表征水溶性助焊剂:表面绝缘电阻VS电化学迁移

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1992-09-28 DOI:10.1109/IEMT.1992.639866

L. Turbini, J. Jachim, G. Freeman, J. F. Lane

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引用次数: 18

摘要

在消除电子产品制造中使用的氟氯化碳和其他消耗臭氧物质的努力下，许多公司开始评估不需要氟氯化碳和甲基氯仿等溶剂进行清洁的替代焊剂。水溶性助焊剂是一种可行的方法，已被主要计算机和电信公司评估和使用。水溶性助焊剂比传统松香基助焊剂的一个优点是提高了焊接收率。然而，水溶性助焊剂残留物的侵蚀性要求仔细控制清洗过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Characterizing Water Soluble Fluxes: Surface Insulation Resistance VS Electrochemical Migration

The drive to eliminate chlorofluorocarbons (CFCs) and other ozone-depleting substances from use in electronics manufacturing has led many companies to evaluate alternate soldering fluxes which do not require solvents such as CFCs and methyl chloroform for cleaning. Water soluble fluxes represent one viable approach which has been evaluated and used by major computer and telecommunication companies. One advantage of water soluble fluxes over traditional rosin-based fluxes is the improved soldering yield'. However, the aggressive nature of the residues from water soluble fluxes require careful control of the cleaning process.

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Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

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