一种可替代的线接测试技术的发展

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1992-09-28 DOI:10.1109/IEMT.1992.639905

P. Lall, D. Barker, M. Pecht

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引用次数: 21

摘要

提出了一种替代导线键合拉力试验的导线键合互连试验技术。这种基于电磁共振的新型测试技术具有在线使用的潜力，可以作为一种质量保证和使用寿命评估方法。与现有的MIL-STD-883拉拔测试和内部目视检查相比，新技术大大缩短了测试时间。这种新的测试技术比钢丝键合拉力测试更接近于模拟操作应力，并且还显示出对缺陷的敏感性，否则无法通过目测检查。>

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Development Of An Alternative Wire Bond Test Technique

An alternative test technique to the wire bond pull test is presented for wire bond interconnects. The new test technique, based on electromagnetic resonance, has the potential for on-line use as a quality assurance and operational life evaluation method. The new technique greatly reduces the test time in comparison with the existing MIL-STD-883 pull test and internal visual inspection. This new test technique more closely simulates the operational stress than the wire bond pull test and has also shown a sensitivity to defects that would otherwise escape visual inspection. >

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Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

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