1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)最新文献_第5页

In package micro-aligner for fiber-optic packaging 光纤封装用封装微对准仪

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678934

J. Haake, M. Beranek

引用次数: 9

Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill 板上倒装芯片的可靠性。下填土水分渗透对接触完整性影响的一阶模型

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678809

J. Caers, R. Oesterholt, R. Bressers, T. Mouthaan, J. F. Verweij

{"title":"Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill","authors":"J. Caers, R. Oesterholt, R. Bressers, T. Mouthaan, J. F. Verweij","doi":"10.1109/ECTC.1998.678809","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678809","url":null,"abstract":"In evaluating the reliability of flip chip on board with solder bumps, only a little is known about moisture-induced failure mechanisms at interconnection level. In order to accommodate the difference in coefficient of thermal expansion of the silicon die and the printed board in a flip chip geometry, an epoxy underfill is commonly applied. This underfill increases the resistance to cyclic temperature loads, but the material is susceptible to moisture ingress. Failure analysis of flip chips from an 85/spl deg/C/85%RH test has shown that swelling of the underfill caused by moisture take up and the resulting hygro-stress is a major driving force for failures at interconnection level. To capture this failure mechanism, a new first order, one dimensional diffusion model for moisture is used. Moisture absorption properties of underfills are experimentally determined by gravimetric vapour sorption experiments at 85/spl deg/C/85%RH. The temperature dependencies of these properties are estimated based on data of similar epoxy moulding compounds. Taking a critical hygro-stress level as failure criterion, an analytical transform is proposed, and an acceleration factor defined. A design rule for accelerated humidity testing is formulated. The acceleration transform is used to plot iso failure-free time diagrams for two flip chip underfills. These diagrams enable predicting of a failure-free time during service life under a variety of temperature and humidity conditions.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124728052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Relationship between initial thermal characteristics and lifetime projection of semiconductor laser diodes 半导体激光二极管初始热特性与寿命投影的关系

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678930

N. Hwang, Sang-Hwan Lee, G. Joo, Min-Kyu Song, K. Pyun

引用次数: 1

Enhancing moisture resistance of PBGA 提高PBGA的抗湿性

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678820

Y. C. Teo, E. Wong, T. Lim, Yu Yang, J. Ju

引用次数: 14

Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging 用于PCB组装和IC封装的环氧基可水处理光介质干膜和导电ViaPlug

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678683

C. G. González, R. Wessel, S. Padlewski

{"title":"Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging","authors":"C. G. González, R. Wessel, S. Padlewski","doi":"10.1109/ECTC.1998.678683","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678683","url":null,"abstract":"DuPont formulated a new generation of photoimageable permanent resists and conductive ViaPlug polymer to be used as building blocks for sequential build-up of PCBs, MCM-Ls, and plastic IC packages. The buzzwords for these structures are HDIS (high density interconnection structures) and microvias. The conventional method of making PCBs and MCM-Ls is a sequential lamination of innerlayer cores or interplanes, followed by at least one mechanical drilling. In this paper we will discuss a new approach of using semi-additive plating which means starting with a multilayer core, mechanically drilling for though hole connection, filling the through-hole with conductive ViaPlug, then adding layers of dielectric to make blind or buried vias for interconnection and routing of circuits, and heat dissipation. The paper will discuss the challenges in each application, relevant industry specifications for each application, and the dielectric and conductor materials properties to meet the challenges. From the viewpoint of technology choices, we will compare photoimaging versus laser ablation and plasma etching. Lastly, we will discuss our reliability data developed internally and in conjunction with several consortia.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125170238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Thermal fatigue reliability analysis of redistributed flip chip assemblies 重分布倒装芯片组件热疲劳可靠性分析

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678669

B. Vandevelde, E. Beyne

引用次数: 4

Multi-domain analysis of PBGA solder joints for structural design optimization PBGA焊点结构优化的多域分析

