用于高速通信总线的直流阻塞电容接口

Junyan Tang, J. Hejase, M. Richardson, D. Dreps, W. Becker, Y. Kwark, J. Audet, C. Baks
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引用次数: 1

摘要

本文研究了差动高速母线通道中直流阻塞电容器的集成问题。在信号路径中存在直流阻塞电容会产生阻抗不匹配的介质,从而导致信号退化。集成电容以减少阻抗不匹配变得非常重要。在不同的物理设计条件下,对微带差分对的差分阻抗进行了仿真计算。此外,还设计和制造了针对各种电容器测试地点的测试车辆测量,这些测试地点具有不同的特征,包括:封装尺寸、电容器衬垫/封装下的真空场景以及电容器走线的布线层。使用VNA对测试点进行了高达20GHz的测量,并对其结果进行了讨论。此外,为了验证建模方法对未来设计分析的目的,几个测试地点进行了模拟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC blocking capacitor interfacing for high speed communication buses
This paper studies integration aspects of DC blocking capacitors in differential high speed bus channels. The presence of a DC blocking capacitor in the signal path can present an impedance mismatched medium which can lead to signal degradation. Integrating the capacitor to minimize impedance mismatches becomes of high importance. The differential impedance of a micro-strip differential pair is evaluated in simulation under different physical design conditions. Additionally, test vehicle measurements for a variety of capacitor test sites with different characteristics including: package size, voiding scenarios under capacitor pads/packages and wiring layers for traces to the capacitors has been designed and fabricated. The test sites are measured up to 20GHz using a VNA and their results are discussed. Also, several of the test sites are simulated in order to validate the modelling method for future design analysis purposes.
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