2017 18th International Conference on Electronic Packaging Technology (ICEPT)最新文献_第3页

Chip-scale scalar atomic magnetometer operating in geomagnetic environment 在地磁环境下工作的芯片级标量原子磁强计

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046551

Pang Zhihua, Shang Jintang, Lu Lin, J. Yu

引用次数: 1

Advanced interconnect and antenna-in-package design for millimeter-wave 5G communications 用于毫米波5G通信的先进互连和封装天线设计

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046398

B. Wu

引用次数: 2

Solidification microstructure of tin-based solder in the rapid cooling condition 快速冷却条件下锡基焊料的凝固组织

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046604

Anna Zhang, Zheng Zhou, Liping Mo, Fengshun Wu, Hui Liu

引用次数: 0

Quantitative polynomial free energy based phase field model for void motion and evolution in Sn under thermal gradient 热梯度下锡中空穴运动与演化的定量多项式自由能相场模型

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046720

Anil Kunwar, M. Tonks, Shengyan Shang, Xueguan Song, Yunpeng Wang, Haitao Ma

引用次数: 1

Electromigration simulation of flip chip CSP LED 倒装CSP LED的电迁移模拟

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046641

Rui Ma, F. Qin, Jiajie Fan, Xuejun Fan, C. Qian

引用次数: 4

Reliability analysis of smartwatch 智能手表可靠性分析

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046614

Yuk Ngang Zita Yip, Ze‐Lin Zhu, Y. Chan

{"title":"Reliability analysis of smartwatch","authors":"Yuk Ngang Zita Yip, Ze‐Lin Zhu, Y. Chan","doi":"10.1109/ICEPT.2017.8046614","DOIUrl":"https://doi.org/10.1109/ICEPT.2017.8046614","url":null,"abstract":"The reliability of electronics products has become a serious problem due to the increasingly harsh environmental conditions when the products are in use. Due to demand on greater performance and higher integration in microelectronic devices, the electronics industry has been seeking suitable components, packaging and cooling techniques to achieve low-cost and high-reliability. This paper presents the experimental verifications to analyze the effect of temperature and humidity on the electronic circuit as well as evaluating the device reliability, using Xiaomi Band 2 as a real case. It is found that 125°C has been a critical temperature for the smart watch, above which the sealed plastic case ruptured easily. However, 150°C has been found to be the temperature to burst the battery. Cold storage test with a temperature of − 70°C shows that low-temperature will only cause the smartwatch to hibernate, even for up to 400 hours, after which the device will be restored to work under a room temperature. Humidity has been found to be a crucial factor in damaging the device, which changes the rubber ring and plastic case into brittle and corrodes the interconnects on printed circuit board. Further investigation into the microstructure evolution of interconnects has found that the highly accelerated stress test has caused serious cracks in solder joints and electronic components, such as, resistors and capacitors. In short, the smartwatch can work under harsher environment than the designated environmental conditions in the product manual.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128741847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A novel copper-coated ceramic substrate prepared by nano thermocompression bonding 纳米热压键合制备新型铜涂层陶瓷衬底

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046507

Yun Mou, Yang Peng, Hao-Chun Cheng, Ziliang Hao, Mingxiang Chen

引用次数: 1

Design of a hydro-dynamically levitated centrifugal micro-pump for the active liquid cooling system 主动液冷系统中流体动力悬浮离心微泵的设计

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046481

Ruikang Wu, B. Duan, Falong Liu, Han Wu, Yanhua Cheng, Xiaobing Luo

引用次数: 3

Numerical simulation of the wire bonding reliability of IGBT module under power cycling 功率循环下IGBT模块焊线可靠性的数值模拟

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046696

Xiaorui Bie, F. Qin, Tong An, Jingyi Zhao, Chao Fang

引用次数: 16

Quasi in situ study about growth kinetics of Ag3Sn at the interface of eutectic SnPb/electroplated Ag soder joint in the long-term satellite 长期卫星观测中共晶SnPb/电镀Ag焊点界面Ag3Sn生长动力学的准原位研究

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046442

Xiaoliang Ji, R. An, Chunqing Wang

{"title":"Quasi in situ study about growth kinetics of Ag3Sn at the interface of eutectic SnPb/electroplated Ag soder joint in the long-term satellite","authors":"Xiaoliang Ji, R. An, Chunqing Wang","doi":"10.1109/ICEPT.2017.8046442","DOIUrl":"https://doi.org/10.1109/ICEPT.2017.8046442","url":null,"abstract":"The interfacial reaction and the growth kinetics of intermetallic compounds between 63Sn37Pb (wt.%) solder and the electroplated silver layer during the solid-state aging were studied in this paper. To measure the growth kinetics of Ag3Sn, the product of the interfacial reaction, more accurately, we used the quasi in situ method. And three same joints between solar cells and solder were annealed at 100°C, 120°C and 150°C for various aging durations. The results showed that the electroplated Ag layer gradually transformed into scalloped Ag3Sn, and the growth kinetics of Ag3Sn was a diffusion-controlled process during isothermal aging. Through measuring the thickness of Ag3Sn during the isothermal storage, the activation energy for IMC at eutectic SnPb solder/electroplated Ag layer interface was calculated and the result was 106 kJ/mole. On the basis of the growth kinetics, a correspondence between long-term thermal recycle and isothermal aging was presented. And the relation could be used to replace the long-term thermal recycle with accelerated annealing experiment, which would have a significant meaning for testing the reliability of low earth orbit satellites' solar cells.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124612300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0