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678917

M. Rassaian, W. Chang, Jung-Chan Lee

引用次数: 3

A CMOS image sensor module applied for a digital still camera utilizing the TOG (TAB On Glass) bonding method 采用TOG (TAB On Glass)键合方法的用于数码相机的CMOS图像传感器模块

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678853

M. Segawa, M. Ono, S. Musha, Y. Kishimoto, A. Ohashi

引用次数: 2

Adhesion integrity evaluation of plastic encapsulated semiconductor package 塑料封装半导体封装的粘附完整性评价

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678858

N. Kawamura, K. Hirohata, T. Kawakami, K. Sawada, T. Mino, A. Kurosu, E. Takano, Yoo Hee Yeoul

{"title":"Adhesion integrity evaluation of plastic encapsulated semiconductor package","authors":"N. Kawamura, K. Hirohata, T. Kawakami, K. Sawada, T. Mino, A. Kurosu, E. Takano, Yoo Hee Yeoul","doi":"10.1109/ECTC.1998.678858","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678858","url":null,"abstract":"Plastic encapsulated semiconductor packages may crack if interval delamination occurs during the reflow soldering process, and adhesion integrity evaluation of plastic packages is becoming increasingly important. A new method of estimating the adhesion integrity between epoxy molding resin and silicon chips for plastic packages is proposed. First, three-dimensional stress analysis was carried out to obtain stress distributions in quad flat packages (QFPs) during the reflow soldering process. Next, resin adhesion strength tests were carried out. The shearing load acting on a resin cube molded on a silicon chip was measured, and the maximum shearing load at breakage was obtained. Finally, it was proposed that the stress distributions near the adhesion resin edge of the resin in the test specimen at breakage be used as the criterion for adhesion integrity evaluation of the packages. The adhesion integrity for some QFPs was predicted by comparing the analytical stress distribution in the package and the criterion calculated from the results of the adhesion strength test. The results of reliability tests on the package showed that the new criterion allowed effective evaluation.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124979478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Solid state UV-laser technology for the manufacture of high performance organic modules 用于制造高性能有机组件的固态紫外激光技术

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678802

D.B. Noddin, E. Swenson, Y. Sun

{"title":"Solid state UV-laser technology for the manufacture of high performance organic modules","authors":"D.B. Noddin, E. Swenson, Y. Sun","doi":"10.1109/ECTC.1998.678802","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678802","url":null,"abstract":"Advances in solid state laser technology have enabled tremendous performance increases in chip packaging technology. Organic composites are now available for high I/O flip chip modules due in part to the size, speed and flexibility of laser via creation methodologies. Generation of the third and fourth harmonics of the fundamental infrared Nd-YAG wavelength enable precision micromachining of alternating layers of organic insulators and metal conductors. The range of available pulse energies at high repetition rate, low M/sup 2/ values and superb pulse stability allows the formation of both high aspect ratio through vias and very small blind vias utilizing similar tools. The ability to fabricate chip packages with through vias, staggered blind vias, or any combination of blind, buried and through vias affords system and chip level design teams the maximum allowable flexibility to optimize performance versus cost. The most fundamental hardware improvements revolve around the conversion efficiency and power stability of Q-switched, lamp pumped Nd-YAG lasers utilizing BBO crystals for harmonic generation. The high pulse energies coupled with excellent beam quality translates into near theoretical focal depth values that in turn allow <50 micron, >7:1 aspect ratio interconnects to be manufactured at defect densities less than 50 ppm. Other advances including improved coatings on crystals and optics and improved thermal management at the rail, result in overall system availability exceeding 85% and via location accuracy of better than +/-20 microns. Future advances are likely to include a migration from lamp pumping to diode pumping, optimization of frequency conversion and laser design for greater power at high repetition rates, multi-rail systems and improved automation. A roadmap for past, current and future laser characteristics as they relate to via qualities and their relative costs will be discussed.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130033733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9