A novel flip chip technology using non-conductive resin sheet

Satoshi Ito, Masaki Mizutani, H. Noro, M. Kuwamura, Ashok Prabhu, Nitto Denko
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引用次数: 14

Abstract

A novel flip chip packaging technology using non-conductive resin sheet has been studied. The process flow of this new packaging system is as follows. First, epoxy base resin sheet is laminated onto substrate to cover the substrate surface including land electrodes. Bumped chip alignment and attachment has done through the resin sheet, in the second stage with pressure and temperature. The bumps under the chip penetrate with removing resin sheet material and eventually reaching to the metal land of the substrate in this process. Metal connection and curing of the interface resin have completed in the third stage. This new process has big potential to make flip chip package simple compared with current flip chip packaging process using liquid resin with dispensing system. The through put time can be reduced to less than 10 seconds/units in actual model case even large flip chip package which has over 15/spl times/15 (mm) square area IC chip. The other advantages are thermal stability of material in the process, moisture related performance, and warpage control performance. For current underfill process we have only choice to use anhydride type resin system which has many disadvantaged on that. This new process made it possible to introduce moisture and thermally stable epoxy resin with phenol curing system for flip chip packaging. Drastic process ability improvement can be achieved by the new process and material. As a typical improvement of thermal shock performance, it was confirmed that the life of chip damage becomes over 10 times longer by flip chip bonding parameters which can be controlled only by this new flip chip packaging process.
采用不导电树脂片的新型倒装芯片技术
研究了一种新型的非导电树脂片倒装封装技术。这种新型包装系统的工艺流程如下。首先,将环氧基树脂片层压在基材上,以覆盖基材表面,包括陆地电极。凸起的芯片对准和附着已经通过树脂片材完成,在第二阶段用压力和温度。在此过程中,芯片下的凸起物穿透树脂片材,最终到达基材的金属表面。第三阶段完成金属连接和界面树脂固化。与目前使用液体树脂加点胶系统的倒装封装工艺相比,该工艺具有很大的简化倒装封装的潜力。在实际模型情况下,即使是具有超过15/spl倍/15 (mm)平方面积IC芯片的大型倒装芯片封装,通过时间也可以减少到10秒/单位以下。其他优点是材料在加工过程中的热稳定性,与水分有关的性能和翘曲控制性能。目前的下填工艺只能选用酸酐型树脂体系,而酸酐型树脂体系有很多缺点。这一新工艺为倒装封装引入湿性和热稳定性环氧树脂酚醛固化体系提供了可能。采用新工艺和新材料可大幅度提高加工能力。作为热冲击性能的典型改进,通过这种新的倒装封装工艺可以控制的倒装键合参数,证实了芯片损伤寿命延长10倍以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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