1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)最新文献

{"title":"Mass production techniques for optical modules","authors":"K. Kurata","doi":"10.1109/ECTC.1998.678752","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678752","url":null,"abstract":"This paper describes optical packaging techniques to realize mass production. A novel passive alignment technique is developed as a key technique for module assembly. A laser diode (LD) is passively positioned on a Si substrate by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V-groove. A simple receptacle structure for the module output port is also designed. This structure has realized both automatic module assembly and automatic module mount on a circuit board, for the first time. In addition to packaging techniques, advanced module applications such as a surface mount LD module and a hybrid integrated waveguide module, are introduced.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121255391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A cost effective ceramic package for LD/PD module in subscriber system","authors":"M. Yanagisawa, S. Tomie, S. Tanahashi","doi":"10.1109/ECTC.1998.678881","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678881","url":null,"abstract":"Proposes a new concept ceramic package for LD/PD module in subscriber system to meet the demand of significant package cost reduction. Subscriber system requires not only cost reduction but also high reliability in a harsh environment. Ceramic packages utilized in trunk lines show good reliability. We propose a new ceramic package which is cost effective. The new ceramic package is a DIP type package which has good operation of assembly on circuit board and good capability for mass production of assembly on circuit board and for mass production of the package. An outer pin pitch of the package has same pitch as 14 pin type or Minidil type structure for ease of circuit board mounting and utilization of industrial standard pin pitch saves the cost of circuit board modification. The new ceramic package has two stage grooves. The first groove holds optical fiber feed with organic adhesive and the fiber core is mounted on the second groove. This two-stage groove structure allows strong fiber attachment to the package. We evaluate reliability by observing change in light power of LD module after assembly of the LD module utilizing silicon V-groove platform and encapsulation by ceramic lid with epoxy sealant which has low Young's modulus. The change in light power from LD module after high temperature and high humidity test of 85C/85%, 2000 hour was less than +/-1 dB. This result indicates that the new ceramic package has capability for use reliability and cost effective.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116450871","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Impacting electronic package design by validated simulations","authors":"V. Sarihan, Yifan Guo, T. Lee, S. Teng","doi":"10.1109/ECTC.1998.678715","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678715","url":null,"abstract":"Numerical methods are being used extensively for predicting mechanical and thermal response of electronic interconnect systems and packages. New challenges are being faced as the regime of predictable response is being expanded. These new challenges can range from incorporating complex time dependent material response prediction, interconnect reliability prediction to micromachined sensor response to extreme environmental inputs. Very often we are treading close to the unknown or predicting response by making certain assumptions and simplifications that enable us to make the predictions. Being aware of these assumptions and verifying the regime of uncertainty then is fundamental to simulation validation.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124435918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Parallel optical link (PAROLI) for multichannel gigabit rate interconnections","authors":"H. Karstensen, L. Melchior, V. Plickert, K. Drogemuller, J. Blank, T. Wipiejewski, H.-D. Wolf, J. Wieland, G. Jeiter, R. Dal’Ara, M. Blaser","doi":"10.1109/ECTC.1998.678791","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678791","url":null,"abstract":"A 12-fiber unidirectional parallel optical link (PAROLI) with discrete Tx and Rx modules is presented with a total bandwidth exceeding 12 Gbit/s. The Tx and Rx module dimensions are 50 mm length, 18 mm width, and 10.5 mm height. The packages have 72 pins with 0.65 mm pitch in surface mount technology. The optical port is an MT-compatible 62.5 /spl mu/m core graded-index multimode fiber array connector which is locked by a clip and can be unlocked without special tools. The supply voltage is 3.3 V. The electrical signal interface is compatible to the Low Voltage Differential Signal Standard (LVDS, IEEE P1596-3 standard).","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"270 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133569520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electrically conductive adhesives at microwave frequencies","authors":"M. Dernevik, R. Sihlbom, K. Axelsson, Z. Lai, Johan Liu, P. Starski","doi":"10.1109/ECTC.1998.678839","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678839","url":null,"abstract":"In this paper we present results from measurements on epoxy-based anisotropic and isotropic, electrically conductive adhesives, ACAs and ICAs respectively. We study two different types of connections, a flip-chip bonded silicon test chips and a simple transmission line gap bridged by a copper foil. These measurements are referenced to equivalent solder joints. The silicon chip is a standard test chip. The test chips are mounted on three different substrates, a rigid FR-4 board, flexible board and a high-frequency Teflon-based duroid substrate. We also discuss two electrical models for the connections, an equivalent RC model and a stochastic model, based on random particle distribution. The equivalent electrical model is based on physical considerations and the parameters are then fitted to measurement data in the high frequency CAD tool HP MDS. All the adhesive and solder interconnections are measured before and after temperature cycling and humidity tests. The temperature dependence of the connections S-parameters are also studied in a temperature controlled environment. A HP8510 network analyzer is used to measure scattering parameters. On rigid and flexible boards, the frequency range investigated is 500 MHz to 8 GHz, and on duroid mounted flip-chips and bridges, the range is 1 GHz to 30 GHz. The Thru-Reflect-Line calibration procedure is used to get the best possible calibration. Power testing is used with the Cu bridge assembly to find the maximum power transmission through an electrically conductive adhesive interconnect. This is done at relevant microwave frequencies. Results indicate that the isotropic adhesive interconnections handle high power throughput well. The adhesive joints are subjected to a maximum peak pulsed power of 250 W. Maximum work factor of the pulsed signal is 10%. The effects of different particle sizes and materials in the ACAs are systematically investigated. Three different particle sizes and two particle materials are examined. All adhesives considered show similar electrical properties and are all suitable for adhesive electrical interconnections. The microstructure of the adhesive joints is studied by cross-sectioning using Scanning Electron Microscopy (SEM) before and after temperature cycling.