{"title":"晶圆级CSP封装的焊点可靠性评估","authors":"K. Chung, Chih-Hao Tseng, Liyu Yang","doi":"10.1109/IMPACT.2011.6117252","DOIUrl":null,"url":null,"abstract":"A WLCSP package consists of 2.2 × 2.2 mm2 silicon die, polyimide-based substrate, and 5 × 5 array of solder balls was used as the test vehicle to evaluate its solder joint reliability. Both package level tests with respect to precondition test, temperature cycling test, unbiased highly accelerated stress test (UHAST), and high temperature storage life (HTSL) test and board level tests regarding temperature cycling test have been included in the test plan. Two different lead free solder ball materials (SAC1205 vs. SAC105), under bump metallurgy (Ti/NiV/Cu vs. plated Cu), and die thicknesses (406 μm vs. 356 μm) were assessed. The test results for the package level assessment present that the test vehicle past criteria for all of these required tests. The test results of temperature cycling (−40°C ∼125°C) for the board level assessment show that these controlled variables have unlike performance in the solder joint reliability (SJR) of the WL-CSP package. The SAC105 shows better solder joint reliability performance than that of SAC1205 to provide 13 % improvement in characteristic life (Weibull distribution). The thick die (406 μm) shows statistically better SJR performance than that of thin die (356 μm) to sustain 10% increase in characteristic life (Weibull distribution). On the other hand, standard Ti/NiV/Cu UBM presents statistically equivalent SJR performance as plated Cu in characteristic life. As the results, package design factors of the solder alloy and die thickness play obvious roles in solder joint reliability compared to the factor of UBM. Generally speaking, the WL-CSP package presents appropriate solder joint reliability according to the test results.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"61 1","pages":"370-372"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The solder joint reliability assessment of a wafer level CSP package\",\"authors\":\"K. Chung, Chih-Hao Tseng, Liyu Yang\",\"doi\":\"10.1109/IMPACT.2011.6117252\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A WLCSP package consists of 2.2 × 2.2 mm2 silicon die, polyimide-based substrate, and 5 × 5 array of solder balls was used as the test vehicle to evaluate its solder joint reliability. Both package level tests with respect to precondition test, temperature cycling test, unbiased highly accelerated stress test (UHAST), and high temperature storage life (HTSL) test and board level tests regarding temperature cycling test have been included in the test plan. Two different lead free solder ball materials (SAC1205 vs. SAC105), under bump metallurgy (Ti/NiV/Cu vs. plated Cu), and die thicknesses (406 μm vs. 356 μm) were assessed. The test results for the package level assessment present that the test vehicle past criteria for all of these required tests. The test results of temperature cycling (−40°C ∼125°C) for the board level assessment show that these controlled variables have unlike performance in the solder joint reliability (SJR) of the WL-CSP package. The SAC105 shows better solder joint reliability performance than that of SAC1205 to provide 13 % improvement in characteristic life (Weibull distribution). The thick die (406 μm) shows statistically better SJR performance than that of thin die (356 μm) to sustain 10% increase in characteristic life (Weibull distribution). On the other hand, standard Ti/NiV/Cu UBM presents statistically equivalent SJR performance as plated Cu in characteristic life. As the results, package design factors of the solder alloy and die thickness play obvious roles in solder joint reliability compared to the factor of UBM. Generally speaking, the WL-CSP package presents appropriate solder joint reliability according to the test results.\",\"PeriodicalId\":6360,\"journal\":{\"name\":\"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)\",\"volume\":\"61 1\",\"pages\":\"370-372\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2011.6117252\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2011.6117252","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
采用由2.2 × 2.2 mm2硅芯片、聚酰亚胺基板和5 × 5焊点球阵列组成的WLCSP封装作为测试载体,评估其焊点可靠性。在测试计划中包括了关于前提条件测试、温度循环测试、无偏高加速应力测试(UHAST)和高温储存寿命测试(HTSL)的封装级测试和关于温度循环测试的板级测试。评估了两种不同的无铅焊球材料(SAC1205 vs SAC105),碰撞冶金(Ti/NiV/Cu vs镀Cu)和模具厚度(406 μm vs 356 μm)。包级评估的测试结果表明,测试车辆通过了所有这些要求测试的标准。电路板水平评估的温度循环(- 40°C ~ 125°C)测试结果表明,这些控制变量在WL-CSP封装的焊点可靠性(SJR)方面具有不同的性能。SAC105表现出比SAC1205更好的焊点可靠性性能,提供了13%的特征寿命提高(威布尔分布)。厚模(406 μm)的SJR性能优于薄模(356 μm),特征寿命延长10%(威布尔分布)。另一方面,标准Ti/NiV/Cu UBM的SJR性能在特征寿命上与镀Cu相当。结果表明,焊料合金的封装设计因素和模具厚度因素对焊点可靠性的影响明显大于UBM因素。一般来说,根据测试结果,WL-CSP封装具有适当的焊点可靠性。
The solder joint reliability assessment of a wafer level CSP package
A WLCSP package consists of 2.2 × 2.2 mm2 silicon die, polyimide-based substrate, and 5 × 5 array of solder balls was used as the test vehicle to evaluate its solder joint reliability. Both package level tests with respect to precondition test, temperature cycling test, unbiased highly accelerated stress test (UHAST), and high temperature storage life (HTSL) test and board level tests regarding temperature cycling test have been included in the test plan. Two different lead free solder ball materials (SAC1205 vs. SAC105), under bump metallurgy (Ti/NiV/Cu vs. plated Cu), and die thicknesses (406 μm vs. 356 μm) were assessed. The test results for the package level assessment present that the test vehicle past criteria for all of these required tests. The test results of temperature cycling (−40°C ∼125°C) for the board level assessment show that these controlled variables have unlike performance in the solder joint reliability (SJR) of the WL-CSP package. The SAC105 shows better solder joint reliability performance than that of SAC1205 to provide 13 % improvement in characteristic life (Weibull distribution). The thick die (406 μm) shows statistically better SJR performance than that of thin die (356 μm) to sustain 10% increase in characteristic life (Weibull distribution). On the other hand, standard Ti/NiV/Cu UBM presents statistically equivalent SJR performance as plated Cu in characteristic life. As the results, package design factors of the solder alloy and die thickness play obvious roles in solder joint reliability compared to the factor of UBM. Generally speaking, the WL-CSP package presents appropriate solder joint reliability according to the test results.