Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Abstract

Micro Electro Mechanical Semiconductors (MEMS) functionalities have been continuously extended during the last years, and they are applied in a wide range of industrial sectors, including the automotive, consumer electronics, and Internet of Things (IoT) markets. These MEMS sensor packages are a multi-materials composite system. The composite materials involved in MEMS sensor packages show significant effects like thermal expansion and hygroscopic swelling when exposed to environmental loads like temperature and moisture. Due to these effects, the MEMS sensing performance is affected. To understand the effects on sensing performance and mechanical behavior, an advanced simulation approach, “hygro-thermo-mechanical simulation,” needs to be accounted for. This approach considers not only the dynamic changes in temperature and moisture loads but also generalized solubility, which is a function of both temperature and saturated mass concentration. This numerical model helps in optimizing and understanding the sensing performance of the MEMS sensor packages.