1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)最新文献

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CMOS RF modeling for GHz communication IC's GHz通信集成电路的CMOS射频建模
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689213
J. Ou, Xiaodong Jin, Ingrid Ma, C. Hu, Paul R. Gray
{"title":"CMOS RF modeling for GHz communication IC's","authors":"J. Ou, Xiaodong Jin, Ingrid Ma, C. Hu, Paul R. Gray","doi":"10.1109/VLSIT.1998.689213","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689213","url":null,"abstract":"With the advent of submicron technologies, GHz RF circuits can now be realized in a standard CMOS process. A major barrier to the realization of robust commercial CMOS RF components is the lack of adequate models which accurately predict MOSFET device behavior at high frequencies. The conventional microwave table-lookup-based approach requires a large database obtained from numerous device measurements and computationally intense simulations for accurate results. This method becomes prohibitively complex when used to simulate highly integrated CMOS communication systems; hence, a compact model, valid for a broad range of bias conditions and operating frequencies is desirable. BSIM3v3 has been widely accepted as a standard CMOS model for low frequency applications. Recent work has demonstrated the capability of modeling CMOS devices at high frequencies by utilizing a complicated substrate resistance network and extensive modification to the BSIM3v3 source code. This paper first describes a unified device model realized with a lumped resistance network suitable for simulations of both RF and baseband analog circuits; then verifies the accuracy of the model to measured data on both device and circuit levels.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125343267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 114
Chemical mechanical polishing: the impact of a new technology on an industry 化学机械抛光:一项新技术对一个行业的影响
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689177
K. A. Perry
{"title":"Chemical mechanical polishing: the impact of a new technology on an industry","authors":"K. A. Perry","doi":"10.1109/VLSIT.1998.689177","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689177","url":null,"abstract":"Chemical Mechanical Polishing (CMP), a technology born in IBM Confidential culture, has remained true to its heritage not only because of its significant competitive advantage, but because of the history of its birth in the semiconductor industry. In spite of this heritage, CMP has grown from its invention in 1984, to one of the fastest growing segments of the semiconductor equipment industry. In 1997 the growth rate of CMP equipment averaged 30% in comparison with the rest of the semiconductor equipment market. The factors that enabled this dynamic growth include both the technical advantages of CMP and the history of its development and subsequent spread into the industry. The growth of CMP technology has spawned new business and supplier networks as well as new fields of study. As the science of CMP evolves, it continues to borrow from several diverse technical fields and has created a new science within semiconductors.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124016444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
CVD photoresist processes for sub-0.18 design rules CVD光刻胶工艺的0.18以下设计规则
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689242
T. Weidman, D. Sugiarto, M. Nault, D. Mui, Z. Osborne, C. Lee, J. Yang
{"title":"CVD photoresist processes for sub-0.18 design rules","authors":"T. Weidman, D. Sugiarto, M. Nault, D. Mui, Z. Osborne, C. Lee, J. Yang","doi":"10.1109/VLSIT.1998.689242","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689242","url":null,"abstract":"The CVD photoresist material plasma polymerized methylsilane (PPMS) provides a thin film high resolution imaging layer for 193 nm lithography. Patterned films are readily converted into silicon dioxide hard masks useful for patterning critical device layers with high selectivity. We describe the application of this process for patterning polysilicon gates and new a low /spl kappa/ dielectric material.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127800220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
RF noise in 1.5 nm gate oxide MOSFETs and the evaluation of the NMOS LNA circuit integrated on a chip 1.5 nm栅极氧化mosfet中的射频噪声及片上集成NMOS LNA电路的评价
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689214
H. Momose, R. Fujimoto, S. Otaka, E. Morifuji, T. Ohguro, T. Yoshitomi, H. Kimijima, S. Nakamura, T. Morimoto, Y. Katsumata, H. Tanimoto, H. Iwai
