films","authors":"S. Ray, K. Seshan, M. Interrante","doi":"10.1109/ECTC.1990.122220","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122220","url":null,"abstract":"Engineering change in multichip modules such as the IBM Thermal Conduction Module (TCM) requires making new nets on the top surface of the module. This is done either to repair opens or shorts in the internal nets or to correct design errors. Since the trend in multichip packaging in the high end is towards thin-film wiring with polyimide as the dielectric, wire-bond and laser delete processes compatible with thin-film metallurgy on polyimide films are required to carry out engineering change. The authors describe the results of a technology-development effort to optimize these processes on a metal/polyimide thin-film structure.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116029912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
GaAs multichip module for a parallel processing system 用于GaAs多芯片并行处理系统的模块
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122246
T. Miyagi, K. Itoh, S. Kimijima, T. Sudo
{"title":"GaAs multichip module for a parallel processing system","authors":"T. Miyagi, K. Itoh, S. Kimijima, T. Sudo","doi":"10.1109/ECTC.1990.122246","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122246","url":null,"abstract":"A high-speed data transfer network for a parallel processing system has been developed on the basis of multichip packaging technology. The high-speed data transfer network connecting multiple processor units (PUs) has been achieved in a module using 8 bit-slice GaAs bus logic (BL) LSIs operating at 100 MHz. The GaAs multichip module consists of 12 GaAs BL LSIs in a 3*4 matrix. Each GaAs chip is sealed in a chip carrier with bumps. The chip carrier is flip-chip bonded to the copper/polyimide thin-film multilayer substrate. The characteristic impedance of the signal lines on the module is controlled to 75 Omega to be compatible with the GaAs original interface level. The thin-film termination resistors are made of Ni/Cr in the substrate to prevent reflections. A total power dissipation of 90 W of the module was efficiently radiated by a newly developed heat-pipe cooling module at 2-m/s air flow velocity with low acoustical noise. the total thermal resistance from the chip to the ambient medium was approximately 3 degrees C/W. A 3-Gb/s data transfer rate (32 b*100 MHz) can be realized by four stacked modules of 48 GaAs BLs.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"129 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120867945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Solder-glass attachment in Cerdip/Cerquad packages: thermally induced stresses and mechanical reliability Cerdip/Cerquad封装中的焊接玻璃附件:热致应力和机械可靠性
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122315
E. Suhir, B. Poborets
{"title":"Solder-glass attachment in Cerdip/Cerquad packages: thermally induced stresses and mechanical reliability","authors":"E. Suhir, B. Poborets","doi":"10.1109/ECTC.1990.122315","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122315","url":null,"abstract":"The authors discuss the major requirements for the mechanical properties of solder glasses and ceramics in cerquad flat packages (CQFP) and develop a simple and easy-to-use stress-evaluation model aimed at assessing thermal stresses in the glass seals of ceramic packages. The authors also demonstrate how a probabilistic approach can be applied to ensure low and compressive stresses in the glass seals, and describe the results of qualification tests for the CQFP packages. For a reliable solder glass seal in a hermetic ceramic package, it is recommended that the same material be used for all the ceramic components and that the coefficient of thermal expansion of this material be close and somewhat larger than the coefficient of thermal expansion of the solder glass, especially at low temperatures, when the expected thermally induced stresses are the greatest. It is also important that the sealing be performed at the lowest possible temperature and that the solder glass material possess high fracture toughness, high strain-to-failure, good shock resistance, low Young's modulus, and good adhesion with ceramics.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124100584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 38
Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates tce不匹配基板上SMT焊点温度循环寿命的预测
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122224
D. Riemer
{"title":"Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates","authors":"D. Riemer","doi":"10.1109/ECTC.1990.122224","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122224","url":null,"abstract":"A method for the prediction of solder-joint cycle life in surface-mount assemblies is presented. It is based on the conversion of plastic solder shear strain into cycle life with an equation derived by W. Engelmaier (1983). The shear strain is normally calculated from temperature and TCE (thermal coefficient of expansion) differentials between the package and interconnect board without consideration of elastic deformations. The suggested method derives the average plastic shear strain of the solder joint at the maximum temperature excursion from the finite-element analysis of a simple model that consists of the interconnect board, a solder joint, and the package. All materials in the model have linear (elastic) properties, except solder, which has nonlinear (elastic/plastic) characteristics. The solder joint is modeled as single finite element so that only one value is computed for the plastic shear strain in the solder joint. This value represents the average shear strain, which is converted into solder-joint cycle life. The cycle life predictions with the finite-element method are confirmed by cycling results obtained on actual hardware.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124103987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 38
Mateability of tin to gold, palladium, and silver 锡与金、钯和银的相容性
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122287
E. Bock
{"title":"Mateability of tin to gold, palladium, and silver","authors":"E. Bock","doi":"10.1109/ECTC.1990.122287","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122287","url":null,"abstract":"It is shown experimentally that tin in combination with itself, as well as with gold, palladium, or silver is susceptible to fretting corrosion. Rates of degradation depend upon the metals in contact and upon the state and type of lubrication. In both the clean and lubricated state, the degradation of tin-to-gold and tin-to-palladium would be considered worse than tin-to-tin. The performance of tin-to-silver is slightly better than tin-to-tin. Antifretting contact lubricant formulations are preferred to antiwear contact lubricants. A proprietary formulation is shown to be very effective in stabilizing contact resistance for the tin-to-tin and tin-to-silver combinations. However, increases in contact resistance (on the order of five times the initial values) for the tin-to-gold and tin-to-palladium interfaces demonstrate that such combinations should not be encouraged for critical circuit applications in environments where fretting reactions are likely.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126365781","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Area-distributed-soldering of flexible and rigid printed circuit boards 柔性和刚性印刷电路板的区域分布焊接
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122219
W. Clark, W. Pelosi
{"title":"Area-distributed-soldering of flexible and rigid printed circuit boards","authors":"W. Clark, W. Pelosi","doi":"10.1109/ECTC.1990.122219","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122219","url":null,"abstract":"A novel design/process is described which facilitates area-distributed soldering of a flexible-printed-circuit to a circuit pack in an inspectable and repairable manner. In the design, solder joints are formed between surface-mount pads on a rigid printed-circuit-board and plated-through-holes on a flexible-printed-circuit. The joints are formed by heating both the flexible-printed-circuit and the printed-circuit-board to reflow temperatures and then allowing solder which has been deposited on the surface mount pads to rise through the plated-through-holes. Because solder rises up through the plated-through-holes to the exterior surface of the flexible-printed-circuit, spherical solder caps are clearly visible and inspectable. Solder joints are also easily repaired since the flexible-printed-circuit can be reheated to reflow one or all the solder joints. Two connector designs being used in AT&T products which employ area-distributed soldering of flex are discussed.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124399425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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