Jian Liu, Kaiyu Mao, Xiande Cao, Yingxin Sun, Anyu Kuo
{"title":"带有互连器件和电路元件的系统的现场电路提取","authors":"Jian Liu, Kaiyu Mao, Xiande Cao, Yingxin Sun, Anyu Kuo","doi":"10.1109/EPEPS.2017.8329713","DOIUrl":null,"url":null,"abstract":"A field-circuit coextraction method is proposed for the 3D full-wave model extraction of systems with interconnects and surface mounting circuit components. Local metal patches are added to each circuit component based on the pins and circuit profile. The voltage and the current continuity between fields and circuits are enforced through internal ports defined on the artificial reference patches.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Field-circuit coextraction of systems with interconnects and circuit components\",\"authors\":\"Jian Liu, Kaiyu Mao, Xiande Cao, Yingxin Sun, Anyu Kuo\",\"doi\":\"10.1109/EPEPS.2017.8329713\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A field-circuit coextraction method is proposed for the 3D full-wave model extraction of systems with interconnects and surface mounting circuit components. Local metal patches are added to each circuit component based on the pins and circuit profile. The voltage and the current continuity between fields and circuits are enforced through internal ports defined on the artificial reference patches.\",\"PeriodicalId\":397179,\"journal\":{\"name\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"84 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2017.8329713\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329713","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Field-circuit coextraction of systems with interconnects and circuit components
A field-circuit coextraction method is proposed for the 3D full-wave model extraction of systems with interconnects and surface mounting circuit components. Local metal patches are added to each circuit component based on the pins and circuit profile. The voltage and the current continuity between fields and circuits are enforced through internal ports defined on the artificial reference patches.