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2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)最新文献

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Signal integrity analysis of machine pressed coaxial connector for automotive system 汽车系统机压同轴连接器信号完整性分析
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-18 DOI: 10.1109/EPEPS.2017.8329735
Dong-Hyun Kim, Hyunsuk Lee, Jonghoon J. Kim, Joungho Kim, Jung-min Park, Un-ho Kim, Kun-ho Kim, Yeok-Hwan Jeon, H. Kwon, Hoon Kim, M. Song
{"title":"Signal integrity analysis of machine pressed coaxial connector for automotive system","authors":"Dong-Hyun Kim, Hyunsuk Lee, Jonghoon J. Kim, Joungho Kim, Jung-min Park, Un-ho Kim, Kun-ho Kim, Yeok-Hwan Jeon, H. Kwon, Hoon Kim, M. Song","doi":"10.1109/EPEPS.2017.8329735","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329735","url":null,"abstract":"Different designs of machine pressed wire-to-wire coaxial connectors for automotive system are proposed and analyzed using a full wave 3D simulation tool. Reduced electromagnetic interference (EMI), impedance mismatch and voltage standing wave ratio (VSWR) are demonstrated using the simulation results. By eliminating unnecessary gaps and inserting air gaps in the housing shells, the signal integrity of wire-to-wire coaxial connectors for automotive system is improved. The proposed wire-to-wire coaxial connector can be used to elongate the RF cables within the automotive system with reduced EMI and impedance mismatch. Moreover, the proposed machine pressed connector design will reduce the total cost of coaxial connectors required for automotive systems.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"43 39","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132389804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Signal integrity analysis of high-speed board-to-board floating connectors for automotive systems 汽车系统中高速板对板浮动连接器的信号完整性分析
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-17 DOI: 10.1109/EPEPS.2017.8329718
Shinyoung Park, Hyesoo Kim, Jonghoon J. Kim, Joungho Kim, Un-ho Kim, Jung-min Park, Yuckhwan Jeon
{"title":"Signal integrity analysis of high-speed board-to-board floating connectors for automotive systems","authors":"Shinyoung Park, Hyesoo Kim, Jonghoon J. Kim, Joungho Kim, Un-ho Kim, Jung-min Park, Yuckhwan Jeon","doi":"10.1109/EPEPS.2017.8329718","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329718","url":null,"abstract":"In this paper, we propose two designs of floating board-to-board connector for high speed data transmission. This paper analyzes the signal integrity of the proposed designs using a full wave three-dimensional electromagnetic simulator. We analyze Time Domain Reflectometry impedance and differential insertion loss of the connectors up to 25 GHz. The proposed designs have uniform pin shapes, thereby showing less impedance mismatch and less signal loss. Among the proposed designs, the design with shorter stubs shows less signal loss due to impedance mismatch and the lower the anti-resonance frequency. Therefore, even though the connector becomes mechanically stable as the stubs become longer, for high-speed data transmission, the stub length has to be reduced to the extent, which the mechanical stability is guaranteed.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130247353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMI radiation physics using generalized characteristic mode (GCM) analysis with loss for practical structures 电磁干扰辐射物理的广义特征模式(GCM)分析与实际结构的损失
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329764
Y. S. Cao, Xu Wang, Yansheng Wang, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak
{"title":"EMI radiation physics using generalized characteristic mode (GCM) analysis with loss for practical structures","authors":"Y. S. Cao, Xu Wang, Yansheng Wang, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak","doi":"10.1109/EPEPS.2017.8329764","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329764","url":null,"abstract":"Characteristic mode analysis has been proposed for lossless case for decades. However, for real electromagnetic interference (EMI) structures, such as printed circuit board (PCB) midplane connector and heat sink, lossy material (such as copper) and terminations (resistive loads) are unavoidable which tradidiotnal CM method cannot handle. In this paper, a generalized CM analysis for lossy material and/or with resistive loads is developed for practical structures. With the proposed method, by applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified. This method facilitates the CM method in real applications.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127485540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Modeling of DDR5 signaling from jitter sequences to accurate bit error rate (BER) 从抖动序列到精确误码率(BER)的DDR5信令建模
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329722
A. Aydiner, Yunhui Chu, O. Mikulchenko, Jin Yan, R. Friar, Ellen Yan Fu
{"title":"Modeling of DDR5 signaling from jitter sequences to accurate bit error rate (BER)","authors":"A. Aydiner, Yunhui Chu, O. Mikulchenko, Jin Yan, R. Friar, Ellen Yan Fu","doi":"10.1109/EPEPS.2017.8329722","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329722","url":null,"abstract":"Intel's signal integrity (SI) analysis for memory in the server segment has neither considered correlated jitter nor handled jitter amplification over channel when performing fast analytical signaling analyses. This inaccuracy is no longer feasible with the intended data rates of DDR5. Here, we propose a DDR5 flow that starts from jitter sequences or histograms and ends with signaling analysis via FastBER that can comprehend jitter amplification over I/O channels regardless of whether Tx jitter is correlated or uncorrelated. The paper contributes results of large scale testing of FastBER signaling in such a scenario and also offers solutions to practical issues like jitter extrapolation and time-margin skew due to setup and hold asymmetry.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122846847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Verilog-A compatible recurrent neural network model for transient circuit simulation 一个兼容的递归神经网络模型，用于瞬态电路仿真
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329743
Zaichen Chen, M. Raginsky, E. Rosenbaum