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116658540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Standards-based multimedia education for electronics packaging","authors":"P. Wesling","doi":"10.1109/ECTC.1998.678765","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678765","url":null,"abstract":"The prevasiveness of Internet access within companies and universities has given us a new tool for education for both students and working engineers. Though in its infancy, the creation and delivery of educational modules over the Internet may bring revolutionary changes to technical education in the next few years. Instructors will be able to access modules prepared by top researchers and professors to use in their classes; students can be directed toward supplementary learning modules that can teach and clarify key course concepts and methods; and working engineers can be quickly trained in the latest techniques, become aware of new designs and methods, or extend their skills into emerging fields. Though the Internet itself is based on standards that define the transmission protocols, there is as yet no standard for interoperability of learning modules. Several proprietary \"environments\" have been created for Computer-Based Training and similar computer-assisted learning; however, the standards that would guarantee interoperability of learning modules have yet to be created. The IEEE Computer Society has established the Learning Technology Standards Committee (P1484) to develop and standardize protocols and methods so that learning modules can be used by the student/learner in a seamless environment, without needing multiple client applications. This paper discusses the nature of the opportunity, the scope of the P1484 Committee, some progress to date, and the prognosis for meaningful standardization that can be of use to instructors and learners in the field of electronics packaging.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"286 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131539988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements","authors":"C. K. Gurumurthy, L. G. Norris, C. Hui, E. Kramer","doi":"10.1109/ECTC.1998.678778","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678778","url":null,"abstract":"Delamination of underfill/passivation interface is a major cause for failure of direct chip attach (DCA) assemblies during reliability testing. We have used a modified asymmetric double cantilever beam (ADCB) testing for measuring the fracture toughness of the interface and a newly developed hydro-thermal fatigue testing (based on noncontact fiber optic displacement sensor) for measuring the fatigue crack growth rate along the interface. We have developed and used a simple anhydride cured model underfill epoxy (that captures the basic chemistry of the underfills) and a commercially available PMDA/ODA passivation for this study. Both the fracture toughness (determined through ADCB testing) and the fatigue crack growth rate (determined through hydro-thermal fatigue testing) are dependent on the mechanical phase angle under which the crack grows.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132826795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Comparison of the shear strength and reliability between gold-plated and bare copper lands of a BGA package","authors":"C.H. Lee, S. Lee, B. Moon","doi":"10.1109/ECTC.1998.678852","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678852","url":null,"abstract":"In this study, we focus on the possibility that the land of bare copper in plastic ball grid array (PBGA hereafter) packages may be used instead of the gold-plated land. Comparison of the shear strength of the balls on the two types of the land is made every 100 cycles of the temperature cycling test. The result shows that the shear strength of bare copper lands with oxidization during the standard process of PBGA is almost as comparable as that of gold-plated lands within experimental error range. Surface analysis of the lands before ball attachment and after ball detachment is presented. A possible process development using copper wire is suggested.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131616048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Tacky Dots/sup TM/ technology for flip chip and BGA solder bumping","authors":"A. Beikmohamadi, A. Cairncross, J. E. Gantzhorn, B. Quinn, M. Saltzberg, G. Hotchkiss, G. Amador, L. Jacobs, R. Stierman, S. Dunford, P. Hundt","doi":"10.1109/ECTC.1998.678732","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678732","url":null,"abstract":"As the electronics market moves toward higher performance Integrated Circuits (ICs), each IC requires larger numbers of Inputs and Outputs (I/Os). This has resulted in a strong need in the marketplace for a low cost, high resolution method for placing controlled volumes of solder (or other metal alloys) on bond pads of ICs and area array semiconductor packages, such as Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs). To satisfy this need, DuPont has developed the concept of Tacky Dots/sup TM/, which utilizes proprietary technology in photoimageable adhesives to form a pattern of tacky areas, which are subsequently populated with conductive particles and then transferred to ICs or packages. DuPont's expertise and effort have been focused on developing a systems approach to the front end population process, while working closely with Texas Instruments who has developed technology to enable the effective transfer of the conductive particles. This paper contains details of the imaging and population technology as well as a discussion of the overall progress of this new wafer bumping process.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134286386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Transient thermal measurement of laser diodes","authors":"C.C. Lee, J. Velasquez","doi":"10.1109/ECTC.1998.678931","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678931","url":null,"abstract":"In this research, the transient thermal response of laser diodes is measured using light power as the temperature sensitive parameter. It is well known that the light power of a laser diode decreases as temperature increases. When the laser is driven by a long pulse signal, the light power decreases within the pulse duration as a result of temperature increase. From the percentage of light power decrease versus time, the temperature rise as a function of time is deduced. In determining the temperature rise, a calibration curve of power versus temperature is used. This curve is produced by measuring the peak light power of the laser driven by a short pulse over a range of case temperature. Under short pulse condition, the laser junction temperature is approximated by the case temperature since the junction does not have enough time to heat up. For the approximation to be valid, the short pulse width must be much shorter than the thermal time constant of the laser. Several commercial laser diodes are studied. In the experiment, the laser case temperature is measured by a thermal coupler-based digital thermometer with an accuracy of /spl plusmn/0.1/spl deg/C. The accuracy is verified by boiling water and ice water temperatures.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132091509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}