Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium最新文献

{"title":"Failure Reporting, Analysis And Corrective Action System In The US Semiconductor Manufacturing Equipment Industry: A Continuous Improvement Process","authors":"Mario Villacourt","doi":"10.1109/IEMT.1992.639872","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639872","url":null,"abstract":"Failure Reporting, Analysis and Corrective Action System (FRACAS) is a closed-loop feedback path by which pertinent reliability data is collected, recorded and analyzed during inhouse (laboratories), field (alpha/beta sites) tests and production/operation to determine where problems are concentrated in the design of the equipment. Thi:j process promotes reliability imlsrovement throughout the life cycle of the equipment. FRACAS objectives are to provide engineering data for corrective action; assess historical reliability performance (MTBF, MTTR, Availability, Preventive Maintenance, etc.); develop patterns for deficiencies and provide data for statistical analysis. FRACAS information can also help you in determining contractual performance data and allow for better determination of warranty information. The heart of .FRACAS is its data base management system (DBMS) which classifies failure modes into categories that are essential in idenfifying the processes in the product (hardware/software) life cycle requiring the most attention for reliability improvement. This reliability engineering activity has its roots in the military, applied to industries such as aerospace, automotive and telecommunications. However bits and pieces can be found throughout all industries. Unfortunately this usually means that the only data received at the manufacturer comes from either field or customer service organizations in the form of complaints. This can have a very negative effect on the equipment performance due to the lateness and misapplication of such limited data.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128015120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Characterizing Water Soluble Fluxes: Surface Insulation Resistance VS Electrochemical Migration","authors":"L. Turbini, J. Jachim, G. Freeman, J. F. Lane","doi":"10.1109/IEMT.1992.639866","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639866","url":null,"abstract":"The drive to eliminate chlorofluorocarbons (CFCs) and other ozone-depleting substances from use in electronics manufacturing has led many companies to evaluate alternate soldering fluxes which do not require solvents such as CFCs and methyl chloroform for cleaning. Water soluble fluxes represent one viable approach which has been evaluated and used by major computer and telecommunication companies. One advantage of water soluble fluxes over traditional rosin-based fluxes is the improved soldering yield'. However, the aggressive nature of the residues from water soluble fluxes require careful control of the cleaning process.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133892062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The Study Of Integrated Manufacturing System For Plant Managers And Staffs","authors":"M. Mori, S. Kuriyama, T. Nose","doi":"10.1109/IEMT.1992.639897","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639897","url":null,"abstract":"The introduction and the conistruction of CIM are advanced in a lot of enterprises. Some has become a stage where the result of CIM is achieved. And, do the factory management and the staff use the data of CIM effectively how as the follwing step? Can the data collected by CIM be used to manage the factory in efficiently and the strategy? And, the tool which enables it and the system are at the stage where examines what is necessary. In this Paper, the system which should say SIS at the factory level by based on the CIM cribed.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131033618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging","authors":"L. Felton, C. Raeder, C. K. Havasy, D. Knorr","doi":"10.1109/IEMT.1992.639908","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639908","url":null,"abstract":"The possibility of a ban of Pb has forced the electronics industry to search for alternatives for Pb-based solders. We present a discussion of several of these alternatives and present preliminary results of experiments aimed at developing these solutions. Experimental results presented include an assessment of the strain rate sensitivity of Sn-Bi solder joints; the wetting properties of Sn-Bi solders on bare and hot-dipped Cu surfaces; and the development of a laser soldering process for fine pitched SMT using Sn-Ag solders.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123567475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development Of An Alternative Wire Bond Test Technique","authors":"P. Lall, D. Barker, M. Pecht","doi":"10.1109/IEMT.1992.639905","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639905","url":null,"abstract":"An alternative test technique to the wire bond pull test is presented for wire bond interconnects. The new test technique, based on electromagnetic resonance, has the potential for on-line use as a quality assurance and operational life evaluation method. The new technique greatly reduces the test time in comparison with the existing MIL-STD-883 pull test and internal visual inspection. This new test technique more closely simulates the operational stress than the wire bond pull test and has also shown a sensitivity to defects that would otherwise escape visual inspection. >","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126326350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Screening ICs On The Bare Chip Level: Temporary Packaging","authors":"D. Chu, C. Reber, D. Palmer","doi":"10.1109/IEMT.1992.639895","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639895","url":null,"abstract":"Several different temporary packaging concepts for integrated circuits (ICs) for pretest at speed and burn-in are introduced. Temporary packaging is achieved using standard labor and equipment resources already employed in permanent packaging. Experiments were carried out to validate the pretest process, and results are presented for the various materials used in the pretest process. The preferred method for temporary packaging along with the selected materials used is presented. Temporary packaging of integrated circuits for pretest with reasonable yield is demonstrated as feasible. >","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134087346","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Application Of Tab In High Performance Single Chip Package","authors":"Y. Stricot, P. Couranti, G. Dehaine","doi":"10.1109/IEMT.1992.639860","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639860","url":null,"abstract":"The increase of the speed and of the number of I/O’s of integrated circuits requires High Performance Single Chip Packages. TAB packages offer an attractive alternative to the standard ceramic QFP in terms of electrical performances and cost reduction. In this paper, a new package using both ceramic and TAB construction is described. It has been designed for