EMI radiation physics using generalized characteristic mode (GCM) analysis with loss for practical structures

Y. S. Cao, Xu Wang, Yansheng Wang, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak
{"title":"EMI radiation physics using generalized characteristic mode (GCM) analysis with loss for practical structures","authors":"Y. S. Cao, Xu Wang, Yansheng Wang, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak","doi":"10.1109/EPEPS.2017.8329764","DOIUrl":null,"url":null,"abstract":"Characteristic mode analysis has been proposed for lossless case for decades. However, for real electromagnetic interference (EMI) structures, such as printed circuit board (PCB) midplane connector and heat sink, lossy material (such as copper) and terminations (resistive loads) are unavoidable which tradidiotnal CM method cannot handle. In this paper, a generalized CM analysis for lossy material and/or with resistive loads is developed for practical structures. With the proposed method, by applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified. This method facilitates the CM method in real applications.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

Abstract

Characteristic mode analysis has been proposed for lossless case for decades. However, for real electromagnetic interference (EMI) structures, such as printed circuit board (PCB) midplane connector and heat sink, lossy material (such as copper) and terminations (resistive loads) are unavoidable which tradidiotnal CM method cannot handle. In this paper, a generalized CM analysis for lossy material and/or with resistive loads is developed for practical structures. With the proposed method, by applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified. This method facilitates the CM method in real applications.
电磁干扰辐射物理的广义特征模式(GCM)分析与实际结构的损失
无损情况下的特征模态分析已经提出了几十年。然而,对于实际的电磁干扰(EMI)结构,如印刷电路板(PCB)背板连接器和散热器,损耗材料(如铜)和终端(电阻负载)是不可避免的,这是传统的CM方法无法处理的。本文针对实际结构,提出了一种适用于有耗材料和/或具有电阻性载荷的广义模态分析方法。该方法采用基于积分方程(IE)的方法和特征模态(CM)分析,将电流分为辐射电流和非辐射电流。利用辐射电流可以量化结构各部分的辐射功率。因此,可以识别辐射热点。该方法便于CM方法的实际应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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