球栅阵列封装电特性的先进测量与建模技术比较

T. Horng, A. Tseng, H.H. Huang, S. Wu, J.J. Lee
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引用次数: 11

摘要

为建立球栅阵列(BGA)封装的高频/高速等效模型,提出了先进的频域和时域测量和建模技术。考虑到封装的相邻耦合走线,找到的电气参数包括等效耦合传输在线模型的特性阻抗、耦合系数和传播延迟,以及等效块模型的自感、互感、负载电容和互电容。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages
Advanced measurement and modeling techniques are proposed in both the frequency domain and time domain to establish the high-frequency/high-speed equivalent models of Ball Grid Array (BGA) packages. In consideration of the adjacent coupled traces of the packages, the electrical parameters that are found include characteristic impedance, coupling coefficient, and propagation delay for the equivalent coupled transmission-line models, and self inductance, mutual inductance, loaded capacitance, and mutual capacitance for the equivalent lump models.
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