Film chip interconnect systems prepared by wet chemical metallization

Abstract

A novel low cost flip-chip like microelectronics packaging technology for bonding integrated circuits to polymer foils has been developed. The chip with the active side facing the polyimide foil is attached by an pre-deposited adhesive. Excimer laser micromachining technique for via hole fabrication to the bond pads was employed. Two different wet chemical metallization processes were investigated for electrical connecting the bond pads. The conductive patterns were fabricated by additive or semiadditive processing technique. Besides the detailed description of the major process steps, results of initial reliability investigations are presented.