Electromigration simulation of flip chip CSP LED

Abstract

Chip scale package (CSP) as an advanced technology has been applied to LED lighting devices, besides electromigration (EM) in CSP under high current density has become a critical reliability issue for the future high density microelectronic packaging. In this paper, the thermal-electric-mechanical coupled analysis is performed by the flip-chip CSP LED multi-physical finite element model. Based on the atomic flux divergences (AFD) method, the position of void formation in the solder joints is predicted subsequently. Influences of the ambient temperature and applied current on the EM failure life of LEDs are investigated finally.