2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)最新文献

Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications 电容耦合互连应用中电容耦合焊盘分配的联合仿真

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117216

Sheng-Feng Hsiao, Ming-Kun Chen, Yi-Lung Lin, Yu-Jung Huang, S. Fu

{"title":"Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications","authors":"Sheng-Feng Hsiao, Ming-Kun Chen, Yi-Lung Lin, Yu-Jung Huang, S. Fu","doi":"10.1109/IMPACT.2011.6117216","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117216","url":null,"abstract":"Three dimensions packaging provides a very promising technology for the effective integration of complex systems: devices that are optimally implemented with various different technologies can be separately manufactured and then stacked and connected by means of efficient vertical interconnections over a very short range; this provides most of the benefits of inter-chips for high-bandwidth with a reasonable cost and short development time in the advance of CMOS processes and assembly. This study presents the co-simulation of capacitive coupling pads assignment for the capacitive coupling interconnection. The modelling of a close capacitive coupling interconnection pad is represented by a lumped circuit. The coupling pads of parasitic capacitance are one of the parasitic parameters. The FEM (finite element method) tools simulation results show that the effect of cross-coupling between adjacent channels is dependent on substrate characteristic and pads arrangement. A comparison between simulated and measured circuit performance was shown for a RLC-elements, and qualitative accuracy was obtained. HSPICE tools are applied for the circuit simulations using the equivalent model of coupling pads. Based on the findings of this work, co-simulation methods can reduce simulation time dramatically, the coupling pads assignment can be translated to HSPICE model.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"8 1","pages":"347-350"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72753865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components 电子元件寿命评估中单独热循环、振动试验与组合试验的比较

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117152

Y. S. Chen, Yang-Sin Lee, Yu-Cheng Lin

引用次数: 2

Total system power minimization of microprocessors using refrigerated systems for electronic cooling 使用制冷系统进行电子冷却的微处理器的总系统功率最小化

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117155

Won Ho Park, Ron McCall, C. K. Yang

{"title":"Total system power minimization of microprocessors using refrigerated systems for electronic cooling","authors":"Won Ho Park, Ron McCall, C. K. Yang","doi":"10.1109/IMPACT.2011.6117155","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117155","url":null,"abstract":"Power dissipation and thermal problems have become a growing issue for scaled technology. This phenomenon drives the need for advance cooling systems. It is well-known that cooling the operating temperature results in reduced electric power and/or speed gains. Since cooling cost penalizes the total power, a refrigeration system is developed and experimentally tested to demonstrate that cooling the high performance microprocessor can lead to overall system power improvement. A processor that dissipates 175.4W of maximum power with 30% electronic leakage power operating at 97°C is cooled using our refrigeration system. Measurements show that with a minimum refrigeration COP of 2.7, the processor operates with junction temperature <40°C and offers a 25% total system power reduction over the non-refrigerated design. This experiment is the first demonstration of active cooling that lead reduced total wall power. With an improved compressor that maintains the COP across a broad range of cooling capacity, our analysis shows that at least >13% of total power is saved across the entire range of processor utilization.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"26 1","pages":"242-245"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85703856","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced high density interconnection substrate for mobile platform application 用于移动平台应用的先进高密度互连基板

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117163

C. Romero, Seungwook Park, Y. Kweon, M. Park

{"title":"Advanced high density interconnection substrate for mobile platform application","authors":"C. Romero, Seungwook Park, Y. Kweon, M. Park","doi":"10.1109/IMPACT.2011.6117163","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117163","url":null,"abstract":"The faster market trend towards smart phones with more advanced computing ability and connectivity will drive the greater need to incorporate more functionality in smaller space by integrating more components and functional blocks into convergent systems in form of chip-level (SOC) or die-level (SIP) packaging. As feature size continues to shrink, it requires combination of stringent design requirements which all interact in order to achieve the desired performance. Also, various limitations will arise in the design of the PCB in terms of size and signal integrity. The substrate or PCB plays critical role in the miniaturization of the overall system and the final application's electrical performance. Given the extreme routing requirement of each component package with high I/O pins and fine pitch area array, the conventional HDI substrate pose some design challenges and limitations. In order to increase the routing density, it often requires smaller trace width and micro via diameter and even the need of adding more metal layers. These, however, will dramatically increase the cost and more reliability risk is expected. In this paper, we present a new generation substrate that could meet the mobile platform requirement by proposing an advanced ultra fine metal resolution substrate. It will demonstrate its high density interconnect capability in a basic 4-layer stack-up structure. One of its advanced features is the ability to adjust board and interconnection impedance in order to optimize signal integrity and more routing capability for dense mobile platform layouts. It will also demonstrate that organic-based substrate may also achieve tighter routing density using limited number of metal layers at smaller and thinner form factor while maintaining the desired signal integrity performance as compared to conventional 8-layer or 10-layer HDI PCBs. Details of electrical simulation and measurement of electrical parameters are also presented and discussed.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"130 1","pages":"214-217"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84597129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Capability evaluation and validation of FC chip scale package structure FC芯片级封装结构的性能评估与验证

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117154

K. Liu, E. Chen, D. Lee, M. Ma

引用次数: 1

Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration 三维集成电路中硅通孔(tsv)非线性热应力分析及设计准则

