Signal integrity analysis of high-speed board-to-board floating connectors for automotive systems

Abstract

In this paper, we propose two designs of floating board-to-board connector for high speed data transmission. This paper analyzes the signal integrity of the proposed designs using a full wave three-dimensional electromagnetic simulator. We analyze Time Domain Reflectometry impedance and differential insertion loss of the connectors up to 25 GHz. The proposed designs have uniform pin shapes, thereby showing less impedance mismatch and less signal loss. Among the proposed designs, the design with shorter stubs shows less signal loss due to impedance mismatch and the lower the anti-resonance frequency. Therefore, even though the connector becomes mechanically stable as the stubs become longer, for high-speed data transmission, the stub length has to be reduced to the extent, which the mechanical stability is guaranteed.