1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)最新文献_第7页

A new analytic model of simultaneous switching noise in CMOS systems 一种新的CMOS系统同步开关噪声分析模型

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678759

Hye-Ran Cha, O. Kwon

引用次数: 13

A novel flip chip technology using non-conductive resin sheet 采用不导电树脂片的新型倒装芯片技术

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678843

Satoshi Ito, Masaki Mizutani, H. Noro, M. Kuwamura, Ashok Prabhu, Nitto Denko

{"title":"A novel flip chip technology using non-conductive resin sheet","authors":"Satoshi Ito, Masaki Mizutani, H. Noro, M. Kuwamura, Ashok Prabhu, Nitto Denko","doi":"10.1109/ECTC.1998.678843","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678843","url":null,"abstract":"A novel flip chip packaging technology using non-conductive resin sheet has been studied. The process flow of this new packaging system is as follows. First, epoxy base resin sheet is laminated onto substrate to cover the substrate surface including land electrodes. Bumped chip alignment and attachment has done through the resin sheet, in the second stage with pressure and temperature. The bumps under the chip penetrate with removing resin sheet material and eventually reaching to the metal land of the substrate in this process. Metal connection and curing of the interface resin have completed in the third stage. This new process has big potential to make flip chip package simple compared with current flip chip packaging process using liquid resin with dispensing system. The through put time can be reduced to less than 10 seconds/units in actual model case even large flip chip package which has over 15/spl times/15 (mm) square area IC chip. The other advantages are thermal stability of material in the process, moisture related performance, and warpage control performance. For current underfill process we have only choice to use anhydride type resin system which has many disadvantaged on that. This new process made it possible to introduce moisture and thermally stable epoxy resin with phenol curing system for flip chip packaging. Drastic process ability improvement can be achieved by the new process and material. As a typical improvement of thermal shock performance, it was confirmed that the life of chip damage becomes over 10 times longer by flip chip bonding parameters which can be controlled only by this new flip chip packaging process.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127661031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Proposed strategies for microelectronic packaging education for next generation engineers 新一代微电子封装工程师的教育策略

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678748

B.C. Kim

引用次数: 0

Low cost MCM-L fiber-optic transmitter package 低成本的MCM-L光纤发射机包

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678725

H.G. Kellzi

引用次数: 3

Intrasystem interconnection in telecommunication platforms using plastic optical fiber 使用塑料光纤的电信平台系统内互连

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678829

G. Grimes, L. L. Blyler, C. J. Sherman, J.S. Nyquist, S. Peck

引用次数: 2

Interconnect simulation using order reduction and scattering parameters 采用降阶和散射参数的互连仿真

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678761

W. Beyene, J. Schutt-Ainé

引用次数: 9

Film chip interconnect systems prepared by wet chemical metallization 湿化学金属化制备薄膜芯片互连系统

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678713

F. Kuchenmeister, M. Bottcher, V. Beyer, S. Thierbach, M. Ekkehard, M. Agater, J. Kickelhain, D. Meier

引用次数: 2

Overmold technology applied to cavity down ultrafine pitch PBGA package 超细螺距PBGA封装的复模工艺

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678734

S. Ouimet, Marie-Claude Paquet

引用次数: 16

Polymer interfacial adhesion in microelectronic assemblies 微电子组件中的聚合物界面粘附

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678682

X. Dai, M. Brillhart, P. Ho

{"title":"Polymer interfacial adhesion in microelectronic assemblies","authors":"X. Dai, M. Brillhart, P. Ho","doi":"10.1109/ECTC.1998.678682","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678682","url":null,"abstract":"The performance requirements of future electronic packages create the need for transition from traditional wire bond connections to advanced technologies such as flip chip on laminate and direct chip attach. These high performance connections utilize a particulate reinforced structural epoxy (underfill) to adhere the chip to the package or board. The integrity of the underfill/silicon chip and underfill/substrate (ceramic or polymer laminates) interfaces are crucial for the reliability of these chip attach methods. This paper presents fracture-mechanics-based experimental and analytical techniques for quantitatively and reproducibly determining the adhesive performance of chip/underfill and polymer substrate/underfill interfaces. The results of the adhesion studies on underfill/passivated silicon and underfill/polymer coated FR4 board interfaces are presented. The effects of different underfill formulations, board coatings and chip passivation layers on underfill interfacial performance are discussed. These techniques can be employed to rapidly evaluate new materials and examine process modification impact on adhesive performance in a wide range of environments.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"247 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114605351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Pad redistribution technology for flip chip applications 倒装芯片应用的衬垫再分配技术

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678851

C. Tsui, Y. Huang, J.H. Wu

引用次数: 3