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2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)最新文献

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Boosting off-chip interconnects through chip-to-chip capacitive coupled communication 通过片对片电容耦合通信增强片外互连
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329736
Xiang Zhang, Dongwon Park, Chung-Kuan Cheng
{"title":"Boosting off-chip interconnects through chip-to-chip capacitive coupled communication","authors":"Xiang Zhang, Dongwon Park, Chung-Kuan Cheng","doi":"10.1109/EPEPS.2017.8329736","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329736","url":null,"abstract":"We propose Chip-to-Chip Capacitive Coupled Communication (5C) to increase off-chip communication through the metal plate on the side wall of the chip packaging, as the chip to chip spacing for the state of the art electronic designs has been reduced due to the advances of design for manufacturing (DFM) technologies. We demonstrate 5C can transmit 20Gbps data on each channel and provide noise immunity to the coupling noise from adjacent channel.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123759742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Adaptive wavelet stochastic collocation for resonant transmission line circuits 谐振传输线电路的自适应小波随机配置
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329729
Alan Yang, Xu Chen, J. Schutt-Ainé, A. Cangellaris
{"title":"Adaptive wavelet stochastic collocation for resonant transmission line circuits","authors":"Alan Yang, Xu Chen, J. Schutt-Ainé, A. Cangellaris","doi":"10.1109/EPEPS.2017.8329729","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329729","url":null,"abstract":"An adaptive wavelet stochastic collocation method for uncertainty quantification is applied to a resonant circuit with stochastic parameters. The outputs of many electrical systems vary rapidly with respect to internal random parameters, for example due to resonance conditions. Accurate and efficient characterization of output statistics is key in designing systems with irregularities, but poses a challenge for conventional sampling-based stochastic collocation methods. The adaptive method in this paper constructs a hierarchical sparse grid approximation using wavelet basis functions. Since wavelet expansion coefficients are rigorous error estimators, wavelet sparse grids can potentially meet error tolerances with optimal efficiency and outperform local polynomial and other adaptive finite-element methods. The advantages and efficiency of this method is explored in the context of the circuit problem presented.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130386344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Unified approach to interconnect conductor surface roughness modelling 互连导体表面粗糙度建模的统一方法
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/epeps.2017.8329704
Y. Shlepnev
{"title":"Unified approach to interconnect conductor surface roughness modelling","authors":"Y. Shlepnev","doi":"10.1109/epeps.2017.8329704","DOIUrl":"https://doi.org/10.1109/epeps.2017.8329704","url":null,"abstract":"Commonalities of five conductor roughness models are analysed and unified form of roughness correction coefficient (RCC) is suggested in the paper. It is shown that Hammerstad, Huray, Groiss, Hemispherical and Bushminskiy roughness correction coefficients can be written in the following unified form K=1+(RF-1)∗F(SR), where RF is roughness factor that has meaning of maximal possible increase of losses with frequency due to the conductor roughness. F is a frequency-dependent function describing transition from zero at lower frequencies to one at higher frequencies (roughness transition function). It is shown that the unified RCC can be used in multi-level additive form for surfaces with two or more dominant discontinuity sizes or in multi-level multiplicative form for surfaces with fractal type discontinuities. Measurements on a test board are used to identify and compare all five RCCs.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"35 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116536852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Black-box optimization of 3D integrated systems using machine learning 使用机器学习的三维集成系统的黑盒优化
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329698
H. Torun, M. Swaminathan
{"title":"Black-box optimization of 3D integrated systems using machine learning","authors":"H. Torun, M. Swaminathan","doi":"10.1109/EPEPS.2017.8329698","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329698","url":null,"abstract":"Increasing complexity of electronics originates new challenges to system optimization. This work proposes a new black box optimization algorithm based on machine learning to address these challenges and analyzes its performance for clock skew minimization of 3D integrated systems.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131249108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Discontinuous Galerkin time-domain analysis of power/ground plate pairs with wave port excitation 波口激励下电源/接地对的不连续伽辽金时域分析
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329717
Ping Li, L. J. Jiang, H. Bağcı
{"title":"Discontinuous Galerkin time-domain analysis of power/ground plate pairs with wave port excitation","authors":"Ping Li, L. J. Jiang, H. Bağcı","doi":"10.1109/EPEPS.2017.8329717","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329717","url":null,"abstract":"In this work, a discontinuous Galerkin time-domain method is developed to analyze the power/ground plate pairs taking into account arbitrarily shaped antipads. To implement proper source excitations over the antipads, the magnetic surface current expanded by the electric eigen-modes supported by the corresponding antipad is employed as the excitation. For irregularly shaped antipads, the eigen-modes are obtained by numerical approach. Accordingly, the methodology for the S-parameter extraction is derived based on the orthogonal properties of the different modes. Based on the approach, the transformation between different modes can be readily evaluated.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128366231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of NEXT coupling in close proximity to receiver of 25Gb/s bus 25Gb/s总线接收器附近NEXT耦合的影响
