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新一代微电子封装工程师的教育策略

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678748
B.C. Kim
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引用次数: 0

摘要

讨论了在塔夫茨大学电气工程课程中整合微电子封装教育的几个建议策略。这些策略包括一些传统的举措和一种针对本科生、毕业生和行业专业人士的新方法。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Proposed strategies for microelectronic packaging education for next generation engineers
Discusses several proposed strategies to integrate microelectronic packaging education in the electrical engineering curriculum at Tufts University. The strategies include some of the traditional initiatives and a novel approach for undergraduates, graduates and professionals in industry.
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1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
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