Chemical mechanical polishing: the impact of a new technology on an industry

K. A. Perry
{"title":"Chemical mechanical polishing: the impact of a new technology on an industry","authors":"K. A. Perry","doi":"10.1109/VLSIT.1998.689177","DOIUrl":null,"url":null,"abstract":"Chemical Mechanical Polishing (CMP), a technology born in IBM Confidential culture, has remained true to its heritage not only because of its significant competitive advantage, but because of the history of its birth in the semiconductor industry. In spite of this heritage, CMP has grown from its invention in 1984, to one of the fastest growing segments of the semiconductor equipment industry. In 1997 the growth rate of CMP equipment averaged 30% in comparison with the rest of the semiconductor equipment market. The factors that enabled this dynamic growth include both the technical advantages of CMP and the history of its development and subsequent spread into the industry. The growth of CMP technology has spawned new business and supplier networks as well as new fields of study. As the science of CMP evolves, it continues to borrow from several diverse technical fields and has created a new science within semiconductors.","PeriodicalId":402365,"journal":{"name":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1998.689177","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

Chemical Mechanical Polishing (CMP), a technology born in IBM Confidential culture, has remained true to its heritage not only because of its significant competitive advantage, but because of the history of its birth in the semiconductor industry. In spite of this heritage, CMP has grown from its invention in 1984, to one of the fastest growing segments of the semiconductor equipment industry. In 1997 the growth rate of CMP equipment averaged 30% in comparison with the rest of the semiconductor equipment market. The factors that enabled this dynamic growth include both the technical advantages of CMP and the history of its development and subsequent spread into the industry. The growth of CMP technology has spawned new business and supplier networks as well as new fields of study. As the science of CMP evolves, it continues to borrow from several diverse technical fields and has created a new science within semiconductors.
化学机械抛光:一项新技术对一个行业的影响
化学机械抛光(CMP)是一项诞生于IBM Confidential文化的技术,它一直忠于自己的传统,这不仅是因为它具有显著的竞争优势,还因为它诞生于半导体行业的历史。尽管有这样的传统,CMP已经从1984年的发明发展成为半导体设备行业增长最快的领域之一。1997年,与其他半导体设备市场相比,CMP设备的平均增长率为30%。实现这种动态增长的因素包括CMP的技术优势以及其发展历史和随后在行业中的传播。CMP技术的发展催生了新的商业和供应商网络以及新的研究领域。随着CMP科学的发展,它继续从几个不同的技术领域借鉴,并在半导体领域创造了一门新的科学。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信