2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)最新文献_第7页

Dry Etched Through SiC Via (TSiCV) Process Analysis Using DOE Modeling 基于DOE模型的干蚀刻SiC通孔工艺分析

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315121

P. Mackowiak, M. Schiffer, Martin Scheider-Ramelow, K. Lang

引用次数: 0

Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies 晶圆级细间距杂化键合:挑战与补救

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315002

V. Chidambaram, Yew Wing Leong, Qin Ren

引用次数: 5

Frequency Domain Methodology for Evaluating Signal Integrity Performance of Logic to Logic and HBM Interconnect Models for Chiplet Packaging 芯片封装中逻辑对逻辑和HBM互连模型信号完整性性能评估的频域方法

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315036

Li Kangrong, M. D. Rotaru

{"title":"Frequency Domain Methodology for Evaluating Signal Integrity Performance of Logic to Logic and HBM Interconnect Models for Chiplet Packaging","authors":"Li Kangrong, M. D. Rotaru","doi":"10.1109/EPTC50525.2020.9315036","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315036","url":null,"abstract":"A novel methodology to evaluate the signal integrity (SI) performance of logic to logic and high bandwidth memory (HBM) interconnect model for chiplet packaging is proposed. Compared with the traditional S parameters and eye diagram analyses, the proposed methodology reflects the actual SI performance under the capacitive termination condition, takes much shorter simulation time and provides more insightful SI evaluation, which is suitable for logic to logic and HBM interconnect design and optimization. The S parameters analysis are not sufficient for the cases like logic to logic and HBM interconnect models, which are unterminated (capacitive loading). The eye diagram analysis cannot provide an insightful guideline for optimization of interconnect model. Besides, eye diagram simulations to find the optimum interconnect model are very time consuming, as a frequency domain to time domain via an inverse fast Fourier transformation (FFT) is required. Compared with the eye diagram analysis, the proposed methodology only analyses the SI performance in frequency domain rather than in time domain, so the simulation time is reduced. The proposed methodology can overcome the drawbacks of the S parameters and eye diagram analyses and provide an in-depth and fast evaluation on the SI performance of logic to logic and HBM interconnect models frequently encountered in advanced system in package using chiplets.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"100 1","pages":"147-151"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84267022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Characterization of 2.5D FCBGA for GPU Application GPU用2.5D FCBGA热特性研究

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315035

Tang-Yuan Chen, Bing-Yuan Huang

{"title":"Thermal Characterization of 2.5D FCBGA for GPU Application","authors":"Tang-Yuan Chen, Bing-Yuan Huang","doi":"10.1109/EPTC50525.2020.9315035","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315035","url":null,"abstract":"2.5D Integrated Circuit package is very important for high- performance applications. The shrinkage in package size, cost reduction and improving thermal performance are driving the development of 2.5D Integrated Circuit. The development of 2.5D technology faces the challenge of thermal path and new structure. The present study applied three-dimensional finite volume methods to simulate the thermal behavior and the allocation of hot spots in the 2.5D package. The results of molding analysis revealed that the thermal resistance between molding/non-molding and expose-die packaging would influence the manufacturability and reliability of the package. In order to reduce the thermal resistance of package and the die to die integration, a design monitoring the installation ratio between package and substrate were investigated. The results of simulation indicate that the power map is non-uniform. The hot spot occurs as the ratio of die/power is over 25 %. The designs of implementing a shielding of ASIC/HBM and interconnect structure of package/substrate improve the maximum power of 2.5D FCBGA about 35~40%. The results of numerical analysis indicate that the above mentioned advance 2.5D IC structure design would lead to better thermal dissipation. The enhancements in the thermal dissipation behaviors are ascribed to the thermal path and the appropriate hot spot location layout. The 2.5D Integrated Circuit package mechanism and the design guidance for engineering application will be presented and discussed in this paper.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"14 1","pages":"479-482"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74884142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Washability of Flexible Printed Circuitry for Wearable Electronics Applications 可穿戴电子应用中柔性印刷电路的可洗性

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315138

B. Salam, G. Soo, X. Shan, B. Lok

{"title":"Washability of Flexible Printed Circuitry for Wearable Electronics Applications","authors":"B. Salam, G. Soo, X. Shan, B. Lok","doi":"10.1109/EPTC50525.2020.9315138","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315138","url":null,"abstract":"Wearable electronics are predicted to be 60 billion dollars market by 2024, according to the recent 2020 International Data Corporation (IDC) news. Textile substrates are typically porous and hence the fabrication of electronic circuitry is by heat-transferred which initially was printed on a non-porous substrate such as heat transfer polymer (HTP). Such a fabrication process paved the way for developing new smart clothes. However, most of the developed smart wear clothes are still not practical as they cannot be washed. Therefore, in this study, the effect of the washing, such as water immersion and mechanical stress/bending, towards printed circuitries will be investigated. The test vehicles are silver and carbon circuitries on HTP-polyester and polyethylene terephthalate (PET)-based substrates. The test vehicle on PET serves as a reference. The test vehicles include printed heater patches. The heater patch consists of printed carbon in a rectangle shape and printed silver lines on the two sides. The resistance values of the circuitries were monitored before and after twisted and immersed in water. The results indicate that the effect of water immersion is significant. The resistive value in water could increase up to 12% and 2% for HTP and PET-based test vehicles, respectively. However, the increase in resistance is temporary.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"35 1","pages":"207-209"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88873045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Electrical characterization and design of hyper-dense interconnect on HD-FOWLP for die to die connectivity for AI and ML accelerator applications 用于AI和ML加速器应用的模具间连接的HD-FOWLP上高密度互连的电气特性和设计

