Advanced interconnect and antenna-in-package design for millimeter-wave 5G communications

Abstract

This paper presents a high-gain millimeter-wave array antenna highly integrated on a single organic chip package. The multi-phased beam steering capability is enabled to reduce multipath fading and over-the-air applications around 30GHz. To improve antenna bandwidth, gain and radiation efficiency, a dual-patch antenna is built on a superstrate structure. A number of design attributes, such as patch, dipole, and slot sizes have been studied. Advanced interconnect between die and antennas in multi-layered dielectric is optimized for transceiver integration and packaging with minimal insertion loss and coupling between the antenna feed-lines. Good correlation is reached among measurement and full-wave electromagnetic simulations. System-level characterization of a mechanically assembled transceiver module is presented with antenna radiation patterns.