热和机械冲击下无铅细间距BGA的可靠性

Mingzhi Dong, Qian Wang, Jian Cai, Jinrui Li, Shuidi Wang
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引用次数: 0

摘要

本文通过热冲击试验和板级跌落试验,评价了细节距与普通节距BGA在热冲击和机械冲击条件下的性能差异。研究了焊球材料对PCB焊盘光洁度的影响。结果表明,钎料球距的减小会导致钎料易损性的增大。小螺距BGA在热应力或机械应力作用下更容易失效。Sn1.0Ag0.5Cu焊锡球与Cu-OSP PCB焊盘的组合在研究中优于其他测试组,推荐厂家使用。失效分析表明,在焊接回流过程中,钎料与钎料之间的金属间化合物内部或金属间化合物附近形成脆性裂纹是主要的失效机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability of lead-free fine pitch BGA under thermal and mechanical impact
In this paper, performance difference of fine pitch and normal pitch BGA under thermal and mechanical impact conditions has been evaluated by means of thermal shock test as well as board-level drop test. Influence of solder ball material and PCB pad finish was also investigated. The results reveal that decrease of solder ball pitch could lead to increase of vulnerability. Fine pitch BGA fails more rapidly subjected to thermal or mechanical stress. The combination of Sn1.0Ag0.5Cu solder ball and Cu-OSP PCB pad outperformed other testing groups in the research and is recommended for manufacturers. Failure analysis shows that dominant failure mechanism is brittle cracking within or near intermetallics formed between bulk solder and pad metal during soldering reflow process.
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