A study of a new flip chip packaging process for diversified bump and land combination

M. Mizutani, S. Ito, M. Kuwamura, H. Noro, S. Akizuki, A. Prarhu
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引用次数: 4

Abstract

Flip chip packages using plastic substrates are becoming popular in the IC packaging market. However, it still has not been standardized as a real mass production system. We have newly developed a flip chip packaging technology using a nonconductive underfill resin sheet. The process flow of the new flip chip packaging is as follows. First, the underfill sheet is laminated onto substrate. Next, the bumped die is aligned and attached onto substrate which is covered by the underfill sheet under proper heat and pressure. The bumps under the die penetrate the resin and to reach the metal land of the substrate. Finally curing the underfill sheet and metal connection are carried out. We have studied the possibility of applying this packaging technology to a diversified bump and land combination by changing the underfill component and process parameters. The electrical stability and package warpage under several stress test conditions, such as JEDEC Level-3 and TST, have been evaluated in this study. After this evaluation, we found that the packages which have been built with proper resin components and process parameters show good performance for all of these reliability tests almost regardless of bump and land materials.
一种新的倒装晶片封装工艺的研究
使用塑料基板的倒装芯片封装在IC封装市场上越来越受欢迎。然而,它仍然没有被标准化为一个真正的大规模生产系统。我们最近开发了一种使用不导电底填充树脂片的倒装芯片封装技术。新型倒装芯片封装的工艺流程如下:首先,将底填片层压到基材上。接下来,凸起的模具对准并附着在衬底上,衬底在适当的热量和压力下被下填片覆盖。模具下的凸点穿透树脂并到达基材的金属表面。最后进行下填料板固化和金属连接。我们研究了通过改变下填料成分和工艺参数,将这种封装技术应用于多种凹凸组合的可能性。在JEDEC 3级和TST等几种应力测试条件下,对电稳定性和封装翘曲进行了评估。经过评估,我们发现采用合适的树脂成分和工艺参数构建的封装在所有这些可靠性测试中都表现出良好的性能,几乎与碰撞和地面材料无关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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