Development Of An Alternative Wire Bond Test Technique

Abstract

An alternative test technique to the wire bond pull test is presented for wire bond interconnects. The new test technique, based on electromagnetic resonance, has the potential for on-line use as a quality assurance and operational life evaluation method. The new technique greatly reduces the test time in comparison with the existing MIL-STD-883 pull test and internal visual inspection. This new test technique more closely simulates the operational stress than the wire bond pull test and has also shown a sensitivity to defects that would otherwise escape visual inspection. >