超细螺距PBGA封装的复模工艺

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678734

S. Ouimet, Marie-Claude Paquet

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引用次数: 16

摘要

传递成型技术通常用于引线框架型封装和芯片式PBGA(塑料球栅阵列)封装。该技术已应用于PBGA空腔封装，通常情况下，液体环氧树脂通过针在空腔中分配，以覆盖器件和金线，而不超过焊料球高度平面。介绍了采用传递成型工艺的新型封装方法，以及采用超细间距线键PBGA工艺的调试/鉴定方法和结果。

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Overmold technology applied to cavity down ultrafine pitch PBGA package

The transfer molding technology is normally used for leadframe type packages and chip-up PBGA (Plastic Ball Grid Array) packages. This technology has been applied to cavity down PBGA packages where, normally, a liquid epoxy is dispensed by a needle in the cavity in order to cover the device and gold wires without exceeding the solder ball height plane. The new encapsulation approach using transfer molding process as well as the debug/qualification method and results using an ultrafine pitch wirebond PBGA process are described.

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来源期刊

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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