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329750
P. Paladhi, J. Hejase, N. Pham, Ghadir Gholami, P. Jayaraman, Megan Nguyen, Glen A. Wiedemeier, D. Dreps
{"title":"Effect of NEXT coupling in close proximity to receiver of 25Gb/s bus","authors":"P. Paladhi, J. Hejase, N. Pham, Ghadir Gholami, P. Jayaraman, Megan Nguyen, Glen A. Wiedemeier, D. Dreps","doi":"10.1109/EPEPS.2017.8329750","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329750","url":null,"abstract":"This paper demonstrates the deleterious effect of Near End Cross Talk (NEXT) on 25.78 Gb/s communication links from proximity of aggressors to the victim's receiver end. Modeling studies and experimental results clearly indicate that at these higher data rates, even shorter lengths 2mm) of tight coupling could effectively close the eye, particularly when the coupling is near the victim's receiver end. Hence particular care must be taken in layout design of constrained areas like chip package to ensure this form of NEXT coupling happening near the victim receiver end is avoided.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114125549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A hybrid land grid array socket connector design for achieving higher signalling data rates 一种用于实现更高信号数据速率的混合地面电网阵列插座连接器设计
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329761
J. Hejase, S. Chun, W. Becker, D. Dreps, B. Beaman
{"title":"A hybrid land grid array socket connector design for achieving higher signalling data rates","authors":"J. Hejase, S. Chun, W. Becker, D. Dreps, B. Beaman","doi":"10.1109/EPEPS.2017.8329761","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329761","url":null,"abstract":"This paper presents an improved hybrid land grid array socket connector design enabling high speed bus signaling data rates up to 50Gb/s. Observed limitations in an existing connector such as impedance mismatches and crosstalk are treated and improved. The improved connector structural differences from the existing connector are presented and motivated. Electromagnetic modelling for the improved and existing connectors has been carried out to validate the design concept and compare signal integrity properties.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122015749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Design optimization of a planar spiral inductor using space mapping 平面螺旋电感的空间映射优化设计
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329706
Felipe de J. Leal-Romo, Marisol Cabrera-Gómez, J. Rayas-Sánchez, Daniel Garcia-Mora
{"title":"Design optimization of a planar spiral inductor using space mapping","authors":"Felipe de J. Leal-Romo, Marisol Cabrera-Gómez, J. Rayas-Sánchez, Daniel Garcia-Mora","doi":"10.1109/EPEPS.2017.8329706","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329706","url":null,"abstract":"This paper addresses the implementation of a computationally efficient optimization technique for designing structures simulated in 3D electromagnetic field solvers. A probe of concept is done by the EM-based optimization of a planar spiral inductor for high-power applications. The optimization technique employed is based on space mapping (SM) methods, more specifically on the Broyden-based input space mapping algorithm. Our optimization results confirm the efficiency of the proposed approach.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126527572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
An indirect measurement method for S-parameters which is based on reduction to eigenvalue problem 基于特征值约简问题的s参数间接测量方法
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329755
N. Maeda, S. Fukui, T. Sekine, Yasuhiro Takahashi
{"title":"An indirect measurement method for S-parameters which is based on reduction to eigenvalue problem","authors":"N. Maeda, S. Fukui, T. Sekine, Yasuhiro Takahashi","doi":"10.1109/EPEPS.2017.8329755","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329755","url":null,"abstract":"A novel measurement method for the S-parameters of multiport circuit with some of its ports not directly measured is proposed. We solve this problem by reducing it to an eigenvalue problem. In this paper, the method has been extended to circuits where the number of direct-measured ports exceeds that of indirect-measured ports. A numerical example shows its validity.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"461 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123648311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A method for creating behavioral models of oscillators using augmented neural networks 利用增强神经网络建立振子行为模型的方法
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329714
Huan Yu, M. Swaminathan, C. Ji, David White
{"title":"A method for creating behavioral models of oscillators using augmented neural networks","authors":"Huan Yu, M. Swaminathan, C. Ji, David White","doi":"10.1109/EPEPS.2017.8329714","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329714","url":null,"abstract":"This paper describes a novel technique to model the nonlinear time-domain behavior of oscillators using augmented neural networks. In the proposed method, a feed forward neural network with a periodic unit is used to capture the periodicity of the oscillatory output waveform. As opposed to the state space model, which is based on a system of differential equations, the output of the oscillator is generated explicitly using the neural network presented in this paper. The model is trained using the data obtained from the simulation of transistor-level circuit models. Examples applied to ring oscillators show the advantages using this method based on CPU time and accuracy. The proposed model is compatible with Verilog-A.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125653614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
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