Power electronic devices and components最新文献_第9页

Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element Analysis 基于加速力学测试和有限元分析的焊点寿命建模

Power electronic devices and components Pub Date : 2023-03-01 DOI: 10.1016/j.pedc.2023.100034

M. Lederer, A. Betzwar Kotas, G. Khatibi

{"title":"Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element Analysis","authors":"M. Lederer, A. Betzwar Kotas, G. Khatibi","doi":"10.1016/j.pedc.2023.100034","DOIUrl":"https://doi.org/10.1016/j.pedc.2023.100034","url":null,"abstract":"<div><p>Solder fatigue is among the predominant failure modes observed in power electronic modules. Under service conditions power electronic parts are exposed to repeated temperature swings originating from resistance heating. In consequence of a mismatch of the coefficients of thermal expansion, thermomechanical stresses are generated at material interconnects. Nevertheless, lifetimes of up to 30 years are requested for high reliability applications. Therefore, there is a demand for accelerated testing methods. However, due to strain rate dependence of inelastic deformations theoretical lifetime modeling is necessary to compare the results of accelerated test methods with usual service conditions. The present study reports on a mechanical testing method operating at the ultrasonic frequency of 20 kHz. During testing samples are exposed to repeated bending deformations until the solder joint finally breaks. The number of cycles to crack initiation is determined for different temperatures ranging from room temperature to 175 °C. Thereafter, an FEM computer simulation of the fatigue experiment is performed, where the visco-plastic Anand model serves as material model of the solder. The time to crack initiation in the solder is evaluated with a model of damage accumulation, which combines the Coffin-Manson model with a multiaxial version of the Goodman relation. It is demonstrated that this model can be applied to the solder alloys PbSnAg, Sn3.5Ag and SnSbAg.</p></div>","PeriodicalId":74483,"journal":{"name":"Power electronic devices and components","volume":"4 ","pages":"Article 100034"},"PeriodicalIF":0.0,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49776581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Layer-by-layer printable nano-scale polypropylene for precise control of nanocomposite capacitor dielectric morphologies in metallised film capacitors 逐层可印刷纳米级聚丙烯用于精确控制金属化薄膜电容器中纳米复合电容器的介电形态

Power electronic devices and components Pub Date : 2023-01-01 DOI: 10.1016/j.pedc.2022.100025

William Greenbank, Thomas Ebel

引用次数: 2

Lifetime modelling of solder joints based on accelerated mechanical testing and Finite Element Analysis 基于加速力学试验和有限元分析的焊点寿命建模

Power electronic devices and components Pub Date : 2023-01-01 DOI: 10.1016/j.pedc.2023.100034

M. Lederer, A. Kotas, G. Khatibi

引用次数: 0

Advantages of the Extended Finite Element Method for the Analysis of Crack Propagation in Power 扩展有限元法在动力裂纹扩展分析中的优势

Power electronic devices and components Pub Date : 2022-11-01 DOI: 10.1016/j.pedc.2022.100027

K. Nwanoro, Hua Lu, C. Yin, C. Bailey

引用次数: 4

A self-powered H-Bridge joule theory circuit for piezoelectric energy harvesting systems 用于压电能量收集系统的自供电h桥焦耳理论电路

Power electronic devices and components Pub Date : 2022-10-01 DOI: 10.1016/j.pedc.2022.100015