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117209

M. Hsieh, Sheng-Tsai Wu, Wei Li, R. Tain, J. Lau, R. Lo, M. Kao

{"title":"Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration","authors":"M. Hsieh, Sheng-Tsai Wu, Wei Li, R. Tain, J. Lau, R. Lo, M. Kao","doi":"10.1109/IMPACT.2011.6117209","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117209","url":null,"abstract":"In this investigation, a set of empirical equations which predicts the maximum thermal stresses at the vicinity of a copper filled TSV for 3D IC integration has been proposed. The finite element model of a symmetrical single in-line TSV with redistribution layer has been created at first and the parametric study includes the TSV diameter, pitch, and thickness, and the thickness of SiO2 passivation and Cu seed layer. The methodology of design of experiments (DOE) has been adopted to deliver a set of empirical equations which captures the most important mechanical parameters of TSVs to comprehend the corresponding thermal stress and strain responses. Through this set of empirical equations, the estimated maximum thermal stresses and strains for different TSV diameter (from 10μm to 50μm) can be explained and the significant geometrical parameters can be easily observed. In addition, based on the present parametric study and results, a set of design guidelines for optimizing the mechanical performance of copper filled TSV in 3D IC integration has been proposed. These results are helpful to engineers if thermal stress solutions for TSVs in 3D IC integration are required.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"38 1","pages":"75-78"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86093030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Hot spot cooling in 3DIC package utilizing embedded thermoelectric cooler combined with silicon interposer 利用嵌入式热电冷却器结合硅中间层的3DIC封装的热点冷却

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117280

Sheng-Liang Li, Chung-Yen Hsu, Chun-Kai Liu, M. Dai, H. Chien, R. Tain

{"title":"Hot spot cooling in 3DIC package utilizing embedded thermoelectric cooler combined with silicon interposer","authors":"Sheng-Liang Li, Chung-Yen Hsu, Chun-Kai Liu, M. Dai, H. Chien, R. Tain","doi":"10.1109/IMPACT.2011.6117280","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117280","url":null,"abstract":"A novel design for hot spot cooling in 3DIC package by integrating the embedded thermoelectric cooler (ETC) is presented in this paper. The silicon (Si) interposer with through silicon vias (TSVs) was used as electrical paths for ETC and stacked on a Si chip that possesses a hot spot area on it. Finite element analysis (FEA) software ANSYS was utilized in present study to analyze the thermal performance. Three different structures: (1)TEC only, (2)TEC with copper ring and (3)copper spreader only were analyzed in present paper. The first two types are the novel designs and the third one is the traditional structure for thermal management in packaging. The dimensions of the Si chip and Si interposer are 5mm in length and width, and 100um in thickness, respectively. Three different sizes of hot spot area were adopted to investigate the cooling performance of each structure of package. Moreover, Si interposer used as an active device was also discussed. An improved novel design (second type: TEC with copper ring) was demonstrated from simulated results that provide the superior cooling performance to the other two structures.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"798 1","pages":"470-473"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91457949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

The solder joint reliability assessment of a wafer level CSP package 晶圆级CSP封装的焊点可靠性评估

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117252

K. Chung, Chih-Hao Tseng, Liyu Yang

{"title":"The solder joint reliability assessment of a wafer level CSP package","authors":"K. Chung, Chih-Hao Tseng, Liyu Yang","doi":"10.1109/IMPACT.2011.6117252","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117252","url":null,"abstract":"A WLCSP package consists of 2.2 × 2.2 mm2 silicon die, polyimide-based substrate, and 5 × 5 array of solder balls was used as the test vehicle to evaluate its solder joint reliability. Both package level tests with respect to precondition test, temperature cycling test, unbiased highly accelerated stress test (UHAST), and high temperature storage life (HTSL) test and board level tests regarding temperature cycling test have been included in the test plan. Two different lead free solder ball materials (SAC1205 vs. SAC105), under bump metallurgy (Ti/NiV/Cu vs. plated Cu), and die thicknesses (406 μm vs. 356 μm) were assessed. The test results for the package level assessment present that the test vehicle past criteria for all of these required tests. The test results of temperature cycling (−40°C ∼125°C) for the board level assessment show that these controlled variables have unlike performance in the solder joint reliability (SJR) of the WL-CSP package. The SAC105 shows better solder joint reliability performance than that of SAC1205 to provide 13 % improvement in characteristic life (Weibull distribution). The thick die (406 μm) shows statistically better SJR performance than that of thin die (356 μm) to sustain 10% increase in characteristic life (Weibull distribution). On the other hand, standard Ti/NiV/Cu UBM presents statistically equivalent SJR performance as plated Cu in characteristic life. As the results, package design factors of the solder alloy and die thickness play obvious roles in solder joint reliability compared to the factor of UBM. Generally speaking, the WL-CSP package presents appropriate solder joint reliability according to the test results.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"61 1","pages":"370-372"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80551615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced platform-level clock jitter and drift analysis 先进的平台级时钟抖动和漂移分析

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117157

Choupin Huang

引用次数: 0

Reliability of lead-free fine pitch BGA under thermal and mechanical impact 热和机械冲击下无铅细间距BGA的可靠性

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117166

Mingzhi Dong, Qian Wang, Jian Cai, Jinrui Li, Shuidi Wang

引用次数: 0