{"title":"RF noise in 1.5 nm gate oxide MOSFETs and the evaluation of the NMOS LNA circuit integrated on a chip","authors":"H. Momose, R. Fujimoto, S. Otaka, E. Morifuji, T. Ohguro, T. Yoshitomi, H. Kimijima, S. Nakamura, T. Morimoto, Y. Katsumata, H. Tanimoto, H. Iwai","doi":"10.1109/VLSIT.1998.689214","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689214","url":null,"abstract":"Recently, direct tunneling gate oxide MOSFETs have shown the potential of enabling extremely high RF performance in analog applications. An excellent cutoff frequency of more than 150 GHz was reported at a gate length of less than 0.1 /spl mu/m. In this paper, RF noise characteristics of the MOSFETs are reported in detail. The gate oxide thickness and supply voltage dependencies were investigated. In addition, NMOS LNA (low noise amplifier) circuits made with 1.5 nm gate oxide MOSFETs were evaluated for the first time. Good RF analog circuit operation with very low noise and high gain was confirmed.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127705124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
A highly manufacturable 0.25 /spl mu/m multiple-Vt dual gate oxide CMOS process for logic/embedded IC foundry technology 用于逻辑/嵌入式IC铸造技术的高度可制造的0.25 /spl mu/m多vt双栅氧化CMOS工艺
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689236
M.H. Chang, J. Ting, J.S. Shy, L. Chen, C.W. Liu, J.Y. Wu, K. Pan, C. Hou, C. Tu, Y.H. Chen, S.L. Sue, S. Jang, S.C. Yang, C. Tsai, C. Chen, H. Tao, C. Tsai, H. Hsieh, Y.Y. Wang, R. Chang, K. Cheng, T. Chu, T. Yen, P. Wang, J. Weng, J.H. Hsu, Y. Ho, C. Ho, Y. Huang, R. Shiue, B. Liew, C. Yu, S.C. Sun, J. Sun
{"title":"A highly manufacturable 0.25 /spl mu/m multiple-Vt dual gate oxide CMOS process for logic/embedded IC foundry technology","authors":"M.H. Chang, J. Ting, J.S. Shy, L. Chen, C.W. Liu, J.Y. Wu, K. Pan, C. Hou, C. Tu, Y.H. Chen, S.L. Sue, S. Jang, S.C. Yang, C. Tsai, C. Chen, H. Tao, C. Tsai, H. Hsieh, Y.Y. Wang, R. Chang, K. Cheng, T. Chu, T. Yen, P. Wang, J. Weng, J.H. Hsu, Y. Ho, C. Ho, Y. Huang, R. Shiue, B. Liew, C. Yu, S.C. Sun, J. Sun","doi":"10.1109/VLSIT.1998.689236","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689236","url":null,"abstract":"Summary form only given. A multiple-Vt high performance, high density and highly manufacturable 0.25 /spl mu/m CMOS technology with a shallow trench isolation process has been successfully developed. Five metal layers with oxide CMP planarization, etchback W plug for borderless contacts/vias, and fully stacked contact/vias were used. Dual gate oxide process (5 nm for 2.5 V core, and 7 nm for 3.3 V I/O or 13 nm for 5 V I/O) with low defect density, and low Vt (/spl sim/0.2 V) or native Vt (/spl sim/0 V) devices for low power and mixed-mode applications are all demonstrated in this technology.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126960131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Stochastic net length distributions for global interconnects in a heterogeneous system-on-a-chip 异质片上系统中全局互连的随机网长分布
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689192
P. Zarkesh-Ha, J. Meindl
{"title":"Stochastic net length distributions for global interconnects in a heterogeneous system-on-a-chip","authors":"P. Zarkesh-Ha, J. Meindl","doi":"10.1109/VLSIT.1998.689192","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689192","url":null,"abstract":"The stochastic net length distribution for global interconnects in a non-homogeneous system-on-a-chip is derived using novel models for netlist information, placement information and routing information. Through comparison with actual product data, it is shown that the new stochastic models successfully predict the global net length distribution of a heterogeneous system.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131343377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
A new prediction method for oxide lifetime and its application to study dielectric breakdown mechanism 一种新的氧化物寿命预测方法及其在介质击穿机理研究中的应用
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689239
K. Okada, H. Kubo, A. Ishinaga, K. Yoneda
{"title":"A new prediction method for oxide lifetime and its application to study dielectric breakdown mechanism","authors":"K. Okada, H. Kubo, A. Ishinaga, K. Yoneda","doi":"10.1109/VLSIT.1998.689239","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689239","url":null,"abstract":"Summary form only given. Highly reliable ultrathin gate oxides (<5 nm) are required to realize high performance MOS LSIs. In such oxides, the breakdown process consists of the partial-breakdown (p-BD) and the complete-breakdown (c-BD). The p-BD is also called as quasi-breakdown or soft-breakdown (s-BD). The time to breakdown is characterized by two specific times, time to p-BD and time to c-BD after p-BD, to retain a definition of thick oxide breakdown even in ultrathin oxides. Hence, it is important to predict these two times independently. We also reported that the A-mode stress induced leakage current (SILC) is a good monitor for indicating the time to p-BD, while we can determine the p-BD by the B-mode SILC. In this paper, a universal relationship between A-mode SILC and oxide lifetime is found, when the lifetime is defined as the time to p-BD. This relationship allows the development of a new prediction method for oxide lifetime. The field acceleration and activation energy of lifetime are further discussed using the new prediction method.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132034184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 29
