2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
发文信息
历年影响因子
历年发表
投稿信息

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - 最新文献

Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications

Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117216 Sheng-Feng Hsiao, Ming-Kun Chen, Yi-Lung Lin, Yu-Jung Huang, S. Fu

Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components

Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117152 Y. S. Chen, Yang-Sin Lee, Yu-Cheng Lin

Total system power minimization of microprocessors using refrigerated systems for electronic cooling

Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117155 Won Ho Park, Ron McCall, C. K. Yang
查看全部
免责声明:
本页显示期刊或杂志信息,仅供参考学习,不是任何期刊杂志官网,不涉及出版事务,特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题,请联系我们,邮箱:info@booksci.cn,我们会认真核实处理。
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信