{"title":"Total system power minimization of microprocessors using refrigerated systems for electronic cooling","authors":"Won Ho Park, Ron McCall, C. K. Yang","doi":"10.1109/IMPACT.2011.6117155","DOIUrl":null,"url":null,"abstract":"Power dissipation and thermal problems have become a growing issue for scaled technology. This phenomenon drives the need for advance cooling systems. It is well-known that cooling the operating temperature results in reduced electric power and/or speed gains. Since cooling cost penalizes the total power, a refrigeration system is developed and experimentally tested to demonstrate that cooling the high performance microprocessor can lead to overall system power improvement. A processor that dissipates 175.4W of maximum power with 30% electronic leakage power operating at 97°C is cooled using our refrigeration system. Measurements show that with a minimum refrigeration COP of 2.7, the processor operates with junction temperature <40°C and offers a 25% total system power reduction over the non-refrigerated design. This experiment is the first demonstration of active cooling that lead reduced total wall power. With an improved compressor that maintains the COP across a broad range of cooling capacity, our analysis shows that at least >13% of total power is saved across the entire range of processor utilization.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"26 1","pages":"242-245"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2011.6117155","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Power dissipation and thermal problems have become a growing issue for scaled technology. This phenomenon drives the need for advance cooling systems. It is well-known that cooling the operating temperature results in reduced electric power and/or speed gains. Since cooling cost penalizes the total power, a refrigeration system is developed and experimentally tested to demonstrate that cooling the high performance microprocessor can lead to overall system power improvement. A processor that dissipates 175.4W of maximum power with 30% electronic leakage power operating at 97°C is cooled using our refrigeration system. Measurements show that with a minimum refrigeration COP of 2.7, the processor operates with junction temperature <40°C and offers a 25% total system power reduction over the non-refrigerated design. This experiment is the first demonstration of active cooling that lead reduced total wall power. With an improved compressor that maintains the COP across a broad range of cooling capacity, our analysis shows that at least >13% of total power is saved across the entire range of processor utilization.