提高PBGA的抗湿性

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678820

Y. C. Teo, E. Wong, T. Lim, Yu Yang, J. Ju

{"title":"提高PBGA的抗湿性","authors":"Y. C. Teo, E. Wong, T. Lim, Yu Yang, J. Ju","doi":"10.1109/ECTC.1998.678820","DOIUrl":null,"url":null,"abstract":"One of the main package reliability limitations of PBGA is its moisture sensitivity performance, i.e. popcorn failure. The objective of this work is to enhance the moisture resistance of a 35/spl times/35 mm overmolded PBGA by matching its material combination. The approach taken is to correlate the package moisture sensitivity performance with the packaging material properties. JEDEC level 2 moisture sensitivity performance was achieved with two different combinations of materials. The best combination was close to achieving level 1 performance, thereby reinforcing the importance of material matching. Mold compound moisture absorption property has the strongest correlation with package moisture performance. A low value is favourable. For die attach material, the hot and wet adhesion shear strength showed the strongest correlation with package moisture performance. High adhesion shear strength is preferred. Unlike mold compound, the moisture absorption property of die attach material has a significantly weaker correlation.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Enhancing moisture resistance of PBGA\",\"authors\":\"Y. C. Teo, E. Wong, T. Lim, Yu Yang, J. Ju\",\"doi\":\"10.1109/ECTC.1998.678820\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the main package reliability limitations of PBGA is its moisture sensitivity performance, i.e. popcorn failure. The objective of this work is to enhance the moisture resistance of a 35/spl times/35 mm overmolded PBGA by matching its material combination. The approach taken is to correlate the package moisture sensitivity performance with the packaging material properties. JEDEC level 2 moisture sensitivity performance was achieved with two different combinations of materials. The best combination was close to achieving level 1 performance, thereby reinforcing the importance of material matching. Mold compound moisture absorption property has the strongest correlation with package moisture performance. A low value is favourable. For die attach material, the hot and wet adhesion shear strength showed the strongest correlation with package moisture performance. High adhesion shear strength is preferred. Unlike mold compound, the moisture absorption property of die attach material has a significantly weaker correlation.\",\"PeriodicalId\":422475,\"journal\":{\"name\":\"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-05-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1998.678820\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1998.678820","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 14

摘要

PBGA封装可靠性的主要限制之一是其湿敏性能，即爆米花失效。这项工作的目的是通过匹配其材料组合来增强35/spl倍/35 mm复模PBGA的防潮性。所采取的方法是将包装的水分敏感性能与包装材料的性能联系起来。采用两种不同的材料组合实现JEDEC 2级湿敏性能。最佳组合接近达到1级性能，从而加强了材料匹配的重要性。模具复合吸湿性能与包装吸湿性能的相关性最强。低价值是有利的。对于模贴材料，热、湿粘接剪切强度与封装防潮性能的相关性最强。粘接抗剪强度高优先。与模具复合材料不同，模贴材料吸湿性能的相关性明显较弱。

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Enhancing moisture resistance of PBGA

One of the main package reliability limitations of PBGA is its moisture sensitivity performance, i.e. popcorn failure. The objective of this work is to enhance the moisture resistance of a 35/spl times/35 mm overmolded PBGA by matching its material combination. The approach taken is to correlate the package moisture sensitivity performance with the packaging material properties. JEDEC level 2 moisture sensitivity performance was achieved with two different combinations of materials. The best combination was close to achieving level 1 performance, thereby reinforcing the importance of material matching. Mold compound moisture absorption property has the strongest correlation with package moisture performance. A low value is favourable. For die attach material, the hot and wet adhesion shear strength showed the strongest correlation with package moisture performance. High adhesion shear strength is preferred. Unlike mold compound, the moisture absorption property of die attach material has a significantly weaker correlation.

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来源期刊

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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