Mahesh Edla , Mikio Deguchi , Yee Yan Lim

{"title":"A self-powered H-Bridge joule theory circuit for piezoelectric energy harvesting systems","authors":"Mahesh Edla , Mikio Deguchi , Yee Yan Lim","doi":"10.1016/j.pedc.2022.100015","DOIUrl":"10.1016/j.pedc.2022.100015","url":null,"abstract":"<div><p>In this paper, investigation of high direct current/voltage (DC) and power gains using H-Bridge joule theory (HBRJT) circuit with an input voltage of alternating current/voltage (AC) is carried out by avoiding higher switching frequency and additional switches for piezoelectric energy harvesting (PEH) systems. The interventions of the proposed HBRJT circuit delineate the boost conversion topology from AC that is generated by the piezoelectric generator (PG) as a result of the excitation into DC and eliminates the usage of additional switches, inductors, capacitors, duty cycles that result in higher output DC voltage. The proposed topology integrates the implications of both the H-Bridge and joule theory circuits. One additional feasibility of the proposed circuit is that it does not require an additional power supply to trigger the switches. In order to validate the effectiveness of the HBRJT circuit, both simulation and experimental results were presented. In the experiment, a series of testing scenarios were carried out, namely varying the frequency with fixed input voltage and cold start-up at a high frequency. The outcome of the proposed circuit is compared with the conventional H-Bridge, Dual-stage H-Bridge (DSHBR) and literature circuits. When contrasted to H-Bridge DSHBR circuits, the proposed circuit significantly boosts the input low AC voltage into high DC voltage. In addition, compared to structures with an H-Bridge, DSHBR, and literature circuits, the HBRJT circuit is more feasible to achieve supposed voltage and power gains without duty cycles and auxiliary circuits.</p></div>","PeriodicalId":74483,"journal":{"name":"Power electronic devices and components","volume":"3 ","pages":"Article 100015"},"PeriodicalIF":0.0,"publicationDate":"2022-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2772370422000128/pdfft?md5=7abb8fc559932a7ef2a067856bb52e62&pid=1-s2.0-S2772370422000128-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44564287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Printed circuit board embedded power semiconductors: A technology review 印刷电路板嵌入式功率半导体:技术综述

Power electronic devices and components Pub Date : 2022-10-01 DOI: 10.1016/j.pedc.2022.100017

Till Huesgen

{"title":"Printed circuit board embedded power semiconductors: A technology review","authors":"Till Huesgen","doi":"10.1016/j.pedc.2022.100017","DOIUrl":"10.1016/j.pedc.2022.100017","url":null,"abstract":"<div><p>Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection resistances and parasitic inductances. Both contribute to a higher system-level efficiency, as conduction and switching losses are reduced. Moreover, the use of thick Cu substrates allows efficient heat removal, due to a low thermal resistance. Therefore, PCB embedding has received a lot of attention in the power electronics community for more than a decade. This article aims to provide a comprehensive review of the scientific literature on the topic ranging from basic fabrication technology over module or system-level demonstrators for electrical and thermal testing to reliability studies. Performance indicators, such as the commutation loop inductance <em>L<sub>σ</sub></em>, the chip area independent thermal resistance <em>R<sub>th</sub> × A<sub>chip</sub>,</em> allow a comparison of different approaches and benchmarking with conventional power modules. Several publications report stray inductances below 1 nH and chip area independent thermal resistances in the range of 20…30 mm²K/W.</p></div>","PeriodicalId":74483,"journal":{"name":"Power electronic devices and components","volume":"3 ","pages":"Article 100017"},"PeriodicalIF":0.0,"publicationDate":"2022-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2772370422000141/pdfft?md5=62be0d548740f5708a69b23538553d0e&pid=1-s2.0-S2772370422000141-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42279040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Single terminal and double terminal coil shape analysis using capacitive power transmission for biomedical implant 生物医学植入体电容式功率传输的单端和双端线圈形状分析

Power electronic devices and components Pub Date : 2022-10-01 DOI: 10.1016/j.pedc.2022.100010

Yen Po Wang, Shin'ichi Warisawa

引用次数: 0

Zero-ventilated self-cooled induction heating device: Topology and component engineering 零通风自冷感应加热装置:拓扑学与元件工程

Power electronic devices and components Pub Date : 2022-10-01 DOI: 10.1016/j.pedc.2022.100013

