A novel copper-coated ceramic substrate prepared by nano thermocompression bonding

Abstract

In this paper, we propose a feasible and prospective method to prepare copper-coated ceramic substrate by using nano thermo-compression bonding technology. Nanoporous copper (NPC) can be prepared by dealloying of Cu-Zn alloy system in L-tartaric acid solution. By controlling the concentration of L-tartaric acid solution and dealloying temperature, NPC presents good homogeneity and open bi-continuous interpenetrating ligament-channel microstructures with the average ligament size of 20 nm. In addition, copper-coated ceramic substrates using NPC are successfully prepared under the bonding pressure of 20MPa for 50min at 350°C in the N2 atmosphere resulted in excellent bonding qualities without voids in the bonding layer, the tensile strength reaches 9.2MPa. These testing results confirms that the copper-coated ceramic substrate prepared by nano thermocompression bonding is a feasible and promising technology.