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315178

M. D. Rotaru, Li Kangrong

{"title":"Electrical characterization and design of hyper-dense interconnect on HD-FOWLP for die to die connectivity for AI and ML accelerator applications","authors":"M. D. Rotaru, Li Kangrong","doi":"10.1109/EPTC50525.2020.9315178","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315178","url":null,"abstract":"High Density Fan Out Wafer Level Package (HD-FOWLP) can be an alternative for technologies such as Embedded Multi-Die Interconnect Bridge (EMIB) and silicon interposer to achieve heterogeneous integration for applications that requires ultra-high bandwidth for die to die communications. This work focusses on the electrical characteristics of this type of interconnect and explains why the metrics based on S-parameters regularly used for designing and qualifying interconnects on substrates and PCBs are not enough and may be misleading in this case. With the lines cross-sectional dimensions of, 1umx1um and respectively and Nyquist frequency around 1GHz, some of these lines operate at the onset of skin effect, with per-unit-length resistance and inductance undergoing severe dispersion. This is very different from signals routed as thicker and wider traces on an organic package, where the skin effect develops at much lower frequencies. It is also different from the on-die signal routing, where RC is an adequate model of the signal interconnect. Simulation examples of different interconnect structures and layouts are presented to support the findings reported here.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"16 1","pages":"430-434"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90245574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Power Module on Copper Lead Frame with Novel Sintering Paste and SnSb solder 新型烧结浆料和SnSb焊料的铜引线框架电源模块

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315011

L. Wai, Kazunori Yamamoto, Simon Lim Siak Boon, T. Yue

引用次数: 3

Dual-band one-sided directional slot array antenna for 10GHz and 24GHz application 用于10GHz和24GHz应用的双频单面定向槽阵天线

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315070

Y. Yamashita, H. Kanaya

引用次数: 3

900 MHz ISM Band RF Energy Harvester for Powering ZigBee Module 用于ZigBee模块供电的900 MHz ISM频段射频能量采集器

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315076

M. Mansour, Shuya Yamamoto, M. Murakami, H. Kanaya

{"title":"900 MHz ISM Band RF Energy Harvester for Powering ZigBee Module","authors":"M. Mansour, Shuya Yamamoto, M. Murakami, H. Kanaya","doi":"10.1109/EPTC50525.2020.9315076","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315076","url":null,"abstract":"ZigBee wireless communication is used for data transmission between two entities. The power consumption of the unit might fall below a few mW. This energy can be provided by using the RF energy harvesting to wirelessly charge a supercapacitor mounted along with the device architecture. The proposed research work offers a significant solution for the battery replacement and tedious work of the circuit maintenance. A rectenna operating at 920 MHz frequency band is used to charge the supercapacitor with high energy levels that can reach up to a few orders of mW. The harvested energy is rectified by a voltage doubler rectifier configuration. The circuit performance is evaluated, tested, and validated to show the agreement between simulation and measurement data. The system shows that the rectenna can provide at least 3 V for the sustainable operation of the ZigBee module. The connection is programmed to initialize every 5-10 seconds so the supercapacitor can re-charge back to the full capacity. The circuit is experimentally tested for continuous operation in a real environment for more than 24 hours.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"74 1","pages":"156-158"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83217523","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions 动态湿度条件下MEMS传感器变形特性的数值分析

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI: 10.1109/EPTC50525.2020.9315091

Mahesh Yalagach, P. Fuchs, T. Antretter, Tao Qi, Markus Weber

{"title":"Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions","authors":"Mahesh Yalagach, P. Fuchs, T. Antretter, Tao Qi, Markus Weber","doi":"10.1109/EPTC50525.2020.9315091","DOIUrl":"https://doi.org/10.1109/EPTC50525.2020.9315091","url":null,"abstract":"Micro Electro Mechanical Semiconductors (MEMS) functionalities have been continuously extended during the last years, and they are applied in a wide range of industrial sectors, including the automotive, consumer electronics, and Internet of Things (IoT) markets. These MEMS sensor packages are a multi-materials composite system. The composite materials involved in MEMS sensor packages show significant effects like thermal expansion and hygroscopic swelling when exposed to environmental loads like temperature and moisture. Due to these effects, the MEMS sensing performance is affected. To understand the effects on sensing performance and mechanical behavior, an advanced simulation approach, “hygro-thermo-mechanical simulation,” needs to be accounted for. This approach considers not only the dynamic changes in temperature and moisture loads but also generalized solubility, which is a function of both temperature and saturated mass concentration. This numerical model helps in optimizing and understanding the sensing performance of the MEMS sensor packages.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"12 1","pages":"380-385"},"PeriodicalIF":0.0,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83923168","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0