a large (12mm Sa) CMOS VLSI with 316 I/O’s. The 276 outer leads have a 0.32 mm pitch. The footprint on the board is 29.2 mm SQ. This work has been sponsorized by the European Community and developed during the Esprit project APACHI P . The package structure will be fully described. Its two major elements are a TAB frame using the two or three layers technology (one metal layer) and a plane capacitor mixing the polyimide and the cofired processes. So, the MLB (Mid lead bonding) connection is introduced: the power leads of the frame are connected to this plane capacitor as close as possible to the chip (0.3 mm). This connection allows a reduction of the noise appearing during the simultaneous switching of the buffers (up to 40 at SO mA/ns per buffer). Electrical modelisations have been conducted to define the equivalent network. We have selected specific organic adhesives to assemble the structure. To connect the lead on the chip (ILB) and the leads on the ceramic (MLB) single point bonding techniques have been applied. The reason is that in this application the chip on tape is placed in a non-hermetic environment, the encapsulation process is very important. By using flexible adhesives we have solved the attachment of the die directly on a brass piece to minimize the high mechanical stresses in the chip. For the lead-frame attachment, we use specific thin films adhesives(100 microns thick) to assemble kapton or upilex. After trim and form of the leads, hot bars reflow soldering is used to mount the package on the board. The characterization of the package has shown its excellent behavior in terms of reliability, of thermal resistance and of electrical performances for high speed applications.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131231093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Performance Capabilities Of The Next Generation Manufacturing Enterprise","authors":"R.N. NageI","doi":"10.1109/IEMT.1992.639911","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639911","url":null,"abstract":"I The vision described in this document is abstracted from a two volume report '2 ls t Century Manufacturing Enterprise Strategy\" facilitated by the Iacocca Institute at Lehigh University. The report has been disnibuted by a Congressional committee to every member of Congress, to the CEO's of every Fortune 500 company, and to thousands of executives in the business community. The complete report may be ordered by contacting the Agile Manufacturing Enterprise Forum of the Iacocca Institute at 215-758-5510.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124649167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Dynamic Manufacturing Process control","authors":"R. Raines, K. Pearsall","doi":"10.1109/IEMT.1992.639854","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639854","url":null,"abstract":"A business need existed for a data management system to combine raw material quality data, in-process statistical control data, and the resulting customer satisfaction data in a manufacturing environment. No system existed that analyzed these three sets of data to optimize customer satisfaction. Therefore, an expert system was developed to fill this need. It includes a relational database for correlating data about the manufacturing process and customer needs. The Customer Quality Analysis (CQA) system has been implemented as a pilot program within IBM. The program that initiated the development of this data management system is highlighted, then specific materials applications are discussed. The authors conclude with suggestions for possible extensions of this process into other manufacturing process areas. >","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"14 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125762915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Energy Systems Product Delivery Project","authors":"S. Long, M. Kowalski","doi":"10.1109/IEMT.1992.639900","DOIUrl":"https://doi.org/10.1109/IEMT.1992.639900","url":null,"abstract":"Energy Systems, a part of AT&T Power Systems, initiated a project to plan, develop, and deploy effective business processes and tools. The objective of the project is to increase customer satisfaction by reducing delivery intervals to less than industry standard. Energy Systems redesigned its product, product documentation, and product delivery process to achieve that objective while continuing to minimize inventory. The project is broad in scope and addresses all aspects of the complete end-to-end order to shipment process flow. These include the Design-To-Bill-Of-Material, the Forecast-ToProcurement, and the Order-'To-Ship Processes. The project is significant in that it demonstrates the direct impact of product design on the Material Provisioning and Order Fulfillment Processes. The project also demonstrates the use of multiple small interdisciplinary process improvement teams cooperating to define and implement a significant, cross functional end-to-end process re-engineering, During 1991, Energy Systems personnel redesigned the Cellular Battery Plant as a building black product and defined new end-toend business processes. Current processes were baselined, a target system was defined, and initial feasibility was demonstrated. The pilot, or test, of the end-to-end target processes and a crisp, clearly defined common goal were key to focusing the efforts of the fifty or so cross functional, part time and full time persons involved in the project. With the re-engineered product delivery process, all the components of an order for Ciellular Battery Plants are shipped to arrive as a consolidated whole on the customer's requested delivery date. This paper will review the project and the methods used to reduce the total cycle time required to fulfill as a total package \"custom orders\" for the Cellular Battery Plant, a building block product with multiple options. Business Environment and Strategies The mission of Energy Systems is to offer system solutions that provide superior quality, cost effective energy transformation, reserve, and monitoring capabilities. Energy Systems services six major customer groups: 1. Regional Bell Operating Companies, 2. AT&T Network Services Division, 3. Independent Telephone Companies, 4. International Telecommunication Corporations 5. AT&T Equipment Divisions, and 6. Original Equipment Manufacturers, Telecommunications and Data Processing Companies. -Energy Systems plans to achieve its business objectives by delivering products much faster than industry standard intervals. The Energy Systems products are being designed or redesigned to be built from standard building blocks. The strategic move to building block products supports the ability to deliver systems in less than industry standard intervals. In response tO customer's requirements, Energy Systems is moving to provide full stream customer oriented service. The service will provide pro-active customer service, sales application engineering, and a re-engineere","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"847 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114442635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}