在电子互连和封装领域开发课程、研究和原型设备的教育项目

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678767

Z. Illyefalvi-Vitéz, G. Harsányi, P. Nemeth, J. Pinkola

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引用次数: 2

摘要

为21世纪微电子互连和封装领域的要求准备电子工程师是当今教育的真正挑战。提供适当的讲座课程和实践实验，引导学生参与研究项目，并在真实的原型制造环境中教授技术，有望实现主要目标。一项教育发展项目已经启动。

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Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging

The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.

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1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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