2016 International Conference on Electronics Packaging (ICEP)最新文献_第3页

Fabrication of biomimetic superhydrophobic surfaces through a one step solution-immersion process on galvanized iron substrates 用一步溶液浸没法在镀锌铁基板上制备仿生超疏水表面

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486917

Chih-Feng Wang, Li-Zhen Huang, Liang-Ting Chen, Sheng-Yi Yang, C. Shih

引用次数: 0

Fine pitch micro-bump forming by printing 细间距微凸块印刷成型

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486824

Hiroaki Ikeda, S. Sekine, Ryuji Kimura, Koichi Shimokawa, K. Okada, H. Shindo, T. Ooi, Rei Tamaki, Makoto Nagata

引用次数: 0

High performance insulating adhesive film for high-frequency applications 高性能绝缘胶膜，适用于高频应用

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486777

H. Kondo, Masaki Yoshida, Munetoshi Kusama, S. Teraki

引用次数: 4

Novel PC miniature board 新型PC微型板

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486900

Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See

引用次数: 0

Thermal Analysis of a battery in an electronic device for an outdoor application 户外用电子设备电池的热分析

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486808

Nitesh Kumar Sardana, Ritwik Alok Pattnayak, S. Busam, C. Ghosh, L. Biswal

{"title":"Thermal Analysis of a battery in an electronic device for an outdoor application","authors":"Nitesh Kumar Sardana, Ritwik Alok Pattnayak, S. Busam, C. Ghosh, L. Biswal","doi":"10.1109/ICEP.2016.7486808","DOIUrl":"https://doi.org/10.1109/ICEP.2016.7486808","url":null,"abstract":"For the effective working of an electronic product, operating temperature of the components on PCB should be below the safe limits. Along with the components, other aspects like the housing material, battery, mountings, connectors etc. should also be analyzed critically from thermal point of view. For safe operation and to avoid any explosion of the battery, temperature in and around battery should be below the limiting temperature. The equipment in consideration is made up of polyester plastic and mounted in an open field, exposed to solar radiations and ambient air. Housing consists of a PCB along with heat dissipating components over it. Components are modelled as lumped models with accurate size, as mentioned in the datasheet. Heat is transferred from the components to the board through conduction. This heat is spread from the board to internal air through convection and radiation. Solar flux transfers the heat to the housing through radiations, which in turn transfers heat to internal air through convection and radiation. At thermal steady state, in-flow and out-flow of heat between internal air and ambient air is balanced. In this paper, surface temperature and ambient temperature around the battery is analyzed at different air flows and different orientations to comment on the appropriate position for placing the product. This will also help in evaluating pertinent time for replacement of battery and the maintenance cost of the product. Steady state thermal simulation is carried out in FloTHERM™. The situation duplicated is maximum temperature in the geographical region with maximum solar flux and various air flows that the product may experience in its life time. The simulation model consists of the entire product and air domain. All three modes of heat transfer (i.e. conduction, convection and radiation) are considered.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123005092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Study on electrical characteristics of micron-order wiring with nano-scale conductive metal particle 纳米级导电金属微粒微米级导线的电学特性研究

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486868

Masaya Tanaka, Tsuyoshi Tsunoda, S. Sagara

引用次数: 0

ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device 采用SiO2非晶层与VUV/O3预处理的st -石英/LiTaO3直接键合制备新型5G表面声波器件

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486865

Haruka Suzaki, H. Kuwae, A. Okada, Bo Ma, S. Shoji, J. Mizuno

{"title":"ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device","authors":"Haruka Suzaki, H. Kuwae, A. Okada, Bo Ma, S. Shoji, J. Mizuno","doi":"10.1109/ICEP.2016.7486865","DOIUrl":"https://doi.org/10.1109/ICEP.2016.7486865","url":null,"abstract":"This paper describes a novel ST-cut quartz (ST-quartz)/LiTaO3 (LT) direct bonding for surface acoustic wave (SAW) devices of next 5G mobile communication. The ST-quartz and LT were bonded to fabricate temperature compensated piezoelectric substrates using amorphous SiO2 (α-SiO2) intermediate layers. The α-SiO2 thin layer was prepared on each substrate by ion beam sputtering (IBS) to realize highly active bonding interfaces and treated by vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). Then they were bonded under pressure of 5 MPa at 200 °C for 15 min in 100 kPa vacuum atmosphere. The tensile strength of 2.9 MPa was achieved in α-SiO2 substrate which is six times stronger than other samples; without intermediate layers or VUV/O3 pre-treatment. In addition, VUV/O3 bonding was compared with Mega-sonic bonding. VUV/O3 treated sample with AIB method slightly increase the bonding strength and achieved the same level of Mega-sonic bonding sample with AIB. Hence, it is indicated that AIB method could prepare the considerably activated surface even using low vacuum condition and affect effectively to hetero-monocrystalline bonding. This result suggested the proposed ST-quartz/LT direct bonding is a promising technique for future 5G SAW devices.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"100 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132132316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Direct bonding and debonding of glass wafers for handling of ultra-thin glass sheets 用于处理超薄玻璃片的玻璃晶圆直接粘接和去粘接

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486833

K. Takeuchi, M. Fujino, T. Suga

引用次数: 2

Effects of additive formula and plating current density on the interfacial reactions between Sn and Cu electroplated layer 添加剂配方和电镀电流密度对锡铜镀层界面反应的影响

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486905

Hsuan Lee, W. Dow, Chih-Ming Chen

{"title":"Effects of additive formula and plating current density on the interfacial reactions between Sn and Cu electroplated layer","authors":"Hsuan Lee, W. Dow, Chih-Ming Chen","doi":"10.1109/ICEP.2016.7486905","DOIUrl":"https://doi.org/10.1109/ICEP.2016.7486905","url":null,"abstract":"Electroplating Cu technique becomes more and more important in advanced three-dimensional integrated circuit (3D-IC) packaging because of its advantages in the electrical/thermal conductivity, low cost, and hole-filling performance. Formula of the Cu electroplating solution, especially the additive like suppressor, accelerator, and leveler, plays a crucial role in the electroplating process. Previous studies have indicated that some organic impurities originated from the additives were incorporated in the Cu plated layer during the electroplating process. Moreover, the incorporated organic impurities segregated to the interface between the Cu plated layer and solder in a solder joint and led to formation of voids at the Cu/solder interface. In this study, effects of additive formula and plating current density on the Cu/solder interfacial reactions thermally aged at 150 and 200 °C were further investigated. If the additive formula contained only suppressor, the grain size in the Cu electroplated layer became bigger and the void quantity reduced as the current density reduced. However, when accelerator was added in the plating solution, an opposite trend was observed. The grain became smaller and a larger number of voids formed at the Cu/solder interface as the current density reduced.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117304852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Novel wiring structure for 3D-conformable devices 用于3d兼容设备的新型布线结构

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.5104/JIEPENG.10.E16-017-1

Susumu Sawada, Y. Tomita, K. Hirano, Hiromi Morita, Takashi Ichiryu, Masanori Nomura, Koji Kawakita

引用次数: 2