Arun Kumar Paul

{"title":"Zero-ventilated self-cooled induction heating device: Topology and component engineering","authors":"Arun Kumar Paul","doi":"10.1016/j.pedc.2022.100013","DOIUrl":"10.1016/j.pedc.2022.100013","url":null,"abstract":"<div><p>Due to its non-contact mode of power transfer, the induction heating principle is favorably used in the packaging industry for sealing of wide range plastic and glass containers. In cap sealing, the power transferred to thin aluminum foil is used to create a bond between the foil and the lip of the bottle. The process ambiance for sealing bottles containing different types of products could be different. Dust prone environment prevailing for sealing coffee, nutraceuticals, several pharma products, etc. recommends the use of an air-tight enclosure. Likewise, to avoid water particles entering the enclosure during its frequent cleaning of exterior surfaces, packaging solutions for the dairy industry need water-tight enclosures. The process ambiance and nature of products are such that those power controllers would increasingly be housed in IP 65 enclosures. The air movement inside i.e., the free convection is restricted. To make the controller inherently self-cooled, this research proposes to make the internal convection effective by creating requisite buoyant force through proper choice of power converter topology where component engineering would also play important role. This article details that the choice of topology should not only reduce the power loss, it would also be useful for loss distribution. It further details that the choice of components is critical to ensure effective internal air movement for reliable operation of the controller. The proposed idea has been validated by designing a 1.5 kW, 47 kHz power controller housed in a zero ventilated enclosure that also includes the coil head.</p></div>","PeriodicalId":74483,"journal":{"name":"Power electronic devices and components","volume":"3 ","pages":"Article 100013"},"PeriodicalIF":0.0,"publicationDate":"2022-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2772370422000104/pdfft?md5=40877ce1c35b14e96983d1feb50359ec&pid=1-s2.0-S2772370422000104-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41326229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electromagnetic analysis of switching cells with dies embedded in printed circuit boards: Application to TAPIR (compacT and modulAr Power modules with IntegRated cooling) technology 印刷电路板内嵌模具开关电池的电磁分析:在TAPIR(集成冷却的紧凑模块化电源模块)技术中的应用

Power electronic devices and components Pub Date : 2022-10-01 DOI: 10.1016/j.pedc.2022.100022

W-F. Bikinga, Y. Avenas, K. Alkama, B. Mezrag, J-M. Guichon, J-L. Schanen

{"title":"Electromagnetic analysis of switching cells with dies embedded in printed circuit boards: Application to TAPIR (compacT and modulAr Power modules with IntegRated cooling) technology","authors":"W-F. Bikinga, Y. Avenas, K. Alkama, B. Mezrag, J-M. Guichon, J-L. Schanen","doi":"10.1016/j.pedc.2022.100022","DOIUrl":"10.1016/j.pedc.2022.100022","url":null,"abstract":"<div><p>The TAPIR technology (compacT and modulAr Power modules with IntegRated cooling) requires a multiphysics analysis to prove its interest compared to current power module solutions. To contribute to this objective, this paper focuses on magnetic aspects and, more specifically, on stray inductance evaluation. Through simulation and experimental studies, it is shown that stray inductances close to 1nH can be obtained. Several design aspects are also studied: the presence of inner layers in the PCB and the decoupling capacitors arrangement. Furthermore, the magnetic interactions between switching cells is studied by simulations and experiments. It is shown that the presence of an adjacent cell reduces slightly the stray inductance (max 20%). In the case of paralleled switching cells, it is also demonstrated that an alternated position of DC link heat sinks can induce a 30% reduction of the stray inductance.</p></div>","PeriodicalId":74483,"journal":{"name":"Power electronic devices and components","volume":"3 ","pages":"Article 100022"},"PeriodicalIF":0.0,"publicationDate":"2022-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2772370422000190/pdfft?md5=1fbec65a294adc35222aaf2aaddd401a&pid=1-s2.0-S2772370422000190-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42540092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thick gate oxide extrinsic breakdown - the potential role of neutral hydrogen atom. 厚栅氧化物本征击穿-中性氢原子的潜在作用。

Power electronic devices and components Pub Date : 2022-10-01 DOI: 10.2139/ssrn.4218073

K. Cheung

引用次数: 2