2017 18th International Conference on Electronic Packaging Technology (ICEPT)最新文献_第4页

Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering 瞬态液相焊接形成的Cu-Sn-Ni金属间化合物全金属间微接头的力学性能

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046622

Liping Mo, Zheng Zhou, Fengshun Wu, Shiyuan Liu, Hui Liu, Changqing Liu

{"title":"Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering","authors":"Liping Mo, Zheng Zhou, Fengshun Wu, Shiyuan Liu, Hui Liu, Changqing Liu","doi":"10.1109/ICEPT.2017.8046622","DOIUrl":"https://doi.org/10.1109/ICEPT.2017.8046622","url":null,"abstract":"A structure of Cu/IMCs/Ni micro-joint has been prepared from Cu/Sn (1.5µm)/Ni sandwich layers through the transient liquid phase soldering at 240 °C and 290 °C. On the result of microstructural observation, two layers can be distinguished as the thick (Cu, Ni)<inf>6</inf>Sn<inf>5</inf> layer beneath the upper layer of thin (Cu, Ni)<inf>3</inf>Sn layer, to constitute the IMCs interlayer in micro-joint formed at 240 °C with dwell time of 15 min. Whereas, the IMCs interlayer in micro-joints after 5∼25 min dwelling at 290 °C is much more uniform and homogenous. The creep properties of IMCs have been evaluated at room temperature with the condition of 2000 µN loading for 30 s. Also, the reduced Young's modulus and hardness of (Cu, Ni)<inf>6</inf>Sn<inf>5</inf> and (Cu, Ni)<inf>3</inf>Sn have been measured by nanoindentation with the application of displacement-controlled multiple loading method, which are respectively higher than the common value of Cu<inf>6</inf>Sn<inf>5</inf> and Cu<inf>3</inf>Sn. With the focus ion beam micro-milling, Cu-Sn-Ni IMCs micro-cantilevers have been fabricated with the size about 1 µm×1 µm×3 µm in the sample formed at 290 °C. Afterwards, an in-situ micro-compression test has been conducted, the fracture strength was calculated to be 2.46 GPa.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123311005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Design of a Ku band 7-bit PIN diode phase shifter Ku波段7位PIN二极管移相器的设计

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046564

Wanfei Lan, Dan Zhong, D. Jin, Dan Yang, Zhao-Jun Zhu, B. Jia

引用次数: 2

Silicon@conductive porous copper layer anode for rechargeable lithium-ion batteries Silicon@conductive多孔铜层阳极用于可充电锂离子电池

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046563

Hanzhi Ju, T. Hang, Ming Li

引用次数: 0

Preparation of core-shell structured SiO2@Ag spheres and their role in improving micro-sized Ag flake filled electrically conductive adhesive for LED packaging 核壳结构SiO2@Ag微球的制备及其对微细银片填充LED封装导电胶的改善作用

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046744

Han Jiang, Min-bo Zhou, Jie-Fei Zhu, Xin-Ping Zhang

引用次数: 1

Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint 铜芯SAC305焊点的抗拉强度及界面反应

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046506

D. Li, L. Yin, Z. Yao, G. Wang, L.P. Zhang, C.X. Wang

{"title":"Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint","authors":"D. Li, L. Yin, Z. Yao, G. Wang, L.P. Zhang, C.X. Wang","doi":"10.1109/ICEPT.2017.8046506","DOIUrl":"https://doi.org/10.1109/ICEPT.2017.8046506","url":null,"abstract":"In this study, Cu-cored ball with the diameter of 350µm and 550µm were applied to connect the Cu wire with the diameter of 400µm and 600µm, and the gap was then filled with the SAC305 solder. As a comparison, the SAC305 solder joints were also prepared. In addition, a thermal aging experiment at 150°C was carried out, and then the tensile strength and solder/Cu interfaces before and after the experiment were studied. The result shows that the tensile strength of 400µm diameter joints soldered by Cu-cored and SAC305 solder is higher than that of the 600µm diameter joints, which are, in order, 66.16MPa, 62.12MPa, 59.47MPa, 52.90.16MPa. For the joints with the same geometry scaling factor d/t (d is the diameter of the joint and t is the thickness of the joint), the small-sized ones can provide a better strength. After a 24h thermal aging treatment, the strength of all the joints declined sharply, as the ageing time prolong to 48h or more, descending of tensile strength developed slowly. The interfacial IMC thickens markedly after high-temperature ageing and in turn makes a negative impact on the strength.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124138174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Influence of packaging effects on the mobile noise of planar SQUID gradiometer for airborne magnetic measurements 封装效应对机载磁测平面SQUID梯度仪移动噪声的影响

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046726

Gaowei Xu, W. Gai, L. Luo, Shulin Zhang, Xiaoming Xie

引用次数: 0

Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method 基于蒙特卡罗和有限元相结合的充铜硅孔(tsv)微观结构模拟及热力学行为分析

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046746

S. Liang, C. Wei, C. Ke, Min-bo Zhou, Xin-Ping Zhang

{"title":"Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method","authors":"S. Liang, C. Wei, C. Ke, Min-bo Zhou, Xin-Ping Zhang","doi":"10.1109/ICEPT.2017.8046746","DOIUrl":"https://doi.org/10.1109/ICEPT.2017.8046746","url":null,"abstract":"Grain characteristics of copper filler have an important influence on physical properties of through silicon vias (TSVs) in three-dimensional (3D) packaging. Due to the mismatch of coefficients of thermal expansion (CTE) between the copper and silicon, there exist obvious thermal stresses when the TSV structure is bearing thermal load. However, the elastic response characteristics of copper can be affected distinctly by the size, shape and orientation of copper grains in TSVs. These effects can not be ignored, especially for 3D ICs undergoing continuous miniaturization and increasing integration. In this study, the grain growth and evolution of a typical copper filler in the TSV structure is dynamically simulated and investigated by using Monte Carlo method (MCM), then the thermo-mechanical behavior of TSVs with considering the grain characteristics of copper filler is studied with combined MCM and finite element method (FEM), i.e., MC-FE method. Besides, the effects of grain evolution on the protrusion of copper filler in the TSV is also investigated. Simulation results are presented for providing more quantitative description and comprehensive understanding of the influences of microstructure evolution of copper filler on the thermo-mechanical behavior of Cu-filled TSVs.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126438092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Creep fracture analysis and control measures of aerospace electronic products 航空航天电子产品蠕变断裂分析及控制措施

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046651

Bin-bin Zhang, Z. He, Zhenming Zhang, Jun Zhang, Ningning Wang, Jing-ming Fei

引用次数: 0

Multi points temperature measurement of infrared scanning method on surface mount technology 多点温度测量的红外扫描法表面贴装技术

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046434

Xiangxi Zhao, Wei Zhang, Lingchao Kong

引用次数: 0

Study on the influence of LED PN junction area on modulation bandwidth in visible light communication 可见光通信中LED PN结面积对调制带宽影响的研究

2017 18th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2017-08-01 DOI: 10.1109/ICEPT.2017.8046542

Zheng Zhou, Liu Li-lin, Gang Wang

引用次数: 1