1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)最新文献_第10页

Novel thermally reworkable underfill encapsulants for flip-chip applications 用于倒装芯片应用的新型热可重构底填料

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678676

Lejun Wang, C. Wong

{"title":"Novel thermally reworkable underfill encapsulants for flip-chip applications","authors":"Lejun Wang, C. Wong","doi":"10.1109/ECTC.1998.678676","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678676","url":null,"abstract":"Underfill encapsulant is critical to the reliability of the flip-chip solder interconnections. Current underfill encapsulants are mainly filled epoxy-based materials that are not reworkable after curing, which place an obstacle in Flip-Chip On Board (FCOB) and Multi-Chip Module (MCM) technology developments, where unknown bad dies (UBD) is still a concern. Accordingly, approaches have been taken to develop the thermally reworkable underfill materials in order to address the reworkability problem of the commercial underfill encapsulants. These include introducing the thermally cleavable block to thermoset resins, and adding additives to thermoset resins. For the first approach, two diepoxides with thermally cleavable blocks were synthesized and characterized. These materials were shown to undergo thermosetting reactions with cyclic anhydride in a very similar fashion to a commercial cycloaliphatic epoxide, and they meet the underfill encapsulant requirements in regard to their glass transition temperatures (Tgs), storage moduli (G's), coefficients of thermal expansion (CTEs), and viscosities. However, these cured samples degrade at much lower temperatures than the commercial epoxies. For the latter approach, two additives were shown that after being added to typical cycloaliphatic epoxy formulation, do not interfere with epoxy curing, and do not affect the typical properties of cured epoxy system, yet provide reworkability to the epoxy. In this paper, we present the characterization results of this new class of materials-thermally reworkable underfill encapsulants-by DSC, TMA, DMA, and rheometer. Furthermore, we will present the preliminary reworkability test results of this class of materials with flip-chip devices on PWB.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116650910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Computational simulation of underfill encapsulation of flip-chip ICs. I. Flow modeling and surface-tension effects 倒装集成电路下填充封装的计算模拟。流动建模和表面张力效应

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678912

H. Yang, S. Bayyuk, A. Krishnan, A. Przekwas, L. Nguyen, P. Fine

引用次数: 7

Fracture of optical fibers in connectors 连接器中光纤断裂

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678935

C.K. Sidbury, B. Lefevre, W. W. King, D. L. Stephenson

引用次数: 0

Finite element thermal model for high power transients in microelectronics with CVD diamond heat spreaders 含CVD金刚石散热器的微电子器件高功率瞬态的有限元热模型

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678936

K. Clark, R. Ulrich, M. Gordon, M. Leftwich

引用次数: 2

Thermal impedance of microwave integrated circuits with localized small heat sources 局部小热源微波集成电路的热阻抗

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678884

D. Riemer

引用次数: 1

Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages 球栅阵列封装电特性的先进测量与建模技术比较

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678938

T. Horng, A. Tseng, H.H. Huang, S. Wu, J.J. Lee

引用次数: 11

Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging 在电子互连和封装领域开发课程、研究和原型设备的教育项目

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678767

Z. Illyefalvi-Vitéz, G. Harsányi, P. Nemeth, J. Pinkola

引用次数: 2

Automatic power control of a VCSEL using an angled lid TO56 package 自动电源控制的VCSEL使用角度盖TO56包

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678694

P. Claisse, W. Jiang, P. Kiely, M. Roll, L. Boughter, P. Sanchez, D. Cotney, M. Lebby, B. Webb, B. Lawrence

引用次数: 8

Creep behavior of a flip-chip package by both FEM modeling and real time moire interferometry 用有限元模拟和实时云纹干涉法研究倒装芯片的蠕变行为

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678933

Jianjun Wang, Z. Qian, D. Zou, Sheng Liu

{"title":"Creep behavior of a flip-chip package by both FEM modeling and real time moire interferometry","authors":"Jianjun Wang, Z. Qian, D. Zou, Sheng Liu","doi":"10.1109/ECTC.1998.678933","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678933","url":null,"abstract":"In this paper, the creep behavior of a flip-chip package under a thermal load was investigated by using nonlinear finite element technique coupled with high density laser moire interferometry. The real-time moire interferometry technique was used to monitor and measure the time-dependent deformation of flip-chip packages during the test, while the finite element method was adapted to analyze the variation of stresses at edges and corners of interfaces with time by considering the viscoelastic properties of the underfill and the viscoplastic behavior of the solder balls. The results show that the creep behavior of the underfill and the solder balls does not have significant effect on the warpage of the flip-chip under the considered thermal load due to their constrained small volume. The variation of the time-dependent deformation in the flip-chip package caused by the creep behavior of the underfill and the solder balls is in the submicron scale. The maximum steady state U-displacement is only reduced by up to 6.7% compared with the maximum initial state U-displacement. Likewise, the maximum steady state V-displacement is merely reduced by up to 10% compared with the maximum initial state V-displacement. The creep behavior slightly weakens the warpage situation of the flip-chip package. However, the modeling results show that the localized stresses at corners and edges of interfaces greatly decrease due to the consideration of viscoelastic properties of the underfill and the viscoplastic properties of the solder balls and thereby effectively prevents interfaces from cracking. In addition, the predicted deformation values of the flip-chip package obtained from the finite element analysis were compared with the test data obtained from the laser moire interferometry technique. It is shown that the deformation values of the flip-chip package predicted from the finite element analysis are in a fair agreement with those obtained from the test.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124419863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 30

O/e-MCM packaging with new, patternable dielectric and optical materials O/e-MCM封装与新的，图案化的介电和光学材料

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI: 10.1109/ECTC.1998.678929

M. Robertsson, O. Hagel, G. Gustafsson, A. Dabek, M. Popall, L. Cergel, P. Wennekers, P. Kiely, M. Lebby, T. Lindahl

{"title":"O/e-MCM packaging with new, patternable dielectric and optical materials","authors":"M. Robertsson, O. Hagel, G. Gustafsson, A. Dabek, M. Popall, L. Cergel, P. Wennekers, P. Kiely, M. Lebby, T. Lindahl","doi":"10.1109/ECTC.1998.678929","DOIUrl":"https://doi.org/10.1109/ECTC.1998.678929","url":null,"abstract":"This paper presents a novel o/e-MCM-L/D concept for fully integrated opto-electronic MCM-packaging aiming at: very low cost, very high interconnect density and high performance. The polymer thin film materials technology allowing the integration of optical waveguides and high density electrical interconnects in just 3 thin film layers is also discussed in terms of chemistry, processes and properties. Very good processability and planarization of the new inorganic-organic photo-polymers, ORMOCERs, (ORganically MOdified CERamics) in combination with a much lower post-curing temperature (120/spl deg/C-170/spl deg/C) than alternative materials (such as polyimide and benzocyclobutene) enables the use of low cost polymer substrates such as FR-4 epoxy. Novel surface mountable waveguide-connectors for passive precision alignment, compatible with standard MT-opto-connectors can be used for coupling light in and out from the o/e-MCM-L/D's. In the demonstrator, laser-arrays (VCSEL's) and photodiode-arrays are flip-chip mounted above UV-excimer laser ablated 45-degree mirrors in the waveguides. Driver-chips and passive components are wirebonded and surface mounted respectively. The modules are also supplied with microvias in the FR4-epoxy-substrate connecting to a ball grid array (BGA) underneath. The need of any extra package for connection to next packaging level is thus eliminated. In conclusion the versatility and the low-cost potential of the presented technologies are emphasized.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124478117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22