1.5 V operation sector-erasable flash memory with BIpolar Transistor Selected (BITS) P-channel cells 具有双极晶体管选择(BITS) p通道单元的1.5 V操作扇区可擦除闪存
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689180
T. Ohnakado, N. Ajika, H. Hayashi, H. Takada, K. Kobayashi, K. Sugahara, S. Satoh, H. Miyoshi
{"title":"1.5 V operation sector-erasable flash memory with BIpolar Transistor Selected (BITS) P-channel cells","authors":"T. Ohnakado, N. Ajika, H. Hayashi, H. Takada, K. Kobayashi, K. Sugahara, S. Satoh, H. Miyoshi","doi":"10.1109/VLSIT.1998.689180","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689180","url":null,"abstract":"A novel BIpolar Transistor Selected (BITS) P-channel flash memory cell is proposed and a very low 1.5 V non-WL (word line)-boosting read and sector-erase operations are successfully achieved. Moveover, this cell technology not only maintains the advantages of the P-channel DINOR (DIvided bit line NOR) flash memory, but also realizes the amplification of cell current, which is favorable for fast access operation.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122963612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
ARC for sub-0.18 /spl mu/m logic and gigabit DRAM frontend and backend processes ARC用于低于0.18 /spl mu/m的逻辑和千兆DRAM前端和后端进程
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689210
W.W. Lee, Qizhi He, A. Chatterjee, G. Xing, B. Brennan, A. Singh, E. Zielinski, M. Hanratty, Sunny Fang, D. Rogers, G. Dixit, D. Carter, J. D. Luttmer, B. Havermann, R. Chapman
{"title":"ARC for sub-0.18 /spl mu/m logic and gigabit DRAM frontend and backend processes","authors":"W.W. Lee, Qizhi He, A. Chatterjee, G. Xing, B. Brennan, A. Singh, E. Zielinski, M. Hanratty, Sunny Fang, D. Rogers, G. Dixit, D. Carter, J. D. Luttmer, B. Havermann, R. Chapman","doi":"10.1109/VLSIT.1998.689210","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689210","url":null,"abstract":"We have developed different Si/sub x/O/sub y/N/sub z/ antireflective coating (ARC) films for many different substrates for deep-UV lithography and implemented then into sub-0.18 /spl mu/m logic and Gigabit DRAM frontend and backend processes. The Si/sub x/O/sub y/N/sub z/ film has dual functions: reducing substrate reflectivity to a minimum, and serving as a hardmask for poly and metal etch. These properties of Si/sub x/O/sub y/N/sub z/ are crucial to tight CD control and fabrication of unique device structures. Plasma damage from ARC deposition is negligible. Using the designed Si/sub x/O/sub y/N/sub z/ and linewidth reduction etch, sub-0.1 /spl mu/m metal gate nMOSFETs are demonstrated. Backend sub-0.25 /spl mu/m multilevel metal patterning and etch with Si/sub x/O/sub y/N/sub z/ produce excellent metal profiles and 100% comb yield. A designed ARC also produces superior 1 Gigabit DRAM 0.16 /spl mu/m storage node contact patterning.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128532547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Normally-off PLED (Planar Localised Electron Device) for non-volatile memory 用于非易失性存储器的正常关闭PLED(平面局部电子器件)
1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) Pub Date : 1998-06-09 DOI: 10.1109/VLSIT.1998.689228
H. Mizuta, K. Nakazato, P. Piotrowicz, K. Itoh, T. Teshima, K. Yamaguchi, T. Shimada
{"title":"Normally-off PLED (Planar Localised Electron Device) for non-volatile memory","authors":"H. Mizuta, K. Nakazato, P. Piotrowicz, K. Itoh, T. Teshima, K. Yamaguchi, T. Shimada","doi":"10.1109/VLSIT.1998.689228","DOIUrl":"https://doi.org/10.1109/VLSIT.1998.689228","url":null,"abstract":"An advanced Planar Localised Electron Device (PLED) is presented for use as a non-volatile and high-speed random access memory with very low power consumption. A new tunnel barrier configuration is introduced to achieve both write time shorter than 1.0 nsec and retention time over 10 years. An operation scheme based on extremely high ON/OFF current ratios is demonstrated for the first time by conducting numerical simulation of tunnel currents.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"18 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116401032","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
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