{"title":"Verilog-A compatible recurrent neural network model for transient circuit simulation","authors":"Zaichen Chen, M. Raginsky, E. Rosenbaum","doi":"10.1109/EPEPS.2017.8329743","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329743","url":null,"abstract":"This paper presents a method for data-driven behavioral modeling of electronic circuits using recurrent neural networks (RNNs). The RNN structure is adapted based on known characteristics of the system being modeled. The discrete-time RNN is transformed to a continuous-time model and then implemented in Verilog-A for compatibility with general-purpose circuit simulators.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128621076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 23
Bivariate macromodeling with guaranteed uniform stability and passivity 保证均匀稳定性和无源性的二元宏观建模
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329710
S. Grivet-Talocia
{"title":"Bivariate macromodeling with guaranteed uniform stability and passivity","authors":"S. Grivet-Talocia","doi":"10.1109/EPEPS.2017.8329710","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329710","url":null,"abstract":"This paper extends the well-established macromodeling flows based on rational fitting and passivity enforcement to the bivariate case, where the model response depends on frequency and on some additional design parameter. We propose a black-box model identification algorithm that is able to guarantee uniform stability and passivity throughout the parameter range. The resulting models, which can be cast as parameterized SPICE subnetworks, may be used to construct parameterized component libraries for design optimization, what-if analyses and fast parametric sweeps in frequency or time domain.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126224758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Maximum power specification management feature in Intel Xeon CPUs 英特尔至强处理器的最大功率规格管理功能
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329719
N. Haider, Amanda Sewani
{"title":"Maximum power specification management feature in Intel Xeon CPUs","authors":"N. Haider, Amanda Sewani","doi":"10.1109/EPEPS.2017.8329719","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329719","url":null,"abstract":"The drivers for performance improvement across server processor generations such as higher core count, frequency and more parallel processing have a fundamental correlation with the maximum electrical power (PMax) specifications. This specification determines the size of the motherboard power supply, the rack power supply and ultimately the server farm power capacity. Consequently, mechanisms to reduce the impact of PMax on power delivery are extremely valuable. This paper describes a novel, scalable feature in the newest line of Intel Xeon Processors that curbs the rising PMax specifications without any loss in performance.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"48 47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115560466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation of the radiation mechanism for high-speed connectors 高速连接器辐射机理研究
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329711
Xu Wang, Y. S. Cao, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak
{"title":"Investigation of the radiation mechanism for high-speed connectors","authors":"Xu Wang, Y. S. Cao, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak","doi":"10.1109/EPEPS.2017.8329711","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329711","url":null,"abstract":"In this paper, the radiation mechanism of the high-speed connectors are investigated by the distributive power radiation formulation and characteristic modes theory. It is shown that hotpot can be identified by the distributive formulation method and the un-symmetry of geometry will cause unbalanced mode current.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"355 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115781339","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Causal version of conductor roughness models and its effect on characteristics of transmission lines 导体粗糙度模型的因果版本及其对传输线特性的影响
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329720
V. Dmitriev-Zdorov, L. Simonovich
{"title":"Causal version of conductor roughness models and its effect on characteristics of transmission lines","authors":"V. Dmitriev-Zdorov, L. Simonovich","doi":"10.1109/EPEPS.2017.8329720","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329720","url":null,"abstract":"We propose a causal form of the Cannonball-Huray metal roughness frequency-dependent complex correction factor. Compared to widely-used non-causal form, this model considerably increases inductive component of internal metal impedance. Transmission lines simulated with improved roughness model demonstrate larger phase and propagation delay, and higher characteristic impedance.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114448379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
SAS 4.0 (22.5Gbps) challenges for server platforms SAS 4.0 (22.5Gbps)对服务器平台的挑战
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI: 10.1109/EPEPS.2017.8329765
Vijender Kumar, G. Anand, Sanjay Kumar, Mallikarjun Vasa, D. Wallace, B. Mutnury
{"title":"SAS 4.0 (22.5Gbps) challenges for server platforms","authors":"Vijender Kumar, G. Anand, Sanjay Kumar, Mallikarjun Vasa, D. Wallace, B. Mutnury","doi":"10.1109/EPEPS.2017.8329765","DOIUrl":"https://doi.org/10.1109/EPEPS.2017.8329765","url":null,"abstract":"Today's varied server applications necessitate a variety of storage requirements. The advent of SAS 4.0 technology represents an evolutionary advancement in storage IO to meet the growing demands of today's storage environments. With unprecedented performance levels and improved signaling and management for supporting larger disk attach, SAS 4.0 offers users a much more scalable and flexible direct attach storage (DAS) interface. This paper highlights the signal integrity challenges faced when designing SAS 4.0 links at 22.5Gbps. Cable skew, connectors, material loss and via stubs affect the channel to a great extent. Signal integrity analysis is performed at SAS 4.0 speed to quantify the impact of above listed parasitic effects.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